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产品型号XCV300-5BG352C的概述

芯片XCV300-5BG352C的概述芯片XCV300-5BG352C是Xilinx公司推出的一款高性能、灵活的可编程逻辑器件，属于其Virtex系列FPGA（现场可编程门阵列）产品。该系列芯片因其高密度、高性能和多功能性，在遍布通信、网络、汽车、消费电子及工业控制等众多领域得到了广泛应用。XCV300是Virtex FPGA的一部分，专注于以其低功耗和高性能的特性满足复杂应用需求。 XCV300-5BG352C的架构基于Xilinx独特的配置技术，能够支持大量的逻辑门和可编程互连。通过灵活的逻辑单元布局，用户能够配置FPGA以实现不同的数字电路功能，極大地提高了设计的灵活性和效率。同时，该器件还提供了一系列硬件处理功能，如嵌入式存储器和DSP模块等，以支持各类高性能应用。芯片XCV300-5BG352C的详细参数 XCV300-5BG352C的详细技术参数如下： 1. 逻辑单元数...

产品型号XCV300-5BG352C的Datasheet PDF文件预览

Virtex™ 2.5 V

Field Programmable Gate Arrays

DS003-1 (v2.5 ) April 2, 2001

Product Specification

Features

•

Fast, high-density Field-Programmable Gate Arrays

•

Supported by FPGA Foundation™ and Alliance

Development Systems

Densities from 50k to 1M system gates

System performance up to 200 MHz

66-MHz PCI Compliant

Complete support for Unified Libraries, Relationally

Placed Macros, and Design Manager

Wide selection of PC and workstation platforms

Hot-swappable for Compact PCI

SRAM-based in-system configuration

•

Multi-standard SelectIO™ interfaces

Unlimited re-programmability

Four programming modes

16 high-performance interface standards

Connects directly to ZBTRAM devices

•

0.22 m 5-layer metal process

100% factory tested

Built-in clock-management circuitry

Four dedicated delay-locked loops (DLLs) for

advanced clock control

Description

Four primary low-skew global clock distribution

nets, plus 24 secondary local clock nets

The Virtex FPGA family delivers high-performance,

high-capacity programmable logic solutions. Dramatic

increases in silicon efficiency result from optimizing the new

architecture for place-and-route efficiency and exploiting an

aggressive 5-layer-metal 0.22 m CMOS process. These

advances make Virtex FPGAs powerful and flexible alterna-

tives to mask-programmed gate arrays. The Virtex family

comprises the nine members shown in Table 1.

•

Hierarchical memory system

LUTs configurable as 16-bit RAM, 32-bit RAM,

16-bit dual-ported RAM, or 16-bit Shift Register

Configurable synchronous dual-ported 4k-bit

RAMs

Fast interfaces to external high-performance RAMs

Flexible architecture that balances speed and density

Dedicated carry logic for high-speed arithmetic

Dedicated multiplier support

Cascade chain for wide-input functions

Abundant registers/latches with clock enable, and

dual synchronous/asynchronous set and reset

Internal 3-state bussing

Building on experience gained from previous generations of

FPGAs, the Virtex family represents a revolutionary step

forward in programmable logic design. Combining a wide

variety of programmable system features, a rich hierarchy of

fast, flexible interconnect resources, and advanced process

technology, the Virtex family delivers a high-speed and

high-capacity programmable logic solution that enhances

design flexibility while reducing time-to-market.

IEEE 1149.1 boundary-scan logic

Die-temperature sensor diode

Table 1: Virtex Field-Programmable Gate Array Family Members

Maximum

Block RAM

Bits

Maximum

SelectRAM+™ Bits

Device

System Gates

CLB Array

Logic Cells

Available I/O

XCV50

57,906

16x24

1,728

180

260

284

316

404

512

32,768

40,960

49,152

57,344

65,536

81,920

98,304

114,688

131,072

24,576

38,400

55,296

75,264

98,304

153,600

221,184

301,056

393,216

XCV100

XCV150

XCV200

XCV300

XCV400

XCV600

XCV800

XCV1000

108,904

20x30

2,700

164,674

24x36

3,888

236,666

28x42

5,292

322,970

32x48

6,912

468,252

40x60

10,800

15,552

21,168

27,648

661,111

48x72

888,439

56x84

1,124,022

64x96

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

DS003-1 (v2.5 ) April 2, 2001

Product Specification

www.xilinx.com

1-800-255-7778

Module 1 of 4

Virtex™ 2.5 V Field Programmable Gate Arrays

Xilinx thoroughly benchmarked the Virtex family. While per-

formance is design-dependent, many designs operated

internally at speeds in excess of 100 MHz and can achieve

200 MHz. Table 2 shows performance data for representa-

tive circuits, using worst-case timing parameters.

