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XCL100/XCL101Series

Inductor Built-in Step-up “micro DC/DC” Converter

ETR28004-005

☆GreenOperation Compatible

■GENERAL DESCRIPTION

The XCL100/XCL101 series is a synchronous step-up micro DC/DC converter which integrates an inductor and a control IC

in one tiny package (2.5mm×2.0mm, h=1.0mm). A stable step-up power supply is configured using only two capacitors

connected externally. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble

due to the circuit wiring.

The XCL100/XCL101 series can be used in applications that start from a single alkaline or nickel-metal hydride battery

because the input voltage range is 0.7V ~ 5.5V. The output voltage can be set from 1.8V to 5.0V (±2.0%) in steps of 0.1V.

PFM control enables a low quiescent current, making these products ideal for portable devices that require high efficiency.

The XCL100/XCL101 features a load disconnect function to break continuity between the input and output at shutdown

(A,B Type), and a bypass mode function to maintain continuity between the input and output (C Type).

■FEATURES

■APPLICATIONS

Input Voltage Range

:

Operating hold voltage 0.7V~5.5V

Start-up voltage 0.9V~5.5V

●Wearable devices

●Mobile phones, Smart phones

●Mouses, Keyboards

●Remote controls

Output Voltage Range

Output Current

:

1.8V ~ 5.0V (±2.0%) 0.1V increment

100mA＠VOUT=3.3V, VBAT=1.8V (TYP.)

6.3μA (VBAT=VOUT+0.5V)

PFM Control

Supply Current

Control Method

PFM Switching Current

Functions

●Portable information devices

●Game consoles

350mA

Load Disconnection or

Bypass Mode

C_LDischarge

Output Capacitor

Operating Ambient Temperature

Package

:

Ceramic Capacitor Compatible

-40ºC ~ 85ºC

CL-2025, CL-2025-02

EU RoHS Compliant, Pb Free

Environmentally Friendly

■TYPICALAPPLICATION CIRCUIT

■ TYPICAL PERFORMANCE

CHARACTERISTICS

XCL101C501BR-G

7ꢀL1

100

1

V_SS

NC

6

5

Lx

80

VOUT

CL

10μF

4.2V

3.6V

2

3

VOUT

VBAT

60

V_IN= 3.0V

VCE

CE 4

40

8ꢀL2

VIN

20

CIN

V_OUT=5.0V

10μF

0

0.01

0.1

1

10

100

1000

Output Current:IOUT (mA)

(TOP VIEW)

“L1 and Lx”, “L2 and VBAT” is connected by PCB pattern.

1/25

XCL100/XCL101 Series

■BLOCK DIAGRAM

XCL101A/XCL101C Type

L1

L2

Inductor

L_X

PFM Comparator Unit

C_FBR_FB1

Parasitic Diode

Controller

V_OUT

Current Sense

PFM Controller

V_OUT

PFM

Comparator

R_FB2

Buffer

Driver

and

Inrush

Current

Protection

FB

-

+

V_SS

V_OUT

V_REF

V_DD

V_BAT- V_OUTDetector

CE and Bypass

Controller Logic

CE

V_BAT

* Diodes inside the circuits are ESD protection diodes and parasitic diodes.

XCL101B Type

L1

L_X

L2

Inductor

PFM Comparator Unit

C_FBR_FB1

Parasitic Diode

Controller

V_OUT

Current Sense

PFM Controller

V_OUT

PFM

Comparator

R_FB2

CL

Discharge

Buffer

Driver

and

Inrush

Current

Protection

FB

-

+

V_SS

V_OUT

V_REF

V_DD

V_BAT- V_OUTDetector

CE and Bypass

Controller Logic

CE

V_BAT

* Diodes inside the circuits are ESD protection diodes and parasitic diodes.

2/25

XCL100/XCL101

Series

■BLOCK DIAGRAM

XCL100A/XCL100C Type

L1

L_X

L2

Inductor

PFM Comparator Unit

C_FBR_FB1

Parasitic Diode

Controller

V_OUT

Current Sense

PFM Controller

V_OUT

PFM

Comparator

R_FB2

Buffer

Driver

and

Inrush

Current

Protection

FB

-

+

V_SS

V_OUT

V_REF

V_DD

V_BAT- V_OUTDetector

CE and Bypass

Controller Logic

CE

Hysteresi s UVLO

Comparator

V_BAT

+

-

* Diodes inside the circuits are ESD protection diodes and parasitic diodes.

XCL100B Type

L1

L2

Inductor

L_X

PFM Comparator Unit

C_FBR_FB1

Parasitic Diode

Controller

V_OUT

Current Sense

PFM Controller

V_OUT

PFM

Comparator

R_FB2

CL

Discharge

Buffer

Driver

and

Inrush

Current

Protection

FB

-

+

V_SS

V_OUT

V_REF

V_DD

V_BAT- V_OUTDetector

CE and Bypass

Controller Logic

CE

Hysteresi s UVLO

Comparator

V_BAT

+

-

* Diodes inside the circuits are ESD protection diodes and parasitic diodes.

3/25

XCL100/XCL101 Series

■PRODUCTION CLASSIFICATION

●Ordering Information

(*1)

XCL100①②③④⑤⑥-⑦

PFM control, Without UVLO function

DESIGNATOR

ITEM

SYMBOL

DESCRIPTION

A

B

C

Load Disconnection Without C_LAuto Discharge

Load Disconnection With C_LAuto Discharge

①

Product Type

V_BATBypass Without C_LAuto Discharge

Output Voltage

②③

Output Voltage

18 ~ 50

e.g. V_OUT=3.3V⇒②=3, ③=3

UVLO Function V_{UVLO_R}=1.65V

CL-2025-02 (3,000pcs/Reel)

(*2)

④

UVLO Function

1

⑤⑥-⑦

Packages (Order Unit)

ER-G^(*3)

^(*1)The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.

^(*2)Please contact our sales representatives for UVLO release voltage other than those listed above.

It can be set from 1.65V to 2.2V in 0.05V increments.

^(*3)ER-G is storage temperature range "-40℃ ~ 125 ℃".

(*1)

XCL101①②③④⑤⑥-⑦

PFM control, With UVLO function

DESIGNATOR

ITEM

SYMBOL

DESCRIPTION

A

B

C

Load Disconnection Without C_LAuto Discharge

Load Disconnection With C_LAuto Discharge

V_BATBypass Without C_LAuto Discharge

①

Product Type

Output Voltage

②③

④

Output Voltage

UVLO Function

18 ~ 50

e.g. V_OUT=3.3V⇒②=3, ③=3

1

No UVLO

BR-G^(*2)

ER-G^(*3)

CL-2025 (3,000pcs/Reel)

CL-2025-02 (3,000pcs/Reel)

⑤⑥-⑦

Packages (Order Unit)

^(*1)The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.

