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产品型号XC6136的Datasheet PDF文件预览

XC6136 Series  
Ultra-Low Power (88nA) Voltage Detector  
ETR02042-001a  
GENERAL DESCRIPTION  
The XC6136 series is ultra-low power voltage detector with high accuracy detection, manufactured using CMOS process  
and laser trimming technologies.  
The device is available in both CMOS and N-channel open drain output configurations. Also detect logic is available in  
both RESETB (Active Low) and RESET (Active High).  
Ultra-small low height package USPQ-4B05 and standard packages SSOT-24 and SOT-25 which are ideally suited for  
small design of portable devices and high densely mounting applications.  
UVLO circuit is implemented in order to suppress the floating of RESETB pin (undefined operation) when VIN voltage is  
lower than the minimum operating voltage.  
FEATURES  
APPLICATIONS  
91nA TYP.(detect, VDF=1.2V, VIN=1.1V)  
88nA TYP.(release, VDF=1.2V, VIN=1.32V)  
±0.8% (VDF3.0V, Ta=25)  
±1.0% (3.1VVDF, Ta=25)  
±2.5% (VDF3.0V, Ta=-40℃~105)  
±2.7% (3.1VVDF, Ta=-40℃~105)  
±50ppm/(TYP.)  
Ultra-Low Power  
Energy Harvesting  
Wearable devices  
High Accuracy  
Smart meter  
Microprocessor logic reset circuitry  
System battery life and charge voltage monitors  
Power-on reset circuits  
Temperature Characteristics  
Hysteresis width  
TYPE:A/C VDF×5.0% (TYP.)  
TYPE:B/D 2mV28mV (TYP.)  
1.2V5.0V (0.1Vstep)  
Power failure Detection  
Detect voltage range  
Operating voltage range  
Output type  
1.1V6.0V  
CMOS  
Nch open drain  
RESETB(Active Low)  
Output logic  
RESET(Active High)  
Output pin Voltage 0.38V(MAXTa=-40℃~+105)  
Power supply Input pin Voltage<  
operating voltage(MIN.)  
Undefined operation  
Protection  
(CMOS Output only)  
Packages  
USPQ-4B05,SSOT-24,SOT-25  
EU RoHS Compliant, Pb Free  
Environment friendly  
TYPICAL APPLICATION CIRCUIT  
TYPICAL PERFORMANCE  
CHARACTERISTICS  
XC6136 Series  
(*1)  
VIN  
RPull  
RESETB  
/RESET  
INPUT  
VIN2  
RESETB  
/RESET  
VIN  
VIN1  
μprocessor  
VSS  
VSS  
(*1)  
Unused for the CMOS output products  
1/23  
XC6136 Series  
BLOCK DIAGRAMS  
(1) XC6136C Series A/B type(RESETB OUTPUT:CMOS output/Active Low)  
VIN  
RSEN=RA+RB+RC  
+
M2  
M1  
RA  
UVLO  
RESETB  
-
RB  
VREF  
RC  
VSS  
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.  
(2) XC6136C Series C/D type (RESET OUTPUT:CMOS output /Active High)  
VIN  
RSEN=RA+RB+RC  
M2  
M1  
+
-
RA  
RB  
UVLO  
RESET  
VREF  
RC  
VSS  
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.  
2/23  
XC6136  
Series  
BLOCK DIAGRAMS  
(3) XC6136N Series A/B type (RESETB OUTPUT: Nch open drain output /Active Low)  
VIN  
RSEN=RA+RB+RC  
+
RA  
UVLO  
RESETB  
-
RB  
M1  
VREF  
RC  
VSS  
* Diodes inside the circuits are ESD protection diodes and parasitic diodes  
(4) XC6136N Series C/D type (RESET OUTPUT: Nch open drain output /Active High)  
VIN  
RSEN=RA+RB+RC  
+
RA  
UVLO  
RESET  
-
RB  
M1  
VREF  
RC  
VSS  
* Diodes inside the circuits are ESD protection diodes and parasitic diodes  
3/23  
XC6136 Series  
PRODUCT CLASSIFICATION  
Ordering Information  
(*1)  
XC6136①②③④⑤⑥-⑦  
DESIGNATOR  
ITEM  
SYMBOL  
DESCRIPTION  
CMOS output  
C
N
Output Configuration  
Detect Voltage  
Nch open drain output  
②③  
1250  
A
e.g. 1.2V =1, =2  
B
Type  
Refer to Selection Guide  
C
D
9R-G  
NR-G  
MR-G  
USPQ-4B05 (5,000pcs/Reel)  
SSOT-24 (3,000pcs/Reel)  
SOT-25 (3,000pcs/Reel) (*2)  
(*1)  
⑤⑥-⑦  
PKG  
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.  
(*2) SOT-25 uses Cu bonding wires.  
