XC8107AC10MR-G全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

XC8107 Series

ETR33003-002

85mΩ High Function Power Switch

■GENERAL DESCRIPTION

The XC8107 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current

prevention (prevents reverse current from V_OUTto V_IN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are

incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open

drain configuration, and it outputs Low level signal when over-current or overheating is detected, or when the reverse current

prevention is operated. The voltage level which is fed to CE pin determines the status of XC8107. The logic level of CE pin is

selectable between either one of active high or active low.

■APPLICATIONS

●Set Top Boxes

●Digital TVs

■FEATURES

Input Voltage

: 2.5V～5.5V

: 2A

Output Current

ON Resistance

: 85mΩ@V_IN=5.0V (TYP.) *USP-6C

100mΩ@V_IN=5.0V (TYP.) *SOT-25

: 40μA@ V_IN=5.0V

●PCs

Supply Current

Stand-by Current

Flag Delay Time

●USB Ports/USB Hubs

●HDMI

: 0.1μA (MAX.)

: 7.5ms (TYP.)

* At over-current detection

: 4ms(TYP.)

* At reverse voltage detection

: Reverse Current Prevention

Thermal Shutdown

Protection Circuit

Under Voltage Lockout(UVLO）

Soft-start

: Flag Output

Functions

CE Pin Input Logic Selectable

: 2μs(TYP.) *Reference value

Current Limit Response Time

Operating Ambient Temperature

Packages

: -40℃～+105℃

: USP-6C, SOT-25

Environmentally Friendly

: EU RoHS Compliant, Pb Free

■

TYPICAL APPLICATION CIRCUIT

■TYPICAL PERFORMANCE

CHARACTERISTICS

XC8107xCxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

6.0

5.0

4.0

3.0

2.0

1.0

0.0

0.5A type

1.0A type

1.5A type

2.0A type

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Output Current : I_OUT[A]

1/27

XC8107 Series

■BLOCK DIAGRAM

XC8107 Series

* Diodes inside the circuit are an ESD protection diode and a parasitic diode.

2/27

XC8107

Series

■PRODUCT CLASSIFICATION

●Ordering Information

XC8107①②③④⑤⑥-⑦

DESIGNATOR

ITEM

SYMBOL

DESCRIPTION

A

B

①

CE Logic

Refer to Selection Guide

C

②

Protection Circuits Type

Maximum Output Current

Packages

D

05

0.5A

10

1.0A

③④

15

1.5A

20

2.0A

ER-G

MR-G

USP-6C (3,000/Reel)

SOT-25 (3,000/Reel)

(*1)

⑤⑥-⑦

^(*1)The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.

●Selection Guide

CURRENT

LIMITTER

TYPE

CE LOGIC SELECTABLE

SOFT-START

AC

AD

BC

BD

Active High

Active Low

Yes

REVERSE CURRENT

PREVENTION

TYPE

UVLO

FLG OUTPUT

AC

AD

BC

BD

Yes

THERMAL

LATCH

TYPE

SHUT DOWN

PROTECTION

AC

AD

BC

BD

Yes

No

Yes

No

Yes

3/27

XC8107 Series

■PIN CONFIGURATION

* The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation.

Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the V_SS(No. 5) pin.

■PIN ASSIGNMENT

PIN NUMBER

PIN NAME

FUNCTIONS

USP-6C

SOT-25

1

2

3

4

5

6

1

-

V_OUT

NC

Output

No connection

Fault Report

ON/OFF Control

Ground

3

4

2

5

FLG

CE

V_SS

V_IN

Power Input

■FUNCTION

TYPE

PIN NAME

SIGNAL

STATUS

Active

H

L

A

Stand-by

OPEN

H

Undefined State ^(*1)

CE

Stand-by

B

L

Active

OPEN

Undefined State ^(*1)

* Avoid leaving the CE pin open; set to any fixed voltage.