^(*2)BR-G is storage temperature range "-40℃ ~ 105 ℃".

^(*3)ER-G is storage temperature range "-40℃ ~ 125 ℃".

4/25

XCL100/XCL101

Series

■PIN CONFIGURATION

7 L1

V_SS

6

1 L_X

NC 5

CE 4

2 V_OUT

3 V_BAT

* If the dissipation pad needs to be connected to other pins, it should be connected

to the V_SSpin.

* Please refer to pattern layout page for the connecting to PCB.

8 L2

(BOTTOM VIEW)

■PIN ASSIGNMENT

PIN NUMBER

PIN NAME

FUNCTIONS

1

2

3

4

5

6

7

8

L_X

V_OUT

V_BAT

CE

NC

V_SS

L1

Switching

Output Voltage

Power Input

Chip Enable

No Connection

Ground

Inductor Electrodes

L2

■CE PIN FUNCTION

PIN NAME

SIGNAL

STATUS

H

L

Operation

CE

A,B Type : Stand-by

C Type : Bypass Mode

* Please do not leave the CE pin open.

■ ABSOLUTE MAXIMUM RATINGS

Ta=25ºC

UNITS

PARAMETER

SYMBOL

RATINGS

V_BATPin Voltage

L_XPin Voltage

V_BAT

V_LX

V_OUT

V_CE

I_LX

-0.3 ~ 7.0

-0.3 ~ V_OUT+ 0.3 or 7.0 ^(*1)

-0.3 ~ 7.0

V

V_OUTPin Voltage

V

CE Pin Voltage

-0.3 ~ 7.0

V

L_XPin Current

700

mA

Power Dissipation

Operating Ambient Temperature

Pd

1000 (40mm x 40mm Standard board) ^(*2)

mW

ºC

Topr

-40 ~+85

-40 ~ 105

CL-2025

Storage

ºC

Tstg

Temperature^(*3)

CL-2025-02

-40 ~ 125

ºC

All voltages are described based on the GND.

^(*1)The maximum value should be either V_OUT+0.3V or 7.0V in the lowest.

^(*2)The power dissipation figure shown is PCB mounted and is for reference only.

Please refer to PACKAGING INFORMATION for the mounting condition.

^(*3)Storage temperature, are divided by the product specification of the package.

5/25

XCL100/XCL101 Series

■ELECTRICAL CHARACTERISTICS

XCL101Axx1/ XCL101Bxx1

Ta=25 ºC

MAX. UNITS CIRCUIT

PARAMETER

Input Voltage

SYMBOL

V_BAT

CONDITIONS

MIN.

-

TYP.

-

5.5

V

-

V_PULL=1.5V, Voltage to start oscillation

while V_OUTis decreasing

(*2)

①

Output Voltage

V_OUT(E)

<E1>

②

Operation Start Voltage

Operation Hold Voltage

V_ST1

V_HLD

I_OUT=1mA

-

0.9

-

V

R_L=1kΩ

0.7

Oscillation stops, V_BAT=V_CE=1.5V

V_OUT=V_OUT(T)^(*1)+0.5V

③

Supply Current

Iq

<E2>

μA

Input Pin Current

Stand-by Current

I_BAT

I_STB

V_OUT=V_OUT(T)^(*1)+0.5V

-

0.25

0.1

1.0

405

6.0

μA

mA

μs

③

④

⑤

②

①

V_BAT=V_LX=V_OUT(T)^(*1), V_OUT=V_CE=0V

I_OUT=3mA

L_XLeak Current

I_LXL

-

0.1

PFM Switching Current

Maximum On Time

I_PFM

295

3.1

350

4.6

t_ONMAX

V_PULL=1.5V, V_OUT=V_OUT(T)^(*1)×0.98V

L_XSW “Pch” ON

Resistance ^(*3)

V_BAT=V_CE=V_LX=V_OUT(E)^(*2)+ 0.5V,

I_OUT=200mA

⑦

⑧

R_LXP

<E3>

0.6

Ω

L_XSW “Nch” ON

Resistance ^(*4)

R_LXN

V_BAT=V_OUT(E)^(*2)=3.3V, V_OUT=1.7V

-

V_BAT=V_PULL=1.5V

V_OUT=V_OUT(T)^(*1)×0.98V

While V_CE= 0.3→0.75V,

Voltage to start oscillation

V_BAT=V_PULL=1.5V

V_OUT=V_OUT(T)^(*1)× 0.98V

While V_CE=0.75 → 0.3V,

Voltage to stop oscillation

CE “H” Voltage

CE “L” Voltage

V_CEH

0.75

-

5.5

V

①

V_CEL

V_SS

0.3

CE “H” Current

CE “L” Current

I_CEH

I_CEL

V_BAT=V_CE=V_LX=V_OUT=5.5V

-0.1

-

0.1

μA

①

V_BAT=V_LX=V_OUT=5.5V, V_CE=0V

CL Discharge

Resistance

(B Type)

R_DCHG

V_BAT=V_OUT=2.0V, V_CE=0V

165

210

254

Ω

③

Inductance Value

L

Test Frequency=1MHz

-

4.7

-

μH

-

(Inductor) Rated Current

I_DC

ΔT=+40℃

700

mA

Unless otherwise stated, V_BAT= V_CE= 1.5V

(*1)

V

=Nominal Output Voltage

=Effective Output Voltage

OUT(T)

(*2)

OUT(E)

The actual output voltage value V_OUT(E)is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output

voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic

example.

^(*3)L_XSW “Pch” ON resistance =(V_LX-V_OUTpin measurement voltage) / 200mA

^(*4)L_XSW “Nch” ONresistance measurement method is shown in the measurement circuit diagram.

6/25

XCL100/XCL101

Series

■ELECTRICAL CHARACTERISTICS (Continued)

XCL101Cxx1

Ta=25 ºC

PARAMETER

Input Voltage

SYMBOL

V_BAT

CONDITIONS

MIN.

-

TYP.