Selection Guide  
TYPE  
RESETB/RESET OUTPUT  
HYSTERESIS  
A
B
C
D
Active Low  
VDF×5.0%(TYP)  
2mV28mV(TYP) (*1)  
VDF×5.0%(TYP)  
Active High  
2mV28mV(TYP) (*1)  
(*1)  
Refer to SPEC TABLE.  
PIN CONFIGURATION  
NC  
5
NC  
4
Type : A/B  
VSS  
3
VIN  
4
VIN  
4
RESETB  
3
3
1
2
2
1
VIN  
VSS  
RESETB  
1
2
NC  
RESETB  
NC  
V
USPQ-4B05  
SS  
SOT-25  
(BOTTOM VIEW)  
(TOP VIEW)  
(TOP VIEW)  
Type : C/D  
NC  
NC  
4
VIN  
RESET  
VSS  
3
VIN  
4
5
4
3
3
1
2
2
1
1
2
VIN  
VSS  
RESET  
NC  
RESET  
NC  
VSS  
SSOT-24  
(TOP VIEW)  
USPQ-4B05  
SOT-25  
(TOP VIEW)  
(BOTTOM VIEW)  
*The dissipation pad for the USPQ-4B05 package should be solder-plated in reference mount pattern and metal masking so as to enhance  
mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to VSS (No. 3) pin.  
4/23  
XC6136  
Series  
PIN ASSIGNMENT  
PIN NUMBER  
PIN NAME  
FUNCTION  
USPQ-4B05  
1
SSOT-24  
3
SOT-25  
1
RESETB  
RESET  
NC  
Reset Output (Active Low) (*1)  
Reset Output (Active High) (*2)  
No Connection  
2
3
4
1
2
4
4 , 5  
3
VSS  
Ground  
2
VIN  
Power Input  
(*1) Type A,B (Refer to the in Ordering Information table.)  
(*2) Type C,D (Refer to the in Ordering Information table.)  
ABSOLUTE MAXIMUM RATINGS  
Ta=25℃  
PARAMETER  
Input Voltage  
SYMBOL  
VIN  
RATINGS  
UNITS  
-0.3+7.0  
VSS-0.3VIN+0.3 or +7.0 (*1)  
V
V
V
XC6136C(*2)  
Output Voltage  
Output Current  
VRESETB  
VRESET  
XC6136N(*3)  
XC6136C(*2)  
XC6136N(*3)  
VSS-0.3+7.0  
±50  
IRBOUT  
IROUT  
mA  
50  
100  
USPQ-4B05  
SSOT-24  
SOT-25  
550 (40mm x 40mm Standard board) (*4)  
150  
Power Dissipation  
Pd  
mW  
500 (40mm x 40mm Standard board) (*4)  
250  
600 (40mm x 40mm Standard board) (*4)  
Operating Ambient Temperature  
Topr  
Tstg  
-40+105  
-55+125  
Storage Temperature  
* All voltages are described based on the VSS  
.
(*1) The maximum value should be either VIN+0.3 or +7.0 in the lowest.  
(*2) CMOS output  
(*3) Nch open drain output  
(*4) The power dissipation figure shown is PCB mounted and is for reference only.  
Please see the power dissipation page for the mounting condition.  
5/23  
XC6136 Series  
ELECTRICAL CHARACTERISTICS  
Ta=25℃  
-40℃≦Ta105(*4)  
PARAMETER  
SYMBOL  
CONDITIONS  
UNITS CIRCUIT  
MIN.  
1.1  
TYP.  
MAX.  
MIN.  
TYP.  
MAX.  