4/27

XC8107

Series

■ABSOLUTE MAXIMUM RATINGS

Ta=25℃

PARAMETER

SYMBOL

RATINGS

UNITS

Input Voltage

Output Voltage

Output Current

CE Input Voltage

FLG Pin Voltage

FLG Pin Current

V_IN

V_OUT

I_OUT

V_CE

-0.3～+6.0

2.8

V

A

-0.3～+6.0

V

V_FLG

I_FLG

V

15

120

mA

USP-6C

SOT-25

1000 (PCB mounted) ^(*2)

250

Power Dissipation

Pd

mW

600 (PCB mounted) ^(*2)

Operating Ambient Temperature

Storage Temperature

Topr

Tstg

-40～+105

℃

-55～+125

* All voltages are described based on the V_SS

.

^(*1)Use with I_OUTless than Pd/（V_IN-V_OUT）.

^(*2)This is a reference data taken by using the test board. Please refer to page 24 and 25 for details.

5/27

XC8107 Series

■ELECTRICAL CHARACTERISTICS

Ta=25℃

PARAMETER

Input Voltage

SYMBOL

V_IN

CONDITIONS

MIN.

TYP.

MAX.

UNITS CIRCUIT

-

2.5

-

5.5

110

104

135

120

75

V

①

V_IN=3.3V ^(*1)

-

100

85

mΩ

μA

USP-6C

V_IN=5.0V ^(*1)

V_IN=3.3V ^(*1)

V_IN=5.0V ^(*1)

On Resistance

R_ON

①

115

100

40

SOT-25

Supply Current

I_SS

V_OUT=OPEN

②

V_IN=5.5V, V_OUT=OPEN

Stand-by Current

I_STBY

V_CE=V_SS(XC8107A series)

V_CE=V_IN(XC8107B series)

-

0.01

1.0

μA

V_IN=5.5V, V_OUT=0V

V_CE=V_SS(XC8107A series)

V_CE=V_IN(XC8107B series)

V_OUT=V_IN-0.3V,

Switch Leakage Current

I_LEAK

②

0.81

0.90

1.40

1.90

2.40

0.45

0.70

0.95

1.20

0.99

A

XC8107xx05 series

V_OUT=V_IN-0.3V,

1.26

1.54

XC8107xx10 series

V_OUT=V_IN-0.3V,

Current Limit

I_LIMT

①

1.71

2.09

XC8107xx15 series

V_OUT=V_IN-0.3V,

2.16

2.64

XC8107xx20 series

V_OUT=0V,

-

XC8107xx05 series

V_OUT=0V,

XC8107xx10 series

V_OUT=0V,

Short-Circuit Current

I_SHORT

①

XC8107xx15 series

V_OUT=0V,

XC8107xx20 series

V_IN=5.0V, V_OUT: OPEN→0V

Measure from V_OUT=0V

to when current falls below

a certain I_LIMvalue

V_IN=5.5V, XC8107A series

V_IN=5.5V, XC8107B series

V_IN=5.5V, XC8107A series

V_IN=5.5V, XC8107B series

V_IN=5.5V, V_CE=5.5V

V_IN=5.5V, V_CE=0V

Current Limit Circuit

Response Time ^(*2)

t_CLR

-

2.0

-

μs

1.5

-

5.5

0.8

5.5

0.1

CE "H" Level Voltage

CE "L" Level Voltage

V_CEH

V_CEL

V

①

-

1.5

-0.1

CE "H" Level Current

CE "L" Level Current

I_CEH

I_CEL

μA

①

UVLO Detected Voltage

V_UVLOD

V_IN: 2.2V→1.7V

1.8

1.9

2.0

V

①

UVLO Released Voltage

UVLO Hysteresis

V_UVLOR

V_UHYS

V_IN: 1.7V→2.2V

1.9

-

2.0

0.1

2.1

-

V

①

-

NOTE:

Unless otherwise stated, V_IN=5.0V, I_OUT=1mA, V_CE=V_IN(XC8107A series) or V_CE=V_SS(XC8107B series)

(*1)

I

=0.25A (XC8107xx05 series), I_OUT=0.5A (XC8107xx10 series), I_OUT=0.75A (XC8107xx15series), I_OUT=1.0A (XC8107xx20 series)

OUT

^(*2)Design reference value. This parameter is provided only for reference.

6/27

XC8107

Series

■ELECTRICAL CHARACTERISTICS (Continued)

Ta=25℃

PARAMETER

turn-on time

SYMBOL

t_DLY(ON)

CONDITIONS

MIN.

-

TYP.

0.60

MAX.