-

MAX. UNITS

CIRCUIT

-

5.5

V

V_PULL=1.5V, Voltage to start oscillation

while V_OUTis decreasing

(*2)

①

Output Voltage

V_OUT(E)

<E1>

Operation Start Voltage

Operation Hold Voltage

V_ST1

V_HLD

I_OUT=1mA

-

0.9

-

V

②

R_L=1kΩ

0.7

Oscillation stops,

V_OUT=V_OUT(T)+0.5V ^(*1)

Supply Current

Iq

<E2>

μA

③

Input Pin Current

Bypass Mode Current

PFM Switching Current

Maximum On Time

I_BAT

I_BYP

V_BAT=V_CE=1.5V, V_OUT=V_OUT(E)^(*2)+0.5V

V_BAT=V_LX=5.5V, V_CE=0V

-

0.25

3.5

1.0

6.1

405

6.0

μA

mA

μs

③

⑥

②

①

-

I_PFM

I_OUT=3mA

295

3.1

350

4.6

t_ONMAX

V_PULL=1.5V, V_OUT=V_OUT(T)^(*1)×0.98V

L_XSW “Pch” ON

Resistance ^(*3)

V_BAT=V_LX=V_CE=V_OUT(E)^(*2)+ 0.5V,

I_OUT=200mA

R_LXP

<E3>

0.6

Ω

⑦

⑧

L_XSW “Nch” ON

Resistance ^(*4)

R_LXN

V_BAT=V_OUT(E)^(*2)=3.3V, V_OUT=1.7V

-

V_BAT=V_PULL=1.5V

V_OUT=V_OUT(T)^(*1)×0.98V

While V_CE=0.3→0.75V,

Voltage to start oscillation

V_BAT=V_PULL=1.5V

V_OUT=V_OUT(T)^(*1)× 0.98V

While V_CE=0.75 → 0.3V,

Voltage to stop oscillation

CE “H” Voltage

V_CEH

0.75

-

5.5

V

①

CE “L” Voltage

V_CEL

V_SS

0.3

①

-

CE “H” Current

CE “L” Current

I_CEH

I_CEL

L

V_BAT=V_CE=V_LX=V_OUT=5.5V

V_BAT=V_LX=V_OUT=5.5V, V_CE=0V

Test Frequency=1MHz

ΔT=+40℃

-0.1

-

0.1

-

μA

μH

mA

-0.1

Inductance Value

-

4.7

700

(Inductor) Rated Current

I_DC

-

Unless otherwise stated, V_BAT= V_CE= 1.5V

(*1)

V

=Nominal Output Voltage

=Effective Output Voltage

OUT(T)

(*2)

OUT(E)

The actual output voltage value V_OUT(E)is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output

voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic

example.

^(*3)L_XSW “Pch” ON resistance =(V_LX-V_OUTpin measurement voltage) / 200mA

^(*4)L_XSW “Nch” ONresistance measurement method is shown in the measurement circuit diagram.

7/25

XCL100/XCL101 Series

■ELECTRICAL CHARACTERISTICS (Continued)

XCL100Axxx/ XCL100Bxxx

Ta=25℃

PARAMETER

Input Voltage

SYMBOL

V_BAT

CONDITIONS

MIN.

TYP.

MAX.

5.5

UNITS

V

CIRCUIT

-

V_PULL=1.5V, Voltage to start oscillation

while V_OUTis decreasing

(*2)

V_OUT(E)

Output Voltage

E1

V

①

②

V_RELEAS

V_ST

I_OUT=1mA

Operation Start Voltage

Operation Hold Voltage

-

(*6)

E(E)

V_DETECT

V_HLD

R_L=1kΩ

-

(*7)

(E)

Iq

Oscillation stops,V_OUT=V_OUT(T)+0.5V ^(*1)

V_OUT=V_OUT(T)+0.5V ^(*1)

V_BAT=V_LX=V_OUT(T)^(*1), V_OUT=V_CE=0V

I_OUT=3mA

Supply Current2

Input Pin Current2

Stand-by Current

L_XLeak Current

E4

E5

μA

mA

③

④

⑤

②

I_BAT

I_STB

I_LXL

I_PFM

-

0.1

350

1.0

405

PFM Switching Current

295

V_PULL=V_RELEASE(T)+0.1V ^(*5)

V_OUT=V_OUT(Ｔ)×0.98 ^(*1)

V_BAT=V_LX=V_CE=V_OUT(T)+0.5V ^(*1)

I_OUT=200mA

,

t_ONMAX

Maximum ON Time

3.1

4.6

E3

0.6

6.0

μs

Ω

①

⑦

⑧

,

L_XSW “Pch” ON

Resistance^(*3)

R_LXP

L_XSW “Nch” ON

Resistance ^(*4)

R_LXN

V_BAT=V_CE=3.3V, V_OUT=1.7V

-

Ω

V_BAT=V_PULL=V_RELEASE(T)+0.1V ^(*5)

V_OUT=V_OUT(Ｔ)×0.98 ^(*1)

,

V_CEH

CE “H” Voltage

0.75

-

5.5

V

①

While V_CE=0.3→0.75V,

Voltage to start oscillation

V_BAT=V_PULL=V_RELEASE(T)+0.1V ^(*5)

V_OUT=V_OUT(Ｔ)×0.98 ^(*1)

,

V_CEL

CE “L” Voltage

V_SS

0.3

While V_CE=0.75→0.3V,

Voltage to stop oscillation

I_CEH

I_CEL

V_BAT=V_CE=V_LX=V_OUT=5.5V

CE “H” Current

CE “L” Current

-0.1

-

0.1

μA

①

V_BAT= V_LX=V_OUT=5.5V, V_CE=0V

CL Discharge Resistance

(B Type)

R_DCHG

I_DQ

V_BAT=V_OUT=2.0V, V_CE=0V

165

210

E6

254

Ω

③

②

V_BAT=V_CE=V_DETECT(E)- 0.1V^(*7)

I_OUT=0mA

,

UVLO Current

μA

V_PULL=V_OUT=V_OUT(T)×0.98 ^(*1),V_BAT=V_CE

Voltage to start oscillation while V_BATis

increasing

V_RELEASE(E)

UVLO Release Voltage

E7

V

①

(*6)

V_PULL=V_OUT=V_OUT(T)×0.98^(*1), V_BAT=V_CE

V_RELEASE(E)-Voltage to stop oscillation

while V_BATis decreasing ^(*6)

(*8)

V_HYS(E)

UVLO Hysteresis Voltage

0.1

0.15

0.2

L

Test Frequency=1.0MHz

Inductance Value

-

4.7

-

μH

-

I_DC

⊿T=+40℃

(Inductor) Rated Current

700

mA

Unless otherwise stated, V_BAT=V_CE= V_RELEASE(T)+0.1V ^(*5)

(*1)

V

=Nominal Output Voltage

=Effective Output Voltage

OUT(T)

(*2)

OUT(E)

The actual output voltage value V_OUT(E)is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output voltage, including

the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic example.

^(*3)LX SW “Pch” ON resistance=(V_LX-V_OUTpin measurement voltage) / 200mA

^(*4)The LX SW “Nch” ON resistance measurement method is shown in the measurement circuit diagram.