6.0  
Operating Voltage  
VIN  
6.0  
1.1  
V
V
V
VDF(T)  
×0.992  
VDF(T)  
VDF(T)  
VDF(T)  
VDF(T)  
×1.025  
VDF(T)  
VDF(T)(*1)=1.2V3.0V  
VDF(T)(*1)=3.1V5.0V  
VDF(T)  
VDF(T)  
×1.008 ×0.975  
VDF(T) VDF(T)  
×1.010 ×0.973  
Detect Voltage  
VDF  
VDF(T)  
VDF(T)  
×0.990  
×1.027  
Temperature  
VDF/  
-40℃≦Topr105℃  
-
±50  
VDF  
-
-
±50  
VDF  
-
ppm/℃  
Characteristics  
(ToprVDF)  
Hysteresis Width  
(TYPE: A/C)  
VDF  
VDF  
VDF  
VDF  
V
V
×0.032 ×0.05 ×0.068 ×0.03 ×0.05 ×0.07  
VHYS  
Hysteresis Width  
(TYPE: B/D)  
-
E-1(*2)  
-
E-2(*2)  
E-4( *2)  
Supply Current1  
(TYPE:A/B)  
CMOS output  
Supply Current1  
(TYPE:C/D)  
Iss1  
VIN=VDF×0.9  
-
E-3( *2)  
-
E-5( *2)  
E-6( *2)  
E-8( *2)  
E-9( *2)  
E-10( *2)  
CMOS output  
Supply Current1  
(TYPE:A/B/C/D)  
Nch open drain output  
Supply Current2  
(TYPE:A/B)  
nA  
CMOS output  
Supply Current2  
(TYPE:C/D)  
Iss2  
VIN=VDF×1.1  
-
-
E-7( *2)  
-
-
CMOS output  
Supply Current2  
(TYPE:A/B/C/D)  
Nch open drain output  
Undefined Operation(*3)  
(TYPE:A/B)  
VUNO  
VIN<1.1V  
VIN<1.1V  
0.1  
0.38  
0.1  
0.38  
Undefined Operation(*3)  
(TYPE:C/D)  
VIN  
VIN  
VUNO  
VIN  
-
-
-
-
VIN  
-
-
-
-
×0.7  
×0.7  
V
UVLO Release Voltage  
UVLO Detect Voltage  
VUVLOR  
VUVLOD  
tUVLOR  
VIN=0V1.1V  
VIN=1.1V0V  
VIN= 0V1.1V  
-
-
-
0.82  
0.79  
157  
-
-
-
0.82  
0.79  
157  
-
-
UVLO  
µs  
Release Delay Time  
(*1)  
V
: Nominal detect voltage  
DF(T)  
(*2) Refer to SPEC TABLE(P.8,9).  
(*3) XC6136C(CMOS output)only.  
(*4) The ambient temperature range (-40℃≦Ta105) is a design value.  
6/23  
XC6136  
Series  
ELECTRICAL CHARACTERISTICS  
Ta=25℃  
-40℃≦Ta105(*16)  
PARAMETER  
SYMBOL  
CONDITIONS  
UNITS  
µs  
CIRCUIT  
MIN. TYP.  
MAX.  
200  
MIN.  
TYP.  
44  
MAX.  
224  
Release Delay Time(*5)  
Detect Delay Time(*6)  
tDR0  
tDF0  
VIN =VDF×0.9VDF×1.1  
VIN =VDF×1.1VDF×0.9  
Nch. VRESETB=0.3V  
VIN=1.1V  
-
-
44  
40  
-
-
170  
40  
184  
0.3  
4.1  
1.4  
6.2  
-
-
-
-
0.2  
3.1  
4.3  
6.2  
1.4  
6.2  
-
-
-
-
IRBOUTN  
VIN=2.0V(*7)  
VIN=3.0V(*8)  
8.1  
10.8  
14.3  
10.8  
14.3  
RESETB  
mA  
VIN=4.0V(*9)  
11.2  
Output Current  
Pch. VRESETB=VIN-0.3V  
VIN=3.0V(*11)  
(*10)  
IRBOUTP  
-
-
-3.2  
-5.1  
-1.4  
-2.9  
-
-
-3.2  
-5.1  
-1.3  
-2.6  
VIN=6.0V  
Nch. VRESET=0.3V  
VIN=2.0V(*12)  
4.1  
8.1  
6.2  
-
-
-
-
-
3.1  
4.3  
6.2  
7.3  
8.1  
6.2  
-
-
-
-
-
VIN=3.0V(*11)  
10.8  
14.3  
17.1  
19.3  
10.8  
14.3  
17.1  
19.3  
IROUTN  
VIN=4.0V(*13)  
11.2  
13.7  
15.7  
RESET  
VIN=5.0V(*14)  
mA  
Output Current  
VIN=6.0V  
Pch. VRESET=VIN-0.3V  
VIN=1.1V  
(*10)  
IROUTP  
-
-
-0.7  
-3.2  
-0.2  
-1.4  
-
-
-0.7  
-3.2  
-0.15  
-1.3  
VIN=3.0V(*8)  
VIN=6.0V,  
(*15)  
ILEAKN  
-
-
-
-
0.01  
-0.01  
0.01  
0.1  
-
-
-
-
-
0.01  
-0.01  
0.01  
0.3  
-
Nch. VRESETB=6.0V  
VIN=1.1V,  
RESETB Output  
Leakage Current  
ILEAKP  
Pch. VRESETB=0V  
VIN=1.1V,  
µA  
(*15)  
ILEAKN  
0.1  
-
0.3  
-
Nch. VRESET=6.0V  
VIN=6.0V,  
RESET Output  
Leakage Current  
ILEAKP  
-0.01  
-0.01  
Pch. VRESET=0V  
(*5) RESETB product: Time from when the VIN pin voltage reaches the release voltage until the reset output pin reaches VIN×90%.  
RESET product: Time from when the VIN pin voltage reaches the release voltage until the reset output pin reaches VIN×10%  
Release voltage (VDR) =Detect voltage (VDF) + Hysteresis width (VHYS).  