1.00

UNITS CIRCUIT

R_LOAD=10Ω, V_CE=0V→2.2V

ms

Ω

①

③

①

turn-off time

t_DLY(OFF)

R_FLG

I_FOFF

t_FD1

R_LOAD=10Ω, V_CE=2.2V→0V

I_FLG=10mA, V_OUT=5.5V

-

0.08

15

0.13

20

FLG output FET

On-resistance

FLG output FET

Leakage Current

V_IN=5.5V, V_FLG=5.5V, V_OUT=OPEN

over-current condition

-

0.01

7.5

0.1

8.5

4.7

μA

ms

6.5

2.7

FLG delay time

t_FD2

reverse-voltage condition

4.0

V_IN=0V, V_OUT=5.5V

Reverse Current

I_REV

V_CE=5.0V (XC8107A series)

V_CE=V_SS(XC8107B series)

-

0.1

1.0

μA

①

Reverse Current

Prevention

SOT-25

-

170

140

-

V_IN: 5.0V→4.7V

V_{REV_D}

mV

V_OUT=5.0V

USP-6C

Detect Voltage

Thermal Shutdown

Detect Temperature

Thermal Shutdown

Release Temperature

Thermal Shutdown

Hysteresis Width

T_TSD

T_TSR

T_HYS

Junction Temperature

-

150

130

20

-

℃

①

NOTE:

Unless otherwise stated, V_IN=5.0V, I_OUT=1mA, V_CE=V_IN(XC8107A series) or V_CE=V_SS(XC8107B series)

■TIMING CHART

●turn-on time, turn-off time

XC8107 Series, Type A

XC8107 Series, Type B

7/27

XC8107 Series

■TEST CIRCUITS

C_IN=1.0μF, C_L=1.0μF

1) CIRCUIT①

2) CIRCUIT②

3) CIRCUIT③

V_OUT

V_IN

FLG

CE

A

V_OUT

V_IN

V_FLG

V_CE

V_SS

V

C_L

(ceramic)

C_IN

(ceramic)

V

8/27

XC8107

Series

■OPERATIONAL EXPLANATION

The XC8107 series is a P-channel MOSFET power switch IC.

The XC8107 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current

prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block.

The current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current.

(See the BLOCK DIAGRAM below)

BLOCK DIAGRAM (XC8107 Series)

The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the

electrical specification is fed to CE pin, then XC8107 can operate in standard manner. However, if the middle voltage which is

neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal

circuits. Also if CE pin is open, the status of XC8107 cannot be fixed and the behavior will be unstable.

For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature

reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC

resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because

the junction temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit

detects higher junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal

shutdown circuit detects lower junction temperature than the release temperature, the thermal shutdown function is released

and the voltage level of FLG pin is high level.

When the V_INpin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by

UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the V_INpin voltage

goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn

ON.

<Soft-start Function>

The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the

reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized

internally and defined as turn-on time. (TYP: 0.6ms)

9/27

XC8107 Series

■OPERATIONAL EXPLANATION (Continued)

When the output current reaches the current limit value, the constant current limiter circuit activates and as a result, the

output voltage goes down.

If the short circuit comes at the V_OUTpin, the output current is limited to the current which is specified as the short-circuit current

value. If the over-current state lasts for 7.5ms (TYP.), the FLG pin changes to Low level output.

Two types are available for the current limiter circuit: an auto recovery type (product type C) and a latch off type (product type

D). After the current limiter circuit activates and the FLG pin outputs low level, the operation is different between these two

types.

The auto recovery type continuously limits the output current by the current limit value.

When the over-current status finishes and the status of that the output current is less than the current limit value continues for

7.5ms (TYP.) or more, the voltage of FLG pin goes up “H” level again.

The latch off type turns off the power switch transistor after the FLG pin outputs Low level. The off state is maintained

regardless of whether the over-current state is released.

Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage

below the UVLO detected voltage once and after that raising it higher than UVLO released voltage.

An internal circuit is built in that prevents reverse current from the V_OUTpin to the V_INpin.

When the difference between input voltage and V_OUTpin voltage is higher than the detect voltage set internally, the reverse

current prevention circuit activates, and the power switch transistor turns off, then the reverse current from the V_OUTpin to the

V_INpin is reduced to 0.1μA (TYP.).

