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产品型号XGD10402KR的Datasheet PDF文件预览

XTREME-GUARD™ ESD Suppressors  
Surface Mount Polymeric Electrostatic Discharge Suppressors  
XGD Series  
Description  
XTREME-GUARDTM ESD Suppressors protect sensitive  
electronic equipment against extreme ESD conditions, in  
very small 0402 and 0603 footprints. This series product is  
specifically designed to suppress fast-rising ESD transients  
up to 30kV while adding virtually no capacitance to the  
circuit, which helps preserve signal integrity and minimize  
data loss. It is designed as RoHS compliant, halogen free,  
and Pb free.  
Features  
• High ESD Rating up to  
30kV Contact/Air  
Discharge  
• RoHS compliant, lead-free  
and halogen-free  
• Compatible with  
pick-and-place processes  
• Available in 1000, 5000,  
and 10000 piece reels  
(EIA-RS481)  
• Ultra-low capacitance  
• Low leakage current  
• Fast response time  
• Bi-directional  
• High rated voltage up to  
32V maximum  
• High operating  
Equivalent Circuits  
0402 and 0603 Devices  
temperature at 125ºC  
• Withstands multiple  
ESD strikes  
2
1
Applications  
Product Characteristics  
• Wearable Devices  
• Notebooks/Laptops/PCs  
• Gaming Consoles  
• SmartTVs  
• Smart Phones  
Tablets  
• SetTop Boxes  
• Networking and Wireless  
Hardware  
• Stationary and Portable  
Medical Devices  
Lines  
Part Number  
Component  
Package  
Available as  
Halogen-Free  
Protected  
XGD10402  
XGD10603  
1
1
0402  
0603  
Yes  
Yes  
Electrical Characteristics  
Specification  
XGD10402  
XGD10603  
Notes  
The ESD capability measured by direct and air discharge  
method is subject to testing equipment and conditions.  
Numerous factors could affect the reliability and reproducibility  
of the direct and air discharge test results.  
ESD Capability:  
IEC 61000-4-2 Contact Discharge (typical)  
IEC 61000-4-2 Air Discharge (typical)  
30kV  
30kV  
30kV  
30kV  
Trigger Voltage  
Clamping Voltage (typical)  
250V  
40V  
400V  
40V  
Measured per IEC 61000-4-2  
8kV Direct DischargeMethod  
Trigger Voltage (typical)  
Clamping Voltage (typical)  
150V  
40V  
300V  
28V  
Measured using 500VTLP Direct Discharge Method  
Rated Voltage (maximum)  
Capacitance (typical)  
ResponseTime  
24V max  
0.04 pF  
32V max  
0.09 pF  
Measured at 250MHz  
<1nS  
<1nS  
Leakage Current (typical)  
<1nA @24V  
<1nA @24V  
1000  
pulses min  
1000  
pulses min  
Some shifting in characteristics may occur when tested over  
multiple pulses at a very rapid rate  
ESD Pulse Withstand  
Note:  
1. Testing performed on Littelfuse test setup as described inTypicalTest Setup Section on page 4 of this document.  
© 2015 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 09/01/15  
XTREME-GUARD™ ESD Suppressors  
Surface Mount Polymeric Electrostatic Discharge Suppressors  
Signal Integrity: USB3.0 5Gbps  
Without XGD Device  
With XGD Device  
Signal Integrity: USB3.1 10Gbps  
Without XGD Device  
With XGD Device  
Typical Device Capacitance  
Typical ESD Response  
1. 00  
XGD10603  
XGD10402  
0.10  
0.01  
XGD10603  
XGD10402  
100  
1,000  
10,000  
Frequency (MHz)  
© 2015 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 09/01/15  
XTREME-GUARD™ ESD Suppressors  
Surface Mount Polymeric Electrostatic Discharge Suppressors  
Physical Specifications  
Environmental Specifications  
Body: Glass Epoxy  
Terminations: Copper/Nickel/Tin  
OperatingTemperature  
Moisture Resistance  
-65°C to +125°C  
Materials  
0402 and 0603 series:  
85°C, 85% RH, 1000 hours  
40°C, 95% RH, 1000 hours  
Solderability  
MIL-STD-202, Method 208  
Soldering  
Parameters  
Wave solder - 260°C, 10 seconds maximum  
Reflow solder - 260°C, 30 seconds maximum  
MIL-STD-202, Method 107,  
-65°C to 125°C, 30 min. cycle,  
10 cycles  
Thermal Shock  
MIL-STD-202, Method 201, (10  
to 55 to 10 Hz, 1 min. cycle, 2  
hrs each in X-Y-Z)  
Design Consideration  
Vibration  
Because of the fast rise-time of the ESD transient, proper  
placement of XTREME-GUARD™ suppressors are a key  
design consideration to achieving optimal ESD suppression.  
The devices should be placed on the circuit board as close to  
the source of the ESD transient as possible. Install XTREME-  
GUARD™ suppressors (connected from signal/data line  
to ground) directly behind the connector so that they are  
the first board-level circuit component encountered by the  
ESD transient.  