(*5)

(*6)

V

= Nominal UVLO release voltage

V

= Actual UVLO release voltage

RELEASE(E)

RELEASE(T)

(*7)

(*8)

= V_RELEASE(E)-V_HYS(E)= Actual UVLO detect voltage

= Actual UVLO hysteresis voltage

HYS(E)

DETECT(E)

8/25

XCL100/XCL101

Series

■ELECTRICAL CHARACTERISTICS (Continued)

XCL100Cxxx

Ta=25℃

PARAMETER

Input Voltage

SYMBOL

V_BAT

CONDITIONS

MIN.

TYP.

MAX.

5.5

UNITS

V

CIRCUIT

-

V_PULL=1.5V, Voltage to start oscillation

while V_OUTis decreasing

(*2)

V_OUT(E)

Output Voltage

E1

V

①

②

V_RELEAS

V_ST

I_OUT=1mA

Operation Start Voltage

Operation Hold Voltage

-

(*6)

E(E)

V_DETECT

V_HLD

R_L=1kΩ

-

(*7)

(E)

Iq

Oscillation stops,V_OUT=V_OUT(T)+0.5V ^(*1)

V_OUT=V_OUT(T)+0.5V ^(*1)

V_BAT=V_LX=5.5V, V_CE=0V

I_OUT=3mA

Supply Current2

Input Pin Current2

E4

E5

μA

mA

③

⑥

②

I_BAT

I_BYP

I_PFM

Bypass Mode Current

PFM Switching Current

-

3.5

350

6.1

295

405

V_PULL=V_RELEASE(T)+0.1V ^(*5)

V_OUT=V_OUT(Ｔ)×0.98 ^(*1)

V_BAT=V_LX=V_CE=V_OUT(T)+0.5V ^(*1)

I_OUT=200mA

,

t_ONMAX

Maximum ON Time

3.1

4.6

E3

0.6

6.0

μs

Ω

①

⑦

⑧

,

L_XSW “Pch” ON

Resistance^(*3)

R_LXP

L_XSW “Nch” ON

Resistance ^(*4)

R_LXN

V_BAT=V_CE=3.3V, V_OUT=1.7V

-

Ω

V_BAT=V_PULL=V_RELEASE(T)+0.1V ^(*5)

V_OUT=V_OUT(Ｔ)×0.98 ^(*1)

,

V_CEH

CE “H” Voltage

CE “L” Voltage

0.75

-

5.5

V

①

While V_CE=0.3→0.75V,

Voltage to start oscillation

V_BAT=V_PULL=V_RELEASE(T)+0.1V ^(*5)

V_OUT=V_OUT(Ｔ)×0.98 ^(*1)

,

V_CEL

V_SS

0.3

While V_CE=0.75→0.3V,

Voltage to stop oscillation

I_CEH

I_CEL

V_BAT=V_CE=V_LX=V_OUT=5.5V

CE “H” Current

CE “L” Current

-0.1

-

0.1

μA

①

V_BAT= V_LX=V_OUT=5.5V, V_CE=0V

V_BAT=V_CE=V_DETECT(E)- 0.1V^(*7)

,

I_DQ

UVLO Current

E6

μA

②

I_OUT=0mA

V_PULL=V_OUT=V_OUT(T)×0.98 ^(*1),V_BAT=V_CE

Voltage to start oscillation while V_BATis

increasing

V_RELEASE(E)

UVLO Release Voltage

E7

V

①

(*6)

V_PULL=V_OUT=V_OUT(T)×0.98^(*1), V_BAT=V_CE

V_RELEASE(E)-Voltage to stop oscillation

while V_BATis decreasing ^(*6)

(*8)

V_HYS(E)

UVLO Hysteresis Voltage

0.1

0.15

0.2

V

①

L

Test Frequency=1.0MHz

Inductance Value

-

4.7

-

μH

-

I_DC

⊿T=+40℃

(Inductor) Rated Current

700

mA

Unless otherwise stated, V_BAT=V_CE= V_RELEASE(T)+0.1V ^(*5)

(*1)

V

=Nominal Output Voltage

=Effective Output Voltage

OUT(T)

(*2)

OUT(E)

The actual output voltage value V_OUT(E)is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output voltage, including

the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic example.

^(*3)LX SW “Pch” ON resistance=(V_LX-V_OUTpin measurement voltage) / 200mA

^(*4)The LX SW “Nch” ON resistance measurement method is shown in the measurement circuit diagram.

(*5)

(*6)

V

= Nominal UVLO release voltage

V

= Actual UVLO release voltage

RELEASE(E)

RELEASE(T)

(*7)

(*8)

= V_RELEASE(E)-V_HYS(E)= Actual UVLO detect voltage

= Actual UVLO hysteresis voltage

HYS(E)

DETECT(E)

9/25

XCL100/XCL101 Series

■ELECTRICAL CHARACTERISTICS (Continued)

SYMBOL

PARAMETER

UNITS:V

E1

E2

E3

E4

L_XSW “Pch” ON

Output Voltage

UNITS:V

Supply Current

UNITS：μA

Supply Current2

UNITS：μA

Resistance

UNITS：Ω

Output

MIN

MAX

TYP

MAX

TYP

0.84

MAX

1.08

TYP.

MAX.

Voltage

1.8

1.9

2.0

2.1

1.764

1.862

1.960

2.058

1.836

1.938

2.040

2.142

6.1

9.4

6.8

9.7

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

5.0

2.156

2.254

2.352

2.450

2.548

2.646

2.744

2.842

2.940

3.038

3.136

3.234

3.332

3.430

3.528

3.626

3.724

3.822

3.920

4.018

4.116

4.214

4.312

4.410

4.508

4.606

4.704

4.802

4.900

2.244

2.346

2.448

2.550

2.652

2.754

2.856

2.958

3.060

3.162

3.264

3.366

3.468

3.570

3.672

3.774

3.876

3.978

4.080

4.182

4.284

4.386

4.488

4.590

4.692

4.794

4.896

4.998

5.100

6.2

9.7

0.75

0.97

6.9

9.8

6.3

6.4

6.5

10.0

10.2

10.4

0.65

0.61

0.57

0.85

0.78

0.74

7.0

7.1

7.2

10.0

10.1

10.2

6.7

10.7

0.53

0.72

7.3

10.3

10/25

XCL100/XCL101

Series

■ELECTRICAL CHARACTERISTICS (Continued)

SYMBOL

E5

E6

E7

E8

UVLO RELEASE

VOLTAGE

UVLO Bypass

Current

PARAMETER Input Pin Current2

UVLO Current

UNITS：μA

UNITS:V

UNITS：μA

UNITS：V

UNITS：μA

UVLO

Release

Voltage

TYP.

MAX.

TYP.

MAX.

MIN.

MAX.

TYP.

MAX.