If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output.

Two types are available for the reverse current prevention circuit: the auto recovery type (product type C) and the latch off

type (product type D). After the reverse current prevention circuit activates and the FLG pin outputs low level, the operation is

different between these two types.

On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops

immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms

(TYP.), the FLG pin returns to High level output.

On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released.

Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage

below the UVLO detected voltage once and after that raising it higher than UVLO released voltage.

10/27

XC8107

Series

■OPERATIONAL EXPLANATION (Continued)

The flag circuit is built in which monitors the state of the power switch.

The FLG pin outputs Low level when the reverse current prevention function is operating. A resistance of 10kΩ to 100kΩ is

recommended for the FLG pin pull-up resistance.

Auto recovery type (product type C)

Protective function

FLG pin Low level output

Return to FLG pin High level output

Current limiter

Reverse current prevention

Thermal shutdown

7.5ms after over-current detection

4.0ms after reverse voltage detection

Same time as overheat state is detected

7.5ms after over-current release

4.0ms after reverse voltage release

Same time as overheat state is released

Latch off type (product type D)

Protective function

FLG pin Low level output

Return to FLG pin High level output

Current limiter

Reverse current prevention

Thermal shutdown

7.5ms after over-current detection

4.0ms after reverse voltage detection

Same time as overheat state is detected

When latch operation is released

Same time as overheat state is released

11/27

XC8107 Series

■NOTES ON USE

1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or

deteriorated if IC is used beyond the absolute MAX. specifications.

2. Where wiring impedance is high, operations may become unstable due to noise depending on output current.

Please keep the resistance low between V_INand V_SSwiring in particular.

3. Please place the input capacitor (C^IN) and the output capacitor (CL) as close to the IC as possible.

For the input or output capacitor, a capacitance of 1.0μF or higher is recommended.

4. When the voltage which is higher than the maximum input voltage is fed to the V_INpin, and V_OUTis shorted to the V_SSlevel, in

this case the short circuit may cause a fatal impact to operation for the IC. Please use within the operational voltage range.

5. Torex places an importance on improving our products and its reliability.

However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.

12/27

XC8107

Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(1) UVLO detect Voltage vs. Input Voltage

(2) UVLO release Voltage vs. Input Voltage

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

2.5

2.0

1.5

1.0

0.5

0.0

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Ta=105℃

Ta=25℃

Ta=-40℃

Ta=105℃

Ta=25℃

Ta=-40℃

1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10

Input Voltage : V_IN[V]

1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10

Input Voltage : V_IN[V]

(3) UVLO threshold Voltage vs. Ambient Temperature

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

2.5

2.0

1.5

1.0

UVLO detect

UVLO release

0.5

0.0

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

(4)ꢀStand-by Current vs. Input Voltage

XC8107xxxxxR

(5)ꢀStand-by Current vs. Ambient Temperature

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

Ta=105℃

Istby

2.5

Ta=25℃

2.5

Ta=-40℃

2.0

1.5

1.0

0.5

0.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

-50 -25

0

25

50

75 100 125

Input Voltage : V_IN[V]

Ambient Temperature : Ta [℃]

13/27

XC8107 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(6)ꢀSupply Current vs. Input Voltage（sweep up）

(7)ꢀSupply Current vs. Ambient Temperature

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

V_IN=5.0V, C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

50

45

40

35

30

25

20

45

40

35

30

25

20

Ta=105℃

15

Ta=25℃

15

VIN=5.0V

10

Ta=-40℃

10

5

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

0

-50 -25

0

25

50

75 100 125

Input Voltage : V_IN[V]

Ambient Temperature : Ta [℃]

(9)ꢀCE "L" Level Voltage vs. Input Voltage

XC8107xxxxxR

(8)ꢀCE "H" Level Voltage vs. Input Voltage

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

2.5

2.0

1.5

2.5

2.0

1.5

Ta=105℃

1.0

Ta=105℃

Ta=25℃

0.5

Ta=-40℃

0.0

0.5

1.0

1.5

2.0

2.5

0.0

0.5

1.0

1.5

2.0

2.5

Input Voltage : V_IN[V]