(*6) RESETB product: Time from when the VIN pin voltage reaches the detect voltage until the reset output pin reaches VIN×10%.  
RESET product: Time from when the VIN pin voltage reaches the detect voltage until the reset output pin reaches VIN×90%.  
(*7) For VDF(T)2.1V only  
(*8) For VDF(T)3.1V only.  
(*9) For VDF(T)4.1V only.  
(*10) For XC6136C (CMOS output) only.  
(*11) For VDF(T)2.9V only.  
(*12) For VDF(T)1.9V only.  
(*13) For VDF(T)3.8V only.  
(*14) For VDF(T)4.8V only.  
(*15) Max. value is for XC6136N (Nch open drain).  
(*16) The ambient temperature range (-40℃≦Ta105) is a design Value.  
7/23  
XC6136 Series  
ELECTRICAL CHARACTERISTICS (SPEC TABLE)  
Table of Characteristics by Voltage Setting  
NOMINAL  
DETECT  
VOLTAGE(V)  
VDF(T)  
1.2  
E-1  
E-2  
E-3  
E-4  
E-5  
E-6  
Ta=25℃  
-40℃≦Ta105℃  
Ta=25℃  
-40℃≦Ta105℃  
Hysteresis Width (mV)  
Supply Current1 (nA)  
TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX.  
TYP.  
2
MAX.  
4.8  
5.2  
5.6  
6.0  
6.4  
6.8  
7.2  
7.9  
8.6  
9.4  
10  
11  
TYP.  
2
MAX.  
5.3  
5.7  
6.2  
6.6  
7.1  
7.5  
8.0  
8.7  
9.5  
10  
11  
91  
213  
218  
224  
229  
235  
240  
245  
251  
256  
262  
267  
272  
278  
283  
289  
294  
299  
305  
310  
316  
321  
326  
332  
337  
343  
348  
353  
359  
364  
370  
375  
380  
386  
391  
397  
402  
407  
413  
418  
91  
431  
437  
444  
451  
457  
464  
471  
478  
484  
491  
498  
504  
511  
518  
524  
531  
538  
545  
551  
558  
565  
571  
578  
585  
591  
598  
605  
612  
618  
625  
632  
638  
645  
652  
658  
665  
672  
679  
685  
91  
325  
331  
338  
344  
351  
357  
363  
370  
376  
383  
389  
395  
402  
408  
415  
421  
427  
434  
440  
447  
453  
459  
466  
472  
479  
485  
491  
498  
504  
511  
517  
523  
530  
536  
543  
549  
555  
562  
568  
91  
338  
345  
351  
358  
364  
371  
377  
384  
390  
397  
403  
410  
416  
423  
429  
436  
442  
449  
455  
462  
468  
475  
481  
488  
494  
501  
507  
514  
520  
527  
533  
540  
546  
553  
559  
566  
572  
579  
585  
1.3  
2
2
94  
94  
94  
94  
1.4  
2
2
98  
98  
98  
98  
1.5  
2
2
101  
104  
108  
111  
114  
117  
121  
124  
127  
131  
134  
137  
140  
144  
147  
150  
154  
157  
160  
163  
167  
170  
173  
177  
180  
183  
186  
190  
193  
196  
200  
203  
206  
210  
213  
216  
101  
104  
108  
111  
114  
117  
121  
124  
127  
131  
134  
137  
140  
144  
147  
150  
154  
157  
160  
163  
167  
170  
173  
177  
180  
183  
186  
190  
193  
196  
200  
203  
206  
210  
213  
216  
101  
104  
108  
111  
114  
117  
121  
124  
127  
131  
134  
137  
140  
144  
147  
150  
154  
157  
160  
163  
167  
170  
173  
177  
180  
183  
186  
190  
193  
196  
200  
203  
206  
210  
213  
216  
101  
104  
108  
111  
114  
117  
121  
124  
127  
131  
134  
137  
140  
144  
147  
150  
154  
157  
160  
163  
167  
170  
173  
177  
180  
183  
186  
190  
193  
196  
200  
203  
206  
210  
213  
216  
1.6  
2
2
1.7  
3
3
1.8  
3
3
1.9  
3
3
2.0  
3
3
2.1  
4
4
2.2  
4
4
2.3  
5
5
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
23  
24  
25  
26  
28  
29  
30  
32  
33  
35  
36  
38  
40  
41  
43  
45  
46  
48  
2.4  
5
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
25  
26  
27  
29  
30  
32  
33  
35  
36  
38  
39  
41  
43  
44  
46  
5
2.5  
6
6
2.6  
6
6
2.7  
7
7
2.8  
8
8
2.9  
8
8
3.0  
9
9
3.1  
9
9
3.2  
10  
11  
12  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
28  
10  
11  
12  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
28  
3.3  
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
4.0  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
8/23  
XC6136  
Series  
ELECTRICAL CHARACTERISTICS (SPEC TABLE)  
Table of Characteristics by Voltage Setting  
NOMINAL  
DETECT  
VOLTAGE(V)  
VDF(T)  
1.2  
E-7  
E-8  
E-9  
E-10  
Ta=25℃  
-40℃≦Ta105℃  
Supply Current2 (nA)  
TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX.  