1.65

1.70

1.75

1.80

1.85

1.90

1.95

2.00

2.05

2.10

2.15

2.20

1.601

1.649

1.698

1.746

1.795

1.843

1.892

1.940

1.989

2.037

2.086

2.134

1.699

1.751

1.802

1.854

1.905

1.957

2.008

2.060

2.111

2.163

2.214

2.266

0.71

0.73

0.75

0.77

0.79

0.82

1.50

1.60

1.70

3.25

3.27

3.29

3.31

3.33

3.35

6.00

6.10

6.20

6.30

2.15

2.20

2.30

2.35

2.40

2.45

4.10

4.20

4.30

4.40

11/25

XCL100/XCL101 Series

■TEST CIRCUITS

L2

V

BAT

OUT

V

BAT

CE

A

NC

V

NC

V

OUT

C_L

C_IN

Rpull

Vpull

GND

Lx

GND

Lx

V

*External components

CIN:4.7μF(Ceramic)

CL:10μF(Ceramic)

Rpull:100 ohm

L1

A

Waveform check point

L2

VBAT

V

BAT

CE

NC

VOUT

NC

V

OUT

L

C_L

A

GND

Lx

GND

L1

Lx

L1

V

A

C_IN

*External components

CIN:4.7μF(Ceramic)

CL:10μF(Ceramic)

R_L

V

Waveform check point

L:4.7μH(Selected goods)

L2

V

BAT

V

BAT

OUT

CE

NC

V

OUT

NC

V

A

GND

Lx

GND

L1

Lx

V

↓

L1

C_IN

*External components

CIN:4.7μF(Ceramic)

L2

V

BAT

OUT

Lx

V

BAT

CE

NC

V

NC

V

OUT

C_L

C_IN

Rpull

V1

GND

L1

Lx

L1

A

Vpull

Waveform check point

*External components

CIN:4.7μF(Ceramic)

CL:10μF(Ceramic)

Rpull:4.7 ohm

<L_XSW “Nch” ON Resistance Measurement Method>

Use Test Circuit No.8 to adjust Vpull so that the LX pin voltage becomes 100mV when the Nch drive Tr is ON and then the

voltage at both ends of Rpull is measured to find the Lx SW "Nch" ON resistance.

RLXN=0.1 / {(V1 - 0.1) / 4.7)}

Note that V1 is the Rpull previous voltage when the Nch driver Tr is ON. Use an oscilloscope or other instrument to measure

the LX pin voltage and V1.

12/25

XCL100/XCL101

Series

■TYPICAL APPLICATION CIRCUIT

7ꢀL1

1

V_SS

NC

6

5

Lx

VOUT

2

3

VOUT

VBAT

CL

10μF

VCE

CE 4

8ꢀL2

VIN

CIN

10μF

(TOP VIEW)

* The embedded coil is optimized for XCL100/XCL101 series. Please do not use for other purposes.

【Recommended External Components】

MANUFACTURE

PRODUCT NUMBER

C1608JB1A106K

VALUE

10μF/10V

22μF/10V

47μF/6.3V

L×W (mm)

1.60 × 0.80

2.00 × 1.25

1.60 × 0.80

2.00 × 1.25

C1608X5R1A106K

C2012JB1A106K

TDK

C2012X5R106K

C_IN,C_L

LMK107BBJ106MALT

LMK212ABJ106KG

LMK212BBJ226MG

JMK212BBJ476MG

TAIYO YUDEN

13/25

XCL100/XCL101 Series

■OPERATION EXPLANATION

The XCL100/XCL101 Series consists of a standard voltage source, a PFM comparator, a Nch driver Tr, a Pch synchronous rectifier switch Tr,

a current sense circuit, a PFM control circuit and a CE control circuit, etc. (refer to the block diagram below.)

L1

L_X

L2

L1

L_X

L2

Inductor

PFM Comparator Unit

C_FBR_FB1

PFM Comparator Unit

C_FBR_FB1

Parasitic Diode

Controller

Parasitic Diode

Controller

V_OUT

Current Sense

PFM Controller

V_OUT

Current Sense

PFM Controller

V_OUT

PFM

Comparator

R_FB2

CL

Discharge

Buffer

Driver

and

Inrush

Current

Protection

PFM

Comparator

R_FB2

CL

Discharge

FB

Buffer

Driver

and

Inrush

Current

Protection

-

FB

-

+

V_SS

+

V_SS

V_OUT

V_REF

V_OUT

V_REF

V_DD

V_BAT- V_OUTDetector

CE and Bypass

Controller Logic

CE

V_DD

V_BAT- V_OUTDetector

Hysteresi s UVLO

Comparator

CE and Bypass

Controller Logic

V_BAT

CE

+

-

V_BAT

< XCL101BType BLOCK DIAGRAM >

< XCL100B Type BLOCK DIAGRAM >

Current limit PFM control is used for the control method to make it difficult for the output voltage ripple to increase even when the switching

current is superimposed, so the product can be used within a wide voltage and current range. Further, because PFM control is used, it has

excellent transient response to support low capacity ceramic capacitors to realize a compact, high-performance boost DC/DC converter.

The synchronous driver and rectifier switch Tr efficiently sends the coil energy to the capacitor connected to the VOUT pin to achieve highly

efficient operation from low to high loads.

The electrical characteristics actual output voltage VOUT(E) is the PFM comparator threshold voltage shown in the block diagram. Therefore, the

booster circuit output voltage average value, including the peripheral components, depends on the ripple voltage, so this must be carefully

evaluated before being used in the actual product.

V_BAT=V_CE=2.0V、V_OUT=3.3V、I_OUT=70mA、L=4.7μH、C_L=10μF、Ta=25℃

V_BAT=V_CE=2.0V、V_OUT=3.3V、I_OUT=20mA、L=4.7μH、C_L=10μF、Ta=25℃

V_LX

V_LX:2V/div

V_OUTVoltage

Average

V_OUTVoltage

V_OUT

V_OUT:50mV/div

I_LX:200mA/div

V_OUT

Average

V_OUT(E)

I_PFM

I_LX

2[μs/div]

< Reference Voltage Source (VREF)>

The reference voltage source (VREF voltage) provides the reference voltage to ensure stable output voltage of the DC/DC converter.

< PFM Control >

①The voltage from the output voltage divided by the division resistors RFB1 and RFB2 in the IC is used as feedback voltage (FB voltage), and the

PFM comparator is compared with the FB voltage and VREF. If the FB voltage is lower than VREF, the signal is sent to the buffer driver via the

PFM control circuit and the Nch driver Tr is turned ON. If the FB voltage is higher than VREF, the PFM comparator sends a signal that does not

turn ON the Nch driver Tr.

②The current sense circuit monitors the current flowing in the Nch driver Tr connected to the Lx pin when the Nch driver Tr is ON. When the

prescribed PFM switching current (IPFM) is reached, the signal is sent to the buffer driver via the PFM control circuit to turn OFF the Nch driver Tr

and turn ON the Pch synchronous rectifier switch Tr.