(10)ꢀCE threshold Voltage vs. Ambient Temperature

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

CE"H"Level

2.5

CE"L"Level

2.0

1.5

1.0

0.5

0.0

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

14/27

XC8107

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(11)ꢀOn Resistance vs. Input Voltage (SOT-25)

(12)ꢀOn Resistance

vs. Ambient Temperature (SOT-25)

XC8107xxxxMR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

180

160

140

120

100

80

160

140

120

100

80

VIN=2.5V

VIN=3.5V

VIN=4.5V

VIN=5.0V

VIN=5.5V

Ta=105℃

60

Ta=25℃

40

Ta=-40℃

20

0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage : V_IN[V]

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

(13)ꢀOn Resistance vs. Input Voltage (USP-6C)

XC8107xxxxER

(14)ꢀOn Resistance

vs. Ambient Temperature (USP-6C)

XC8107xxxxER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

180

160

140

120

100

80

160

140

120

100

80

VIN=2.5V

VIN=3.5V

VIN=4.5V

VIN=5.0V

VIN=5.5V

60

Ta=105℃

Ta=25℃

40

Ta=-40℃

20

0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage : V_IN[V]

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

(15)ꢀturn-on time vs. Input Voltage

XC8107xxxxxR

(16)ꢀturn-on time vs. Ambient Temperature

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

0.7

0.6

0.5

0.4

0.6

0.5

0.4

0.3

Ta=105℃

VIN=2.5V

Ta=25℃

0.2

VIN=3.5V

0.2

VIN=4.5V

Ta=-40℃

0.1

VIN=5.0V

VIN=5.5V

0.0

-50 -25

0

25

50

75 100 125

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage : V_IN[V]

Ambient Temperature : Ta [℃]

15/27

XC8107 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(17)ꢀturn-off time vs. Input Voltage

(18)ꢀturn-off time vs. Ambient Temperature

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

V_IN=4.3V, C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

0.09

0.08

0.07

0.06

0.05

0.04

0.03

0.02

0.01

0.00

0.08

0.07

0.06

0.05

VIN=2.5V

0.04

VIN=3.5V

Ta=105℃

Ta=25℃

Ta=-40℃

0.03

VIN=4.5V

VIN=5.0V

0.02

VIN=5.5V

0.01

0.00

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage : V_IN[V]

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

(19)ꢀFLG delay time over-current

vs. Ambient Temperature

(20)ꢀFLG delay time reverse-voltage

vs. Ambient Temperature

XC8107xxxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

9.0

8.5

8.0

7.5

7.0

6.5

6.0

5.5

5.0

4.5

4.0

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

VIN=2.5V

VIN=3.5V

VIN=4.5V

VIN=5.0V

VIN=5.5V

VIN=2.5V

VIN=3.5V

VIN=4.5V

VIN=5.0V

-50 -25

0

25

50

75 100 125

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

(21)ꢀOutput Voltage vs. Output Current

XC8107xCxxxR

XC8107xDxxxR

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

6.0

5.0

4.0

3.0

2.0

1.0

0.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

0.5A type

1.0A type

1.5A type

2.0A type

0.5A type

1.0A type

1.5A type

2.0A type

If the over-current state lasts for 7.5ms,

the latch off type turns off the power switch transistor.

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Output Current : I_OUT[A]

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Output Current : I_OUT[A]

16/27

XC8107

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(22)ꢀturn-on Delay vs. Rise Time (C_L=1.0μF)

(23)ꢀturn-oｆｆ Delay vs. Fall Time (C_L=1.0μF)

XC8107xx10xR

V

_CE=5.0V→0V, tf=5μs, R_L=10Ω, Ta=25℃

V_CE=0V→5.0V, tr=5μs, R_L=10Ω, Ta=25℃

V

_IN=5.0V, C_IN=C_L=1.0μF(ceramic)

V

_IN=5.0V, C_IN=C_L=1.0μF(ceramic)

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

CE Input Voltage

Output Voltage

4.0

2.0

Output Voltage

0.0

CE Input Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [100μs/div]

(24)ꢀturn-on Delay vs. Rise Time (C_L=120μF)

XC8107xx10xR

(25)ꢀturn-oｆｆ Delay vs. Fall Time (C_L=120μF)