88  
204  
211  
217  
224  
230  
237  
243  
250  
256  
263  
269  
276  
282  
289  
295  
302  
308  
315  
321  
328  
334  
341  
347  
354  
360  
367  
373  
380  
386  
393  
399  
406  
412  
419  
425  
432  
438  
445  
451  
88  
325  
334  
342  
350  
358  
366  
374  
382  
390  
398  
406  
415  
423  
431  
439  
447  
455  
463  
471  
479  
487  
496  
504  
512  
520  
528  
536  
544  
552  
560  
568  
577  
585  
593  
601  
609  
617  
625  
633  
88  
474  
482  
490  
498  
506  
515  
523  
531  
539  
547  
556  
564  
572  
580  
588  
597  
605  
613  
621  
629  
638  
646  
654  
662  
670  
679  
687  
695  
703  
711  
720  
728  
736  
744  
752  
761  
769  
777  
785  
88  
327  
336  
344  
352  
360  
368  
376  
384  
392  
400  
408  
417  
425  
433  
441  
449  
457  
465  
473  
481  
489  
498  
506  
514  
522  
530  
538  
546  
554  
562  
570  
579  
587  
595  
603  
611  
619  
627  
635  
1.3  
92  
92  
92  
92  
1.4  
95  
95  
95  
95  
1.5  
99  
99  
99  
99  
1.6  
103  
107  
111  
115  
119  
123  
127  
131  
135  
139  
143  
147  
151  
155  
158  
162  
166  
170  
174  
178  
182  
186  
190  
194  
198  
202  
206  
210  
214  
218  
222  
225  
229  
233  
237  
103  
107  
111  
115  
119  
123  
127  
131  
135  
139  
143  
147  
151  
155  
158  
162  
166  
170  
174  
178  
182  
186  
190  
194  
198  
202  
206  
210  
214  
218  
222  
225  
229  
233  
237  
103  
107  
111  
115  
119  
123  
127  
131  
135  
139  
143  
147  
151  
155  
158  
162  
166  
170  
174  
178  
182  
186  
190  
194  
198  
202  
206  
210  
214  
218  
222  
225  
229  
233  
237  
103  
107  
111  
115  
119  
123  
127  
131  
135  
139  
143  
147  
151  
155  
158  
162  
166  
170  
174  
178  
182  
186  
190  
194  
198  
202  
206  
210  
214  
218  
222  
225  
229  
233  
237  
1.7  
1.8  
1.9  
2.0  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
4.0  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
9/23  
XC6136 Series  
TEST CIRCUITS  
CIRCUIT①  
VIN  
100kΩ  
(Unused for the CMOS output products)  
RESETB/  
RESET  
V
V
VSS  
CIRCUIT②  
A
VIN  
RESETB/  
RESET  
VSS  
CIRCUIT③  
VIN  
RESETB/  
RESET  
V
V
VSS  
CIRCUIT④  
VIN  
100kΩ  
(Unused for the CMOS output products)  
RESETB/  
RESET  
Waveform measure point  
VSS  
CIRCUIT⑤  
VIN  
RESETB/  
RESET  
A
VSS  
*“RESETB” is A/B type, and “RESET” is C/D type.  
10/23  
XC6136  
Series  
OPERATIONAL DESCRIPTION  
Fig. 1: Typical block diagram (CMOS output/Active Low product)  
Fig. 2: Timing chart of Fig. 1  
The circuit operation in the above representative circuit example will be explained using the timing chart.  
(1) Assume that the input voltage (VIN) in the initial state is higher than the release voltage (VDR), and VIN gradually decreases.  
In a state where a voltage higher than the detection voltage (VDF) is applied to the input voltage (VIN), the input voltage (VIN)  
is output to the RESETB pin (released state).  
* In the case of N-ch open drain output products, the RESETB pin goes into a high impedance state.  
When the output is pulled up, the pull-up voltage is output to the RESETB pin.  
(2) When the input voltage (VIN) drops below the detection voltage (VDF), the ground potential (VSS) is output to the RESETB pin  
(detection state).  
* N-ch open drain output products are also the same.  
(3) If the input voltage (VIN) further decreases and becomes lower than the minimum operating voltage (1.1V), the output  
becomes undefined.  
However, the XC6136C series (CMOS output product) has an under-voltage lockout (UVLO) circuit to prevent undefined  
operation due to a decrease in VIN.  