Virtex Architecture

Virtex devices feature a flexible, regular architecture that

comprises an array of configurable logic blocks (CLBs) sur-

rounded by programmable input/output blocks (IOBs), all

interconnected by a rich hierarchy of fast, versatile routing

resources. The abundance of routing resources permits the

Virtex family to accommodate even the largest and most

complex designs.

Table 2: Performance for Common Circuit Functions

Function

Bits

Virtex -6

Virtex FPGAs are SRAM-based, and are customized by

loading configuration data into internal memory cells. In

some modes, the FPGA reads its own configuration data

from an external PROM (master serial mode). Otherwise,

the configuration data is written into the FPGA (Select-

MAP™, slave serial, and JTAG modes).

5.0 ns

7.2 ns

Adder

Pipelined Multiplier

8 x 8

5.1 ns

6.0 ns

16 x 16

The standard Xilinx Foundation™ and Alliance Series™

Development systems deliver complete design support for

Virtex, covering every aspect from behavioral and sche-

matic entry, through simulation, automatic design transla-

tion and implementation, to the creation, downloading, and

readback of a configuration bit stream.

Address Decoder

4.4 ns

6.4 ns

16:1 Multiplexer

Parity Tree

5.4 ns

4.1 ns

5.0 ns

6.9 ns

Higher Performance

Virtex devices provide better performance than previous

generations of FPGA. Designs can achieve synchronous

system clock rates up to 200 MHz including I/O. Virtex

inputs and outputs comply fully with PCI specifications, and

interfaces can be implemented that operate at 33 MHz or 66

MHz. Additionally, Virtex supports the hot-swapping

requirements of Compact PCI.

Chip-to-Chip

HSTL Class IV

200 MHz

180 MHz

LVTTL,16mA, fast slew

Module 1 of 4

www.xilinx.com

1-800-255-7778

DS003-1 (v2.5 ) April 2, 2001

Product Specification

Virtex™ 2.5 V Field Programmable Gate Arrays

Virtex Device/Package Combinations and Maximum I/O

Table 3: Virtex Family Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)

Package

CS144

TQ144

PQ240

HQ240

BG256

BG352

BG432

BG560

FG256

FG456

FG676

FG680

XCV50

XCV100

XCV150

XCV200

XCV300

XCV400

XCV600

XCV800 XCV1000

166

316

180

176

180

176

180

260

180

260

316

404

316

404

512

176

260

176

284

312

404

444

512

444

512

Virtex Ordering Information

Example:

XCV300 -6 PQ 240 C

Device Type

Temperature Range

C = Commercial (T_J= 0 C to +85 C)

I = Industrial (T_J= –40 C to +100 C)

Speed Grade

-4

-5

-6

Number of Pins

Package Type

BG = Ball Grid Array

FG = Fine-pitch Ball Grid Array

PQ = Plastic Quad Flat Pack

HQ = High Heat Dissipation QFP

TQ = Thin Quad Flat Pack

CS = Chip-scale Package

Figure 1: Virtex Ordering Information

DS003-1 (v2.5 ) April 2, 2001

Product Specification

www.xilinx.com

1-800-255-7778

Module 1 of 4

Virtex™ 2.5 V Field Programmable Gate Arrays

Revision History

Date

11/98

01/99

02/99

05/99

07/99

Version

1.0

Revision

Initial Xilinx release.

1.2

Updated package drawings and specs.

1.3

Update of package drawings, updated specifications.

Addition of package drawings and specifications.

Replaced FG 676 & FG680 package drawings.

1.4

1.5

1.6

Changed Boundary Scan Information and changed Figure 11, Boundary Scan Bit

Sequence. Updated IOB Input & Output delays. Added Capacitance info for different I/O

Standards. Added 5 V tolerant information. Added DLL Parameters and waveforms and

new Pin-to-pin Input and Output Parameter tables for Global Clock Input to Output and

Setup and Hold. Changed Configuration Information including Figures 12, 14, 17 & 19.