XC8107xx10xR

V

_CE=5.0V→0V, tf=5μs, R_L=10Ω, Ta=25℃

_IN=5.0V, C_IN=1.0μF, C_L=120μF(ceramic)

V

_CE=0V→5.0V, tr=5μs, R_L=10Ω, Ta=25℃

_IN=5.0V, C_IN=1.0μF, C_L=120μF(ceramic)

V

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

CE Input Voltage

4.0

Output Voltage

2.0

0.0

CE Input Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

(26)ꢀShort Circuit Current, Device Enabled Into Short

XC8107xx10xR

V_CE=5.0V→0V, tf=5μs, Ta=25℃

V

_CE=0V→5.0V, tr=5μs, Ta=25℃

V

_IN=5.0V, C_IN=1.0μF, C_L=120μF(ceramic)

V

_IN=5.0V, C_IN=C_L=1.0μF(ceramic)

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

CE Input Voltage

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

CE Input Voltage

4.0

2.0

0.0

Output Voltage

Supply Current

Output Voltage

Supply Current

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

-0.5

Time [40μs/div]

17/27

XC8107 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

（27）ꢀShort-Curcuit Transient Response

(V_OUT=5.0Ω→short, C_L=1.0μF)

（28）ꢀShort-Curcuit Transient Response

(V_OUT=short→5.0Ω, C_L=1.0μF)

XC8107xC10xR

V

_IN=5.0V, tr=100μs, Ta=25℃

V

_IN=5.0V, tf=100μs, Ta=25℃

FLG=100kΩ, C_IN=C_L=1.0μF(ceramic)

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

V_OUT= Removed Short circuit

V_OUT= Short circuit to Vss

4.0

Output Voltage

FLG Voltage

4.0

2.0

FLG Voltage

0.0

Output Voltage

Supply Current

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [2ms/div]

（29）ꢀShort-Curcuit Transient Response

(V_OUT=open→short, C_L=1.0μF)

（30）ꢀShort-Curcuit Transient Response

(V_OUT=short→open, C_L=1.0μF)

XC8107xC10xR

V

_IN=5.0V, tr=100μs, Ta=25℃

V

_IN=5.0V, tf=100μs, Ta=25℃

FLG=100kΩ, C_IN=C_L=1.0μF(ceramic)

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

V_OUT= Removed Short circuit

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

V_OUT= Short circuit to Vss

4.0

Output Voltage

4.0

FLG Voltage

2.0

FLG Voltage

0.0

Output Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [2ms/div]

（31）ꢀShort-Curcuit Transient Response

(V_OUT=5.0Ω→short, C_L=120μF)

（32）ꢀShort-Curcuit Transient Response

(V_OUT=short→5.0Ω, C_L=120μF)

XC8107xC10xR

V

_IN=5.0V, tr=100μs, Ta=25℃

V

_IN=5.0V, tf=100μs, Ta=25℃

FLG=100kΩ, C_IN=1.0μF, C_L=120μF(ceramic)

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

V_OUT= Removed Short circuit

V_OUT= Short circuit to Vss

4.0

FLG Voltage

Output Voltage

FLG Voltage

2.0

0.0

Output Voltage

Supply Current

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [2ms/div]

18/27

XC8107

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

（33）ꢀShort-Curcuit Transient Response

(V_OUT=open→short, C_L=120μF)

（34）ꢀShort-Curcuit Transient Response

(V_OUT=short→open, C_L=120μF)

XC8107xC10xR

V

_IN=5.0V, tr=100μs, Ta=25℃

V_IN=5.0V, tf=100μs, Ta=25℃

FLG=100kΩ, C_IN=1.0μF, C_L=120μF(ceramic)

8.0

FLG=100kΩ, C_IN=1.0μF, C_L=120μF(ceramic)

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

V_OUT= Removed Short circuit

V_OUT= Short circuit to Vss

6.0

4.0

FLG Voltage

Output Voltage

4.0

2.0

Output Voltage

FLG Voltage

0.0

-2.0

-4.0

-2.0

-4.0

-6.0

-8.0

-6.0

Supply Current

-8.0

Time [2ms/div]

(35)ꢀUVLO Transient Response (C_L=1.0μF)

XC8107xxxxxR

V_IN=5.0V→0V, tf=3ms, Ta=25℃

R_L=5Ω, C_IN=C_L=1.0μF(ceramic)