Therefore, the floating of the RESETB terminal caused by less than the minimum operating voltage is minimized.  
* Pull-up voltage may be output to the RESETB terminal when the output terminal is pulled up with an N-ch open drain output  
product.  
(4) The RESETB pin holds the ground potential (VSS) until the input voltage (VIN) rises above the minimum operating voltage  
(1.1V) and reaches the release voltage (VDR).  
(5) When the input voltage (VIN) becomes equal to or higher than the release voltage (VDR), the input voltage (VIN) is output to the  
RESETB pin.  
* In the case of N-ch open drain output products, the RESETB pin goes into a high-impedance state in the same way as in 1),  
and if the output is pulled up, the pull-up voltage is output to the RESETB pin.  
(6) The difference between the release voltage (VDR) and the detect voltage (VDF) is the hysteresis width (VHYS).  
Note: In the above explanation, the operation time of the circuit is omitted for simplicity of explanation.  
In addition, above explanation is the operation using Active Low product.  
For Active High products, please reverse the output logic of RESETB pin voltage.  
11/23  
XC6136 Series  
NOTES ON USE  
(1) Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon,  
the IC is liable to malfunction should the ratings be exceeded.  
(2) The power input pin voltage may fall due to the flow through current during IC operation and the resistance component  
between the power supply and the power input pin.  
In the case of CMOS output, a drop in the power input pin voltage may occur in the same way due to the output current. When  
this happens, if the power input pin voltage drops below the minimum operating voltage, a malfunction may occur.  
(3) Note that large, sharp changes of the power input pin voltage may lead to malfunction.  
(4) Since the power supply noise may cause malfunction, please fully evaluate with an actual system. As necessary, please take  
measures such as inserting a capacitor between VIN and VSS  
.
(5) When an N-ch open drain output is used, the VRESETB voltage at detection and release is determined by the pull-up resistance  
connected to the output pin. Refer to the following when selecting the resistance value.  
At detection:  
VRESETB = Vpull / (1 + Rpull / RON)  
Vpull  
RON  
Voltage after pull-up  
(*1)  
ON resistance of N-ch driver M1 (calculated from VRESETB/IRBOUTN based on electrical characteristics)  
Example: When VIN=2.0V(*2), RON = 0.3V / (4.1 × 10-3 A) 73.2(MAX.)  
If it is desired to make VRESETB at detection 0.1V or less when Vpull is 3.0V,  
Rpull = { ( Vpull / VRESETB ) – 1 } × RON = { ( 3V / 0.1V ) – 1 } × 73.22.1kΩ  
Therefore, to make the output voltage at detection 0.1V or less under the above conditions, the pull-up resistance must be 2.1kor higher.  
(*1) Note that RON becomes larger as VIN becomes smaller.  
(*2) For VIN in the calculation, use the lowest value of the input voltage range you will use.  
At release:  
VRESETB = Vpull / ( 1 + Rpull / Roff )  
Vpull  
Roff  
Voltage after pull-up  
Resistance when N-ch driver M1 is OFF (calculated from VRESETB/ILEAKN based on electrical characteristics)  
Example: When Vpull is 6.0V, Roff = 6V / ( 0.1 × 10-6 A) = 60M(MIN.).  
If it is desired to make VRESETB 5.99V or higher,  
R
pull = { ( Vpull / VRESETB ) – 1 } × Roff = { ( 6V / 5.99V ) – 1 } × 60 × 106100kΩ  
Therefore, to make the output voltage at release 5.99V or higher under the above conditions, the pull-up resistance must be  
100kor less.  
The above VRESETB voltage is an example calculation of Active Low products.  
To calculate the VRESET voltage (Active High product), calculate by inverting the logic at detection and release.  
(6) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs  
and post-aging protection treatment when using Torex products in their systems.  