③The Pch synchronous rectifier switch Tr ON time (off time) is dynamically optimized internally. After the off time has passed, when the PFM

comparator confirms the VOUT voltage has exceeded the set voltage, a signal that does not allow the Nch driver Tr to be turned on is sent from

the PFM comparator to the PFM control circuit, but if the VOUT voltage remains lower than the set voltage, then Nch driver Tr ON is started.

The intervals of the above ①②③ linked operations are continuously adjusted in response to the load current to ensure the output voltage is

kept stable from low to high loads and that it is done with good efficiency.

14/25

XCL100/XCL101

Series

■OPERATION EXPLANATION (Continued)

The PFM switching current unit monitors the current flowing in the Nch driver Tr and functions to limit the current flowing in the Nch driver Tr,

but if the load current becomes much larger than the PFM switching energy, the VOUT voltage becomes lower and prevents the coil current in the

Nch driver Tr OFF period from lowering, which affects the internal circuit delay time and results in an excessive current that is larger than the

PFM switching current flowing in the Nch driver Tr and Pch synchronous rectifier switch Tr.

When "L" voltage is input to the CE pin, the A/B type enters into standby mode and the C type enters into bypass mode to stop the circuit required

for the boost operation. In the standby mode the load cut-off function operates and both the Nch driver Tr and Pch synchronous rectifier switch Tr

are turned OFF, which cuts off the current to the L_Xpin and V_OUTpin and the parasitic diode control circuit connects the parasitic diode cathode of

the Pch synchronous rectifier switch Tr to the L_Xpin ①. In the bypass mode the Nch driver Tr is OFF, the Pch synchronous rectifier switch Tr is

ON when V_LX> V_OUT, and the parasitic diode control circuit connects the parasitic diode cathode of the Pch synchronous rectifier switch Tr to the

V_OUTpin ②. Also, when V_LX< V_OUT, the Pch synchronous rectifier switch Tr is turned OFF and the parasitic diode cathode is connected to the V_OUT

pin ②.

Note: Except for the moment when the V_BATvoltage rises up under a start-up condition.

①

②

Parasitic Diode

Controller

Parasitic Diode

Controller

L_XPin Side

V_OUTPin Side

L_XPin Side

V_OUTPin Side

Buffer Driver

< VBAT-VOUT Voltage Detection Circuit>

The V_BAT-V_OUTvoltage detection circuit compares the V_BATpin voltage with the V_OUTpin voltage, and whichever is the highest is operated to

become the IC power supply (V_DD). In addition, if, during normal operation, the input voltage becomes higher than the output voltage, the Nch

driver Tr is turned OFF and the Pch synchronous rectifier switch Tr is kept ON so that the input voltage passes through to the output voltage

(through mode). When the input voltage becomes lower than the output voltage, the circuit automatically returns to the normal boost operation.

This detection circuit does not operate when in the standby mode.

When the VBAT or VCE power supply is input, CL is charged via the stable current that results from the inrush current protection function (refer to

graphs below). Therefore, this function minimizes potential over current from the VBAT pin to the VOUT pin. Also, this current value depends on the

V_BATvoltage. After CL is charged by the aforementioned stable current and V_OUTreaches around the V_BATvoltage level, the inrush current

protection function will be released after several hundred μs ~ several ms and the IC will then move to step-up mode, bypass mode or through

mode.

Inrush Current Protection Characteristics

300

250

200

150

100

50

600

550

500

450

400

350

300

250

200

0

0.5

1.0

1.5

2.0

2.5

3.0

(V)

3.5

4.0

4.5

5.0

5.5

Input Voltage: V

BAT

15/25

XCL100/XCL101 Series

■OPERATION EXPLANATION (Continued)

The UVLO function is selectable on the XCL100 series as an option. When the V_BATpin voltage falls below the UVLO detect voltage, the IC stops

switching or BYPASS operation and cuts off the current to the L_Xpin and V_OUTpin (UVLO mode). In addition, when the V_BATpin voltage recovers to

above the UVLO release voltage, the IC begins operating again.

<C_LDischarge Function>

With the B Type an optional C_Ldischarge function can be selected. This function uses the Nch Tr connected between V_OUTand GND to discharge,

at high speed, the load capacity C_Lcharge when the "L" voltage is input to the CE pin (when in the IC standby mode). This is done to prevent

malfunction of the application caused by a residual charge in C_Lwhen the IC is stopped.

The discharge time is determined by the C_Ldischarge resistance R_DCHG, including the Nch Tr, and C_L. The constant τ=C_L×R_DCHGis determined at

this time, and the following formula is used to find the output voltage discharge time. However, the C_Ldischarge resistance R_DCHGvaries depending

on the V_BATor V_OUTvoltage, so the discharge time cannot be determined easily.

Therefore, carefully check this in the actual product.

V=V_OUT× e ^{- t /}^τor t=τIn(V_OUT/ V)

V: Output voltage after discharge

V_OUT: Output voltage

ｔ: Discharge time

τ: C_L× R_DCHG

C_L: Capacity value of the load capacitor (C_L)

R_DCHG: Low resistance value of the C_Ldischarge resistance.

However, this changes depending on the voltage.

Output Voltage Discharge characteristics

R_DCHG= 210Ω (TYP.), C_L=10μF

5.5

1.8V

3.3V

5.0V

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0

1

2

3

4

5

6

7

8

9

10

Discharge Time(ms)

16/25

XCL100/XCL101

Series

■NOTE ON USE

1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.

2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected

components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the

characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA

Standard) ceramic capacitor.

3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC

operation to become unstable, so reinforce the area around the GND pin of the IC in particular.

4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance.

5. An excessive current that is larger than the PFM switching current flowing in the Nch driver Tr and Pch synchronous rectifier switch Tr, which

could destroy the IC.

6. When in the bypass mode, the internal Pch synchronous rectifier switch Tr turns ON to allow current to flow to the Lx pin and VOUT pin. When

an excessive current comes from the VOUT pin when this bypass operates, it could destroy the Pch synchronous rectifier switch Tr.

7. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin.

8. The embedded coil is optimized for XCL100/XCL101 series. Please do not use for other purposes.

9. At high temperatures, the product performance could vary causing the efficiency to decline. Evaluate this carefully before use if the product

will be used at high temperatures.

10. Please note that the leak current of the Pch synchronous rectifier switch Tr during high-temperature standby operation could cause the

output voltage to increase.

11. When the voltage difference between V_INand V_OUTis small, switching energy increases and there is a possibility that the ripple voltage

will be too large. And when the ripple voltage becomes big by influence of a load current, please add the C_Lcapacitor.