V

_IN=0V→5.0V, tr=3ms, Ta=25℃

R_L=5Ω, C_IN=C_L=1.0μF(ceramic)

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

Input Voltage

4.0

2.0

Output Voltage

0.0

Output Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

(36)ꢀUVLO Transient Response (C_L=120μF)

XC8107xxxxxR

V

_IN=0V→5.0V, tr=3ms, Ta=25℃

V

_IN=5.0V→0V, tf=3ms, Ta=25℃

R_L=5Ω, C_IN=1.0μF, C_L=120μF(ceramic)

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

Output Voltage

Input Voltage

4.0

2.0

Output Voltage

0.0

Input Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

19/27

XC8107 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(37)ꢀReverse Voltage Detected Voltage (C_L=1.0μF)

(38)ꢀReverse Voltage Released Voltage (C_L=1.0μF)

XC8107xxxxxR

VIN=5.0V, R_L=5Ω, Ta=25℃

C_IN=C_L=1.0μF(ceramic)

V

_IN=5.0V, R_L=5Ω, Ta=25℃

C_IN=C_L=1.0μF(ceramic)

8.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

-2.0

8.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

-2.0

V_OUT=5.5V forced

V_OUT= 5.5V Removed

Output Voltage

Input Voltage

4.0

Output Voltage

4.0

Input Voltage

2.0

FLG Voltage

0.0

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

(39)ꢀReverse Voltage Detected Voltage (C_L=120μF)

XC8107xxxxxR

(40)ꢀReverse Voltage Released Voltage (C_L=120μF)

XC8107xxxxxR

V

_IN=5.0V, Ta=25℃

V_IN=5.0V, Ta=25℃

C_IN=1.0μF, C_L=120μF(ceramic)

C

_IN=1.0μF, C_L=120μF(ceramic)

8.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

-2.0

8.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

-2.0

V_OUT= 5.5V Removed

V_OUT=5.5V forced

Output Voltage

Input Voltage

Output Voltage

4.0

Input Voltage

2.0

FLG Voltage

0.0

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

（41）ꢀCE Transient Response

XC8107xxxxxR

V_CE=0→5.0V, tr=5μs, Ta=25℃

V_IN=5.0V, C_IN=C_L=1.0μF(ceramic)

V_IN=5.0V, C_IN=1.0μF, C_L=120μF(ceramic)

8.0

6.0

0.035

0.030

0.025

0.020

0.015

0.010

0.005

0.000

-0.005

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

CE Voltage

4.0

2.0

0.5A type

1.0A type

1.5A type

2.0A type

0.0

0.5A type

1.0A type

1.5A type

2.0A type

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

In Rush Current

Time [500μs/div]

20/27

XC8107

Series

■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(42)ꢀShort Applied

(43)ꢀCurrent Limit adapted time

XC8107xx10xR

V

_IN=5.0V, Ta=25℃

C_L=open

V_IN=5.0V, Ta=25℃

C_L=open

8.0

14.0

12.0

10.0

8.0

15

14

13

12

11

10

9

V_OUT= Short circuit to Vss

6.0

4.0

2.0

Output Voltage

8

7

0.0

6.0

6

5

4

3

2

1

0

-2.0

-4.0

-6.0

-8.0

4.0

2.0

In Rush Current

0.0

-2.0

0.0

1.0

2.0

3.0

4.0

5.0

6.0

Time [2μs/div]

Peak Limit Current [A]

21/27

XC8107 Series

■PACKAGING INFORMATION

●USP-6C (unit:mm)

1.8±0.05

1pin INDENT

0.05

0.30±0.05

(0.1)

(0.50)

0.20±0.05

0.10±0.05

1.4±0.05

●SOT-25 (unit:mm)

22/27

XC8107

Series

■PACKAGING INFORMATION (Continued)

●USP-6C Reference Pattern Layout (unit: mm)

●USP-6C Reference Metal Mask Design (unit: mm)

23/27

XC8107 Series

■PACKAGING INFORMATION (Continued)

●

SOT-25 Power Dissipation

Power dissipation data for the SOT-25 is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as the reference data taken in the following condition.