12/23  
XC6136  
Series  
TYPICAL PERFORMANCE CHARACTERISTICS  
(1)Detect, Release Voltage vs. Ambient Temperature  
(2)Output Voltage vs. Input Voltage  
XC6136 (VDF=1.2V,TYPE:A)  
XC6136 (VDF=1.2V,TYPE:A)  
1.35  
1.5  
1.3  
VDR  
1
0.5  
0
1.25  
1.2  
105℃  
25℃  
40℃  
VDF  
1.15  
1.1  
50 25  
0
25 50 75 100 125  
1.1  
1.15  
1.2  
1.25  
1.3  
1.35  
Ambient Temperature : Ta ()  
Input Voltage : VIN (V)  
(3)Hysteresis Width vs. Ambient Temperature  
XC6136 (VDF=1.2V,TYPE:A)  
XC6136 (VDF=5.0V,TYPE:A)  
70  
320  
300  
280  
260  
240  
220  
65  
60  
55  
50  
50 25  
0
25 50 75 100 125  
50 25  
0
25 50 75 100 125  
Ambient Temperature : Ta ()  
Ambient Temperature : Ta ()  
(4)Supply Current vs. Ambient Temperature  
XC6136 (VDF=5.0V,CMOS output,  
TYPE:A)  
XC6136 (VDF=1.2V,CMOS output,  
TYPE:A)  
500  
200  
175  
VIN=VDF×0.9  
400  
300  
200  
100  
0
150  
125  
VIN=VDF×1.1  
VIN=VDF×0.9  
100  
VIN=VDF×1.1  
75  
50  
25  
0
50 25  
0
25  
50  
75 100 125  
50 25  
0
25  
50  
75 100 125  
Ambient Temperature : Ta ()  
Ambient Temperature : Ta ()  
(5)Supply Current vs. Input Voltage  
XC6136 (VDF=5.0V,CMOS output,  
TYPE:A)  
XC6136 (VDF=1.2V,CMOS output,  
TYPE:A)  
400  
300  
200  
100  
0
400  
Ta=105℃  
Ta=105℃  
300  
Ta=25℃  
Ta=25℃  
200  
100  
0
Ta=40℃  
Ta=40℃  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage : VIN (V)  
Input Voltage : VIN (V)  
13/23  
XC6136 Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(6)Undefined Operation vs. Input Voltage  
XC6136 (CMOS output, TYPE:A)  
XC6136 (CMOS output, TYPE:C)  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
1
0.8  
0.6  
0.4  
0.2  
0
105℃  
25℃  
40℃  
105℃  
25℃  
40℃  
0
0.2  
0.4  
0.6  
0.8  
1
0
0.2  
0.4  
0.6  
0.8  
1
Input Voltage : VIN (V)  
Input Voltage : VIN (V)  
(7)Release, Detect Delay Time vs. Ambient Temperature  
XC6136  
VIN=VDF×0.9VDF×1.1  
100  
80  
60  
tDR0  
40  
20  
0
tDF0  
50 25  
0
25 50 75 100 125  
Ambient Temperature : Ta ()  
(8)RESETB Output Current vs. Ambient Temperature  
XC6136 (VDF=5.0V,TYPE:A)  
XC6136 (VDF=1.2V,TYPE:A)  
Nch. VRESETB=0.3V  
Pch. VRESETB=VIN 0.3V  
30  
0
1  
2  
3  
4  
5  
6  
25  
VIN=4.0V  
VIN=3.0V  
20  
15  
10  
5
VIN=3.0V  
VIN=2.0V  
VIN=6.0V  
VIN=1.1V  
25 50 75 100 125  
0
50 25  
0
50 25  
0
25 50 75 100 125  
Ambient Temperature : Ta ()  
Ambient Temperature : Ta ()  
(9)RESETB Output Leakage Current vs. Ambient Temperature  
XC6136 (Nch opendrainoutput,  
VIN=6.0V  
TYPE:A)  
V
RESETB=6.0V  
50  
40  
30  
20  
10  
0
50 25  
0
25 50 75 100 125  
Ambient Temperature : Ta ()  
14/23  
XC6136  
Series  
PACKAGING INFORMATION  
USPQ-4B05 (unit:mm)  
1.0±0.05  
1pin INDENT  
0.05  
0.25±0.05  
1
2
3
4
(0.65)  
USPQ-4B05 Reference Pattern Layout (unit:mm)  
USPQ-4B05 Reference Metal Mask Design  
3
4
0.65  
3
4
0.1  
0.05  
0.1  
0.25  
0.225  
0.225  
0.45  
0.9  
2
1
2
1
15/23  
XC6136 Series  
PACKAGING INFORMATION  
SSOT-24 (unit:mm)  
2.0±0.1  
+0.15  
0.25 -0.1  
+0.15  
0.25 -0.1  
+0.1  
0 -0  
+0.1  
-0.05  
+0.15  
0.25 -0.1  
0.125  
+0.15  
0.35 -0.1  
0.05  
1.3±0.2  
SSOT-24 Reference Pattern Layout (unit:mm)  
0.5  
0.6  
1.3  
16/23  
XC6136  
Series  
PACKAGING INFORMATION  
SOT-25 (unit:mm)  
2.9±0.2  
+0.1  
0.4  
-0.05  
5
1
4
3
0~0.1  
2
+0.1  
-0.05  
0.15  
(0.95)  
1.9±0.2  
SOT-25 Reference Pattern Layout (unit:mm)  
0.7  
0.95  
0.95  
17/23  
XC6136 Series  
18/23  
XC6136  
Series  
SSOT-24 Power Dissipation (40mm x 40mm Standard board)  
Power dissipation data for the SSOT-24 is shown in this page.  
The value of power dissipation varies with the mount board conditions.  
Please use this data as the reference data taken in the following condition.  