12. When the booster circuit is activated by a low input voltage, during the time until the output voltage reaches about 1.7V, the PFM switching

current function might not operate causing the coil current to be superimposed. (See the figure below.)

V_BAT=V_CE=0→0.9V、V_OUT=1.8V、I_OUT=1mA、L=4.7μH、C_L=10μF、Ta=25℃

V_OUT

V_BAT=V_CE

V_BAT=V_CE:1.0V/div

V_LX

V_OUT:1.0V/div

V_LX:2.0V/div

I_LX:200mA/div

I_LX

200[μs/div]

V_OUT

V_BAT=V_CE

V_LX

V_BAT=V_CE:1.0V/div

V_OUT:1.0V/div

V_LX:2.0V/div

Zoom

I_LX:200mA/div

I_LX

50[μs/div]

V_BAT=V_CE=0→1.7V、V_OUT=1.8V、I_OUT=1mA、L=4.7μH、C_L=10μF、Ta=25℃

V_OUT

V_BAT=V_CE:1.0V/div

V_OUT:1.0V/div

V_LX:2.0V/div

V_BAT=V_CE

V_LX

I_LX

I_LX:200mA/div

200[μs/div]

V_OUT

V_BAT=V_CE:1.0V/div

V_OUT:1.0V/div

V_LX:2.0V/div

V_BAT=V_CE

V_LX

Zoom

I_LX

I_LX:200mA/div

50[μs/div]

17/25

XCL100/XCL101 Series

■NOTE ON USE (Continued)

13. If the CL capacity or load current becomes excessively large, the output voltage start-up time, when the power is turned on, will increase, so

the coil current might be superimposed during the time it takes for the output voltage to become sufficiently higher than the VBAT voltage.

14. If the input voltage is higher than the output voltage, then the circuit automatically enters the through mode. When the input voltage

becomes close to the output voltage, there could be repeated switching between the boost mode and through mode causing the ripple

voltage to fluctuate. (Refer to the graphic below)

V_BAT=V_CE=3.316V,V_OUT=3.412V,I_OUT=3mA,L=4.7μH,C_L=10μF,Ta=25℃

V_OUT

V_OUT:100mV/div

V_BAT

V_BAT:100mV/div

V_LX

V_LX:2.0V/div

200[μs/div]

15. If a different power supply is connected from an external source to the IC could be destroyed.

Refer to the table below for external voltage availability for each product type and operating conditions.

V

_RELEASE(E)≦V_BAT≦5.5V

0.9V≦V_BAT＜V_RELEASE(E)

V

_BAT＜0.9V

Series/

TYPE

(UVLO Release State)

(UVLO Detect State)

CE="L"

Yes

CE="H"

CE="L"

CE="H"

CE="L" CE="H"

XCL100A

XCL100B

Yes

Applied

Voltage

to the

No

(CL Discharge

Operation)

(CL Discharge

Operation)

(CL Discharge

Operation)

Yes

No

V_OUTpin

No

XCL100C

(Reverse Flow

toward the input)

Yes

0.9V≦V_BAT≦5.5V

V

_BAT＜0.9V

Series/

TYPE

CE="L"

CE="H"

CE="L"

CE="H"

XCL101A

XCL101B

Yes

Applied

Voltage

to the

No

(CL Discharge

Operation)

Yes

No

V_OUTpin

No

XCL101C

(Reverse Flow

toward the input)

16. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded.

17. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-

aging protection treatment when using Torex products in their systems.

18/25

XCL100/XCL101

Series

■NOTE ON USE (Continued)

18. With the A Type, when the VBAT or VCE power supply is input, if the VOUT pin voltage does not exceed VBAT -0.35V, which can happen due to

the load current being more than the inrush protection current, step-up mode or through mode operations won’t function correctly.

19. In the case of products with the UVLO function that do not have C_Ldischarge, the output voltage may occasionally rise due to leakage current

from the Pch synchronous switch Tr when high-temperature UVLO mode operates.

20. The proper position of mounting is based on the coil terminal

●Instruction of pattern layouts

1. In order to stabilize VBAT voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VBAT and ground

pins.

2. Please mount each external component as close to the IC as possible.

3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.

4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of

switching may result in instability of the IC.

5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.

6. As precautions on mounting, please set the mounting position accuracy within 0.05 mm

●Recommended Pattern Layout

TOREX

XCL101

GND

CE

IC

LX

Lx

VIN

CL

GND

VOUT

■About the appearance (coil part)

(1) Coils are compliant with general surface mount type chip coil (inductor) specifications and may have scratches, flux contamination and the

like.

19/25

XCL100/XCL101 Series

■TYPICAL PERFORMANCE CHARACTERISTICS

1) Output Voltage vs. Output Current

XCL101C501BR-G

XCL101C331BR-G

3.7

3.5

3.3

3.1

2.9

5.8

5.4

5.0

4.6

4.2

Ta=25℃

V_IN=1.5V

1.8V

V_IN=3.0V

3.6V

3.0V

4.2V

0.01

0.1

1

10

100

1000

0.01

0.1

1

10

100

1000

Output Current:IOUT (mA)

2) Efficiency vs. Output Current

XCL101C331BR-G

XCL101C501BR-G

100

80

60

40

20

0

100

80

60

40

20

0

4.2V

3.6V

3.0V

1.8V

V_IN= 1.5V

V_IN= 3.0V

Ta=25℃

100 1000

Ta=25℃

0.01

0.1

1

10

0.01

0.1

1

10

100

1000

Output Current:IOUT (mA)

3) Ripple Voltage vs. Output Current

XCL101C331BR-G

XCL101C501BR-G

200

160

120

80

200

160

120

80

Ta=25℃

V_IN=3.0V

3.6V

4.2V

V_IN=1.5V

1.8V

3.0V

40

0

0.01

0.1

1

10

100

1000

0.01

0.1

1

10

100

1000

Output Current:IOUT (mA)

20/25

XCL100/XCL101

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

4) Bypass Voltage vs. Output Current

XCL101C331BR-G

XCL101C501BR-G

3.8

3.7

3.6

3.5

3.4

3.3

3.2

3.1

5.2

5.1

5.0

4.9

4.8

4.7

4.6

4.5

V_IN=5.0V

CE=0V

V_IN=3.6V

CE=0V

-40℃

Ta=25℃

85℃

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Output Current: I_OUT(mA)