Chemical Resistance  
MIL-STD-202, Method 215  
IPC/EIA J-STD-002  
Solder Leach Resistance and  
Terminal Adhesion  
Soldering Parameters  
Reflow Condition  
-Temperature Min (Ts(min)  
Pb – Free assembly  
150°C  
tP  
)
TP  
Pre Heat -Temperature Max (Ts(max)  
)
200°C  
Ramp-up  
TL  
TS(max)  
-Time (min to max) (ts)  
60 – 180 seconds  
tL  
Average ramp up rate (LiquidusTemp  
(TL) to peak  
3°C/second max  
Ramp-down  
Preheat  
TS(max) toTL - Ramp-up Rate  
3°C/second max  
217°C  
TS(min)  
tS  
-Temperature (TL) (Liquidus)  
Reflow  
-Temperature (tL)  
60 – 150 seconds  
260°C  
25  
time to peak temperature  
PeakTemperature (TP)  
Time  
Time within 5°C of actual peak  
Temperature (tp)  
10 – 30 seconds  
Based on IPC/JEDEC J-STD-020  
Ramp-down Rate  
6°C/second max  
8 minutes max  
Time 25°C to peakTemperature (TP)  
Packaging  
Packaging Specification  
EIA RS-481-1 (IEC 286, part 3)  
EIA RS-481-1 (IEC 286, part 3)  
EIA RS-481-1 (IEC 286, part 3)  
Part Number  
Quantity & Packaging Code  
Quantity  
10000  
1000  
Packaging Option  
Tape & Reel (7” reel)  
Tape & Reel (7” reel)  
Tape & Reel (7” reel)  
XGD10402  
XGD10603  
XGD10603  
KR  
MR  
NR  
5000  
© 2015 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 09/01/15  
XTREME-GUARD™ ESD Suppressors  
Surface Mount Polymeric Electrostatic Discharge Suppressors  
Dimensions  
0402 Device  
0603 Device  
Dimensions: mm (inch)  
Dimensions: mm (inch)  
Reference Dimensions:  
Reference Dimensions:  
1.02 0.05  
(0.040" 0.002")  
1.68 0.08  
(0.066" 0.003")  
0.09 +/- 0.05  
(0.004" 0.002")  
0.19 +/- 0.08  
(0.008" 0.003")  
0.46 0.05  
(0.018" 0.002")  
0.51 0.05  
(0.020" 0.002")  
0.46 0.05  
(0.018" 0.002")  
0.84 0.05  
(0.033" 0.002")  
0.23 0.10  
0.43 0.18  
(0.017" 0.007")  
(0.009" 0.004")  
Reflow Solder Only  
Reꢀow Solder  
Wave Solder  
0.76 (0.030")  
0.381 (0.015")  
0.51 (0.020")  
1.55  
(0.061")  
3.30  
(0.130")  
3.05  
(0.120")  
.584 (0.023")  
1.27 (0.050")  
0.76 (0.030")  
1.27 (0.050")  
0.76 (0.030")  
0.559 (0.022")  
Recommended Pad Layout  
Tape and Reel Specifications  
0603 Series  
0402 Series  
Tt  
Ds  
Description  
Dd  
(mm)  
0.05  
1.50  
4.00  
0.58  
1.85  
4.00  
1.02  
0.65  
8.00  
(mm)  
0.05  
1.50  
4.00  
0.56  
1.14  
Ct - Cover tape thickness  
Dd - Drive hole diameter  
Ds - Drive hole spacing  
Pd - Pocket depth  
Tw  
Ph  
Pd  
Pw  
Ph - Pocket height  
Ps  
Ct  
Ps - Pocket spacing  
2.00  
0.62  
0.65  
8.00  
Pw - Pocket width  
Tt - Carrier tape thickness  
Tw - Carrier tape width  
TypicalTest Setup  
Part Numbering System  
FARADAY CAGE  
XGD 1 0603 NR  
COMPUTER  
AGILENT INFINIIUM  
1.5 GHz 8 GS/s  
QUANTITY &  
PACKAGING CODE:  
MR = 1000 pieces, tape & reel  
NR = 5000 pieces, tape & reel  
KR = 10,000 pieces, tape & reel  
LEAD-FREE  
XTREME-GUARD™  
ESD SUPPRESSORS  
30dB PASTERNAK ATTENUATOR  
PE7025-30  
TEKTRONIX LOW CAP PROBE  
6158 (20xTIP)  
LINES PROTECTED:  
1 = 1 line  
DEVICE SIZE CODE:  
0402 = 0402 (1005)  
0603 = 0603 (1608)  
QUADTECH 1865  
RESISTANCE METER  
RESISTANCE  
TEST FIXTURE  
ESDTEST FIXTURE  
TEST BOARD W/ DUT  
ESD PULSE GENERATOR  
© 2015 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 09/01/15  
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