1. Measurement Condition  
Condition Mount on a board  
Ambient Natural convection  
Soldering Lead (Pb) free  
Board Dimensions 40 x 40 mm  
(1600 mm2 in one side)  
Copper (Cu) traces occupy 50% of the board  
area In top and back faces  
Package heat-sink is tied to the copper traces  
Material Glass Epoxy (FR-4)  
Thickness 1.6mm  
Through-hole 4 x 0.8 Diameter  
Evaluation Bard (Unit mm)  
2.Power Dissipation vs. Ambient Temperature  
Board Mount (Tj max = 125  
)
Ambient Temperature  
Power Dissipation Pd mW  
Thermal Resistance  
200.00  
W
(℃/ )  
(℃)  
25  
500  
100  
105  
Pd vs Ta  
600  
500  
400  
300  
200  
100  
0
25  
45  
65  
85  
105  
125  
Ambient Temperature Ta ()  
19/23  
XC6136 Series  
SOT-25 Power Dissipation 105(40mm x 40mm Standard board)  
Power dissipation data for the SOT-25 is shown in this page.  
The value of power dissipation varies with the mount board conditions.  
Please use this data as the reference data taken in the following condition.  
1. Measurement Condition  
Condition Mount on a board  
Ambient Natural convection  
Soldering Lead (Pb) free  
Board Dimensions 40 x 40 mm  
(1600 mm2 in one side)  
Copper (Cu) traces occupy 50% of the board  
area In top and back faces  
Package heat-sink is tied to the copper traces  
(Board of SOT-26 is used.)  
Material Glass Epoxy (FR-4)  
Thickness 1.6mm  
Through-hole 4 x 0.8 Diameter  
Evaluation Board (Unit mm)  
2.Power Dissipation vs. Ambient Temperature  
Board Mount (Tj max = 125  
)
Ambient Temperature  
Power Dissipation Pd mW  
Thermal Resistance  
166.67  
W
(℃/ )  
(℃)  
25  
600  
120  
105  
Pd vs Ta  
700  
600  
500  
400  
300  
200  
100  
0
25  
45  
65  
85  
105  
125  
Ambient Temperature)  
20/23  
XC6136  
Series  
MARKING RULE  
USPQ-4B05 (with underline mark)  
SSOT-24 (with underline mark)  
3
4
4
3
1
2
2
1
represents products series  
MARK  
X
PRODUCT SERIES  
XC6136******-G  
represents internal sequential number  
09AZ repeated.  
(G, I, J, O, Q, W excluded)  
,represents production lot number  
0109, 0A0Z, 119Z, A1A9, AAA9, AAZ9 repeated.  
(GIJOQW excluded)  
* No character inversion used.  
21/23  
XC6136 Series  
MARKING RULE  
SOT-25 (under dot)  
Expansion  
represents products series  
MARK  
X
PRODUCT SERIES  
XC6136******-G  
②③ represents internal sequential number  
01091099A0A9B0B9・・・Z0Z9AAAZBABZ・・・ZAZZ repeated.  
(G, I, J, O, Q, W excluded)  
④⑤ represents production lot number  
01090A0Z11・・・9ZA1A9AA・・・Z9ZAZZ repeated  
(GIJOQW excluded)  
* No character inversion used.  
.
22/23  
XC6136  
Series  
1. The product and product specifications contained herein are subject to change without notice to  
improve performance characteristics. Consult us, or our representatives before use, to confirm that  
the information in this datasheet is up to date.  
2. The information in this datasheet is intended to illustrate the operation and characteristics of our  
products. We neither make warranties or representations with respect to the accuracy or  
completeness of the information contained in this datasheet nor grant any license to any intellectual  
property rights of ours or any third party concerning with the information in this datasheet.  
3. Applicable export control laws and regulations should be complied and the procedures required by  
such laws and regulations should also be followed, when the product or any information contained in  
this datasheet is exported.  
4. The product is neither intended nor warranted for use in equipment of systems which require  
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss  
of human life, bodily injury, serious property damage including but not limited to devices or equipment  
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and  
other transportation industry and 5) safety devices and safety equipment to control combustions and  
explosions. Do not use the product for the above use unless agreed by us in writing in advance.  
5. Although we make continuous efforts to improve the quality and reliability of our products;  
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal  
injury and/or property damage resulting from such failure, customers are required to incorporate  
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention  
features.  
6. Our products are not designed to be Radiation-resistant.  
7. Please use the product listed in this datasheet within the specified ranges.  
8. We assume no responsibility for damage or loss due to abnormal use.  
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex  
Semiconductor Ltd in writing in advance.  
TOREX SEMICONDUCTOR LTD.  
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XC6135N25A9R-G产品参数
型号:XC6135N25A9R-G
是否Rohs认证: 符合
生命周期:Active
包装说明:,
Reach Compliance Code:compliant
风险等级:5.57
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