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Specification

SSC-YGUR302TM

(Rev 1.0, General)

SSC

Customer

Drawn

Approval

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

[ Contents ]

1. Absolute maximum ratings

2. Electro-optical characteristics

3. Characteristic diagram

4. Soldering profile

5. Outline dimension

6. Packing

7. Reel packing structure

8. Precaution for use

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

SSC-YGUR302TM

Features

SSC-YGUR302TM

Description

-

Small size suitable for compact

appliances

• 3.0 X 2.5 X 1.4 mm

• Untinted, Inner lens type

Surface-mounted and leadless chip

LED device

clear old

• Wavelength :

Yellow-Green - 571 nm

Red - 638 nm (Red)

-

Tape and Reel packing

Increases the life time of battery

Applications

• Indicator

• Other decoration

lighting

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

1. Absolute maximum ratings

(Ta=25℃)

Parameter

Symbol

Value

66

Unit

Power Dissipation

Forward Current

P_d

I_F

mW

mA

V

30

*1

Peak Forward Current

Reverse Voltage

I_FM

60

5

V_R

Operation Temperature

Storage Temperature

T_opr.

T_stg.

-30 ~ 85

-40 ~ 100

℃

*1 I_FMconditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10

2. Electro-Optical Characteristics

(Ta=25℃)

Parameter

Symbol

Condition

Color

Min

Typ

2.0

1.7

-

Max

Unit

YG

RED

YG

-

2.5

2.2

1.8

100

130

120

-

V_F

I_F=20 ㎃

-

1.3

-

Forward Voltage

V

V_FM

I_F=1 uA

V_R=5V

RED

YG

-

Reverse Current

Luminous Intensity^*2

Wavelength

I_R

㎂

RED

YG

-

60

50

-

I_V

I_F=20 ㎃

mcd

nm

RED

YG

-

571

638

30

60

λ_D

RED

YG

-

Spectral Bandwidth

Viewing Angle^*3

Δλ

2θ_1/2

nm

RED

YG

-

˚

RED

-

*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the

LED package.

*3 θ_1/2is the off-axis where the luminous intensity is 1/2 the peak intensity.

[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at

20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.

(Tolerance : I_v±10 %, λ_D±2 nm, V_F±0.1 V)

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

3. Characteristic Diagram

Forward Current vs Forward Voltage

Relative Intensity vs Forward Current

100

10

1

250

200

150

100

50

YG

UR

YG

UR

0

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

2.4

0

5

10

15

20

25

30

35

40

45

50

55

Forward Voltage [V]

Forward Current I_F(mA)

Forward Current vs Derating Curve

Radiation Diagram

40

35

30

25

20

15

10

5

YG

UR

90

1.0

120

60

0.8

0.6

0.4

0.2

30

150

0

.

0

180

0

-25

0

25

50

75

100

Ambient temperature Ta(^oC)

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

4. Soldering profile

Reflow Soldering Conditions/ Profile

(1) Lead Solder

• Preliminary heating to be at 150℃max. for 2 minutes max.

• Soldering heat to be at 240℃max. for 5 seconds max.

(2) Lead-Free Solder

• Preliminary heating to be at 150℃max. for 2 minutes max.

• Soldering heat to be at 260℃max. for 10 seconds max.

(3) Hand Soldering Condition

• Not more than 3 seconds @MAX280℃, under Soldering iron.

[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

5. Outline Dimension

Tolerance: ±0.1, Unit: ㎜

1.4

2.5

1.4^±0.1

ٛٛٛ

Cathode

Polarity Mark

1.5

0.6 ^±0.1

0.9

(0.5)

0.9

Cathode

②

①

Yellow

Green

②

①

Red

Resin

P. C. B

Anode

Lens

④

③

0.8

1.8

0.6

④

③

0.5min

Anode

[Recommended Solder pattern]

6. Packing

4.0±0.1

0.25±0.05

2.0±0.05

+0.1

-0

1.5

YG UR

4.0±0.1

?1.1±0.

11.4

9^±0.3

180

- 3

+ 0

2^±0.2

22

13 ^±0.2

Label

Tolerance: ±0.2, Unit: ㎜

(1) Quantity:2,500pcs./Reel

(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm

(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is

turned off from the carrier tape at10˚angle to be the carrier tape.

(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof

Package.

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

7. Reel Packing Structure

Reel

P/ N: ##########

##

제품명 : SSC-YGUR302TM

Lot No ##########

수량 : 2500

Aluminum Vinyl Bag

P/ N: ##########

##

제품명 : SSC-YGUR302TM

Lot No ##########

수량 : 2500

Outer Box

*Material: Paper(SW3B(B))

SIZE(mm)

TYPE

a

c

b

7inch 245 220 142

c

CHIP LED

PART : SSC-YGUR302TM

CODE

:

CHIP LED

a

Q'YT : 25,000EA

LOT NO :

b

DATE

:

SEOUL SEMICONDUCTOR CO.,LTD

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

8. Precaution for Use

(1) Storage

In order to avoid the absorption of moisture, it is recommended to store in the dry box (or

desiccator) with a desiccant. Otherwise, to store them in the following environment is

recommended.

Temperature : 5℃~30℃ Humidity : 60%HR max.

(2) Attention after opened

However LED is corresponded SMD, when LED be soldered dip, interfacial separation may

affect the light transmission efficiency, causing the light intensity to drop. Attention in followed.

a. After opened and mounted, the soldering shall be quickly.

b. Keeping of a fraction

Temperature : 5 ~ 40℃

Humidity : less than 30%

(3) In case of more than 1 week passed after opening or change color of indicator on desiccant

components shall be dried 10-12hr. at 60±5℃.

(4) In case of supposed the components is humid, shall be dried dip-solder just before.

100Hr at 80±5℃ or 12Hr at 100±5℃.

(5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling

process to normal temp. after soldering.

(6) Quick cooling shall not be avoid.

(7) Components shall not be mounted on warped direction of PCB.

(8) Anti radioactive ray design is not considered for the products listed here in.

(9) Gallium arsenide is used in some of the products listed in this publication. These products are

dangerous if they are burned or smashed in the process of disposal. It is also dangerous to

drink the liquid or inhale the gas generated by such products when chemically disposed.

(10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.

When washing is required, IPA should be used.

(11) When the LEDs are illuminating, operating current should be decided after considering the

ambient maximum temperature.

(12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or

more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be

used for storage.

(13) The LEDs must be soldered within seven days after opening the moisture-proof packing.

(14) Repack unused products with anti-moisture packing, fold to close any opening and then

store in a dry place.

(15) The appearance and specifications of the product may be modified for improvement without

notice.

SSC-YGUR302TM

Revision 1.0

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

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