Added device-dependent listings for quiescent currents ICCINTQ and ICCOQ. Updated

IOB Input and Output Delays based on default standard of LVTTL, 12 mA, Fast Slew Rate.

Added IOB Input Switching Characteristics Standard Adjustments.

09/99

1.7

Speed grade update to preliminary status, Power-on specification and Clock-to-Out

Minimums additions, “0” hold time listing explanation, quiescent current listing update, and

Figure 6 ADDRA input label correction. Added T_IJITCCparameter, changed T_OJITto

T_OPHASE

01/00

03/00

1.8

1.9

2.0

Update to speed.txt file 1.96. Corrections for CRs 111036,111137, 112697, 115479,

117153, 117154, and 117612. Modified notes for Recommended Operating Conditions

(voltage and temperature). Changed Bank information for V_CCOin CS144 package on p.43.

Updated DLL Jitter Parameter table and waveforms, added Delay Measurement

Methodology table for different I/O standards, changed buffered Hex line info and

Input/Output Timing measurement notes.

New TBCKO values; corrected FG680 package connection drawing; new note about status

of CCLK pin after configuration.

05/00

09/00

2.1

2.2

2.3

Modified “Pins not listed ...” statement. Speed grade update to Final status.

Modified Table 18.

•

Added XCV400 values to table under Minimum Clock-to-Out for Virtex Devices.

Corrected Units column in table under IOB Input Switching Characteristics.

Added values to table under CLB SelectRAM Switching Characteristics.

•

Corrected Pinout information for devices in the BG256, BG432, and BG560 packages in

Table 18.

10/00

04/01

2.4

2.5

•

Corrected BG256 Pin Function Diagram.

Revised minimums for Global Clock Set-Up and Hold for LVTTL Standard, with DLL.

Converted file to modularized format. See Virtex Data Sheet section.

Virtex Data Sheet

The Virtex Data Sheet contains the following modules:

•

DS003-1, Virtex 2.5V FPGAs:

Introduction and Ordering Information (Module 1)

•

DS003-3, Virtex 2.5V FPGAs:

DC and Switching Characteristics (Module 3)

•

DS003-2, Virtex 2.5V FPGAs:

Functional Description (Module 2)

DS003-4, Virtex 2.5V FPGAs:

Pinout Tables (Module 4)

Module 1 of 4

www.xilinx.com

1-800-255-7778

DS003-1 (v2.5 ) April 2, 2001

Product Specification

XCV300-5BG352C相关文章

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XCV300-5BG352C产品参数

型号:	XCV300-5BG352C
是否无铅：	含铅
是否Rohs认证：	不符合
生命周期：	Obsolete
零件包装代码：	BGA
包装说明：	BGA-352
针数：	352
Reach Compliance Code：	not_compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.78
Is Samacsys：	N
最大时钟频率：	294 MHz
CLB-Max的组合延迟：	0.7 ns
JESD-30 代码：	S-PBGA-B352
JESD-609代码：	e0
长度：	35 mm
湿度敏感等级：	3
可配置逻辑块数量：	1536
等效关口数量：	322970
输入次数：	260
逻辑单元数量：	6912
输出次数：	260
端子数量：	352
最高工作温度：	85 °C
最低工作温度：
组织：	1536 CLBS, 322970 GATES
封装主体材料：	PLASTIC/EPOXY
封装代码：	LBGA
封装等效代码：	BGA352,26X26,50
封装形状：	SQUARE
封装形式：	GRID ARRAY, LOW PROFILE
峰值回流温度（摄氏度）：	225
电源：	1.2/3.6,2.5 V
可编程逻辑类型：	FIELD PROGRAMMABLE GATE ARRAY
认证状态：	Not Qualified
座面最大高度：	1.7 mm
子类别：	Field Programmable Gate Arrays
最大供电电压：	2.625 V
最小供电电压：	2.375 V
标称供电电压：	2.5 V
表面贴装：	YES
技术：	CMOS
温度等级：	OTHER
端子面层：	Tin/Lead (Sn63Pb37)
端子形式：	BALL
端子节距：	1.27 mm
端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	30
宽度：	35 mm
Base Number Matches：	1

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