5) Load Transient Response

XCL101C331BR-G

I_OUT= 1.0mA→50mA

I_OUT= 50mA→1.0mA

V_OUT

I_OUT=50mA

I_OUTSW

I_OUT=50mA

I_OUT=1.0mA

I_OUTSW

I_OUT=1.0mA

V_BAT=V_CE=1.8V, V_OUT=3.3V, Ta=25℃, C_IN=4.7μF, C_L=10μF

V_OUT:50mV/Div, I_OUTSW:1.0V/Div, Time:20μs

V_BAT=V_CE=1.8V, V_OUT=3.3V, Ta=25℃, C_IN=4.7μF, C_L=10μF

V_OUT:50mV/Div, I_OUTSW:1.0V/Div, Time:20μs

XCL101C501BR-G

I_OUT= 1.0mA→50mA

V_OUT

I_OUTSW

I_OUT=50mA

I_OUT=1.0mA

I_OUTSW

V_BAT=V_CE=3.0V, V_OUT=5.0V, Ta=25℃, C_IN=4.7μF, C_L=10μF

V_OUT:50mV/Div, I_OUTSW:1.0V/Div, Time:20μs

V_BAT=V_CE=3.0V, V_OUT=5.0V, Ta=25℃, C_IN=4.7μF, C_L=10μF

V_OUT:50mV/Div, I_OUTSW:1.0V/Div, Time:20μs

21/25

XCL100/XCL101 Series

■PACKAGING INFORMATION

For the latest package information go to, www.torexsemi.com/technical-support/packages

PACKAGE

CL-2025

OUTLINE / LAND PATTERN

CL-2025 PKG

THERMAL CHARACTERISTICS

CL-2025 Power Dissipation

CL-2025-02

CL-2025-02 PKG

CL-2025-02 Power Dissipation

22/25

XCL100/XCL101

Series

■MARKING RULE

XCL101

① represents products series

MARK

1

PRODUCT SERIES

XCL101******-G

② represents integer portion of the output voltage

1

2

3

6

5

4

XCL101A*****

XCL101C*****

V_OUT(V)

1.x

MARK

V_OUT(V)

1.x

MARK

1

2

3

4

5

B

C

D

E

F

2.x

3.x

4.x

5.x

CL-2025/CL-2025-02

③ represents the decimal part of output voltage

V_OUT(V)

X.0

MARK

PRODUCT SERIES

0

1

2

3

4

5

6

7

8

9

XCL101**0***-G

XCL101**1***-G

XCL101**2***-G

XCL101**3***-G

XCL101**4***-G

XCL101**5***-G

XCL101**6***-G

XCL101**7***-G

XCL101**8***-G

XCL101**9***-G

X.1

X.2

X.3

X.4

X.5

X.6

X.7

X.8

X.9

Example (mark②, ③)

MARK

XCL101A33***-G

XCL101C28***-G

XCL101A50***-G

②

③

②

③

②

③

3

C

8

5

0

④, ⑤ represents production lot number

01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.

(G, I, J, O, Q, W excluded)

* No character inversion used.

23/25

XCL100/XCL101 Series

■MARKING RULE

XCL100

① represents products series

MARK

PRODUCT SERIES

R

S

T

XCL100A**1/2/3/4/5/6/7/8/9/A/B/CE*-G

XCL100B**1/2/3/4/5/6/7/8/9/A/B/CE*-G

XCL100C**1/2/3/4/5/6/7/8/9/A/B/CE*-G

1

2

3

6

5

4

② represents output voltage

MARK

V_OUT(V)

MARK

V_OUT(V)

2.4

MARK

V_OUT(V)

3.0

1

2

3

4

5

6

1.8

3.5

3.6

3.7

3.8

3.9

4.0

7

8

4.1

4.2

4.3

4.4

4.5

4.6

D

E

F

4.7

4.8

4.9

5.0

-

1.9

2.0

2.1

2.2

2.3

2.5

2.6

2.7

2.8

2.9

3.1

3.2

3.3

3.4

9

A

B

C

H

K

CL-2025-02

③ represents output voltage range and UVLO release voltage

Output Voltage

Range

UVLO

MARK

PRODUCT SERIES

XCL100***1**-G

XCL100***2**-G

XCL100***3**-G

XCL100***4**-G

XCL100***5**-G

XCL100***6**-G

XCL100***7**-G

XCL100***8**-G

XCL100***9**-G

XCL100***A**-G

XCL100***B**-G

XCL100***C**-G

Release Voltage

0

1

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.8～3.4V

3.5～5.0V

1.65

1.70

1.75

1.80

1.85

1.90

1.95

2.00

2.05

2.10

2.20

2.15

2

3

4

5

6

7

8

9

A

B

C

D

E

F

H

K

L

M

N

P

R

S

④, ⑤ represents production lot number

01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.

(G, I, J, O, Q, W excluded)

* No character inversion used.

24/25

XCL100/XCL101

Series

1. The product and product specifications contained herein are subject to change without notice to

improve performance characteristics. Consult us, or our representatives before use, to confirm that

the information in this datasheet is up to date.

2. The information in this datasheet is intended to illustrate the operation and characteristics of our

products. We neither make warranties or representations with respect to the accuracy or

completeness of the information contained in this datasheet nor grant any license to any intellectual

property rights of ours or any third party concerning with the information in this datasheet.

3. Applicable export control laws and regulations should be complied and the procedures required by

such laws and regulations should also be followed, when the product or any information contained in

this datasheet is exported.

4. The product is neither intended nor warranted for use in equipment of systems which require

extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss

of human life, bodily injury, serious property damage including but not limited to devices or equipment

used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and

other transportation industry and 5) safety devices and safety equipment to control combustions and

explosions. Do not use the product for the above use unless agreed by us in writing in advance.

5. Although we make continuous efforts to improve the quality and reliability of our products;

nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal

injury and/or property damage resulting from such failure, customers are required to incorporate

adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention

features.

6. Our products are not designed to be Radiation-resistant.

7. Please use the product listed in this datasheet within the specified ranges.

8. We assume no responsibility for damage or loss due to abnormal use.

Semiconductor Ltd in writing in advance.

TOREX SEMICONDUCTOR LTD.

25/25

型号:	XCKU5P-1FFVA676E
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	XILINX INC
包装说明：	BGA, BGA676,26X26,40
Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01
Factory Lead Time：	12 weeks
风险等级：	5.8
JESD-30 代码：	S-PBGA-B676
长度：	27 mm
可配置逻辑块数量：	27120
输入次数：	304
逻辑单元数量：	474600
输出次数：	304
端子数量：	676
最高工作温度：	100 °C
最低工作温度：
组织：	27120 CLBS
封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA
封装等效代码：	BGA676,26X26,40
封装形状：	SQUARE
封装形式：	GRID ARRAY
峰值回流温度（摄氏度）：	NOT SPECIFIED
可编程逻辑类型：	FIELD PROGRAMMABLE GATE ARRAY
座面最大高度：	3.52 mm
最大供电电压：	0.876 V
最小供电电压：	0.825 V
标称供电电压：	0.85 V
表面贴装：	YES
温度等级：	OTHER
端子形式：	BALL
端子节距：	1 mm
端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	27 mm

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