1. Measurement Condition

40.0

28.9

Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board: Dimensions 40 x 40 mm (1600 mm²in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

(Board of SOT-26 is used)

Material: Glass Epoxy (FR-4)

Thickness: 1.6mm

Through-hole 4 x 0.8 Diameter

1.4

2.54

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient Temperature (105℃)

Board Mount (Tjmax=125℃)

Ambient Temperature (℃)

Power Dissipation Pd (mW)

Thermal Resistance (℃/W)

25

600

120

166.67

105

Pd vs. Ta

Pd-Ta特性グラフ

700

600

500

400

300

200

100

0

25

45

65

85

105

125

周囲温度Ta（℃）

Ambient Temperature: Ta (℃)

24/27

XC8107

Series

■PACKAGING INFORMATION (Continued)

●

USP-6C Power Dissipation

Power dissipation data for the USP-6C is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as the reference data taken in the following condition.

1. Measurement Condition

Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board: Dimensions 40 x 40 mm (1600 mm²in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material: Glass Epoxy (FR-4)

Thickness: 1.6mm

Through-hole 4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient Temperature (105℃)

Board Mount (Tjmax=125℃)

Ambient Temperature (℃)

Power Dissipation Pd (mW)

Thermal Resistance (℃/W)

25

1000

200

100.00

105

Pd vs. Ta

Pd-Ta特性グラフ

1200

1000

800

600

400

200

0

25

45

65

85

105

125

周囲温度Ta（℃）

Ambient Temperature: Ta (℃)

25/27

XC8107 Series

■MARKING RULE

① represents products series

SOT-25

MARK

Z

PRODUCT SERIES

XC8107******-G

5

4

② represents product type

①

②

③

④

⑤

PROTECTION CIRCUIT TYPE

MARK

CE LOGIC

Active High

Active Low

PRODUCT SERIES

XC8107AC****-G

XC8107AD****-G

XC8107BC****-G

XC8107BD****-G

1

2

3

4

Auto-recovery

Latch-off

1

2

3

Auto-recovery

Latch-off

USP-6C

③ represents maximum output current

1

2

3

6

MARK

CURRENT (A)

PRODUCT SERIES

5

4

1

2

3

4

0.5

1.0

1.5

2.0

XC8107**05**-G

XC8107**10**-G

XC8107**15**-G

XC8107**20**-G

④⑤ represents production lot number

01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.

(G, I, J, O, Q, W excluded)

* No character inversion used.

26/27

XC8107

Series

1. The products and product specifications contained herein are subject to change without

notice to improve performance characteristics. Consult us, or our representatives

before use, to confirm that the information in this datasheet is up to date.

2. We assume no responsibility for any infringement of patents, patent rights, or other

rights arising from the use of any information and circuitry in this datasheet.

3. Please ensure suitable shipping controls (including fail-safe designs and aging

protection) are in force for equipment employing products listed in this datasheet.

4. The products in this datasheet are not developed, designed, or approved for use with

such equipment whose failure of malfunction can be reasonably expected to directly

endanger the life of, or cause significant injury to, the user.

(e.g. Atomic energy; aerospace; transport; combustion and associated safety

equipment thereof.)

5. Please use the products listed in this datasheet within the specified ranges.

Should you wish to use the products under conditions exceeding the specifications,

please consult us or our representatives.

6. We assume no responsibility for damage or loss due to abnormal use.

prior permission of TOREX SEMICONDUCTOR LTD.

27/27

型号:	XC8107AC10MR-G
是否Rohs认证：	符合
生命周期：	Active
包装说明：	LSSOP,
Reach Compliance Code：	compliant
风险等级：	5.51
内置保护：	TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
接口集成电路类型：	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码：	R-PDSO-G5
JESD-609代码：	e3
长度：	2.9 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	5
最高工作温度：	105 °C
最低工作温度：	-40 °C
输出电流流向：	SINK
标称输出峰值电流：	1.4 A
封装主体材料：	PLASTIC/EPOXY
封装代码：	LSSOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
座面最大高度：	1.3 mm
最大供电电压：	5.5 V
最小供电电压：	2.5 V
标称供电电压：	5 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	Tin (Sn)
端子形式：	GULL WING
端子节距：	0.95 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	10
断开时间：	130 µs
接通时间：	1000 µs
宽度：	1.6 mm
Base Number Matches：	1

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