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  • 深圳市芯脉实业有限公司

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  • 深圳市芯脉实业有限公司

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  • 北京齐天芯科技有限公司

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  • 深圳市芯福林电子有限公司

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  • 深圳市芯福林电子有限公司

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  • 深圳市创思克科技有限公司

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  • 深圳市芯脉实业有限公司

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  • ZLLS2000TA
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  • 封装SOT-23 (SC-59,TO-236) 
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  • 深圳市芳益电子科技有限公司

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  • 封装SOT23-6 
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产品型号ZLLS2000TA的概述

芯片ZLLS2000TA的概述 ZLLS2000TA是一款多功能集成电路芯片,广泛应用于低功耗无线通信与控制系统中。它专门设计用于智能家居、物联网设备及便携式电子产品。该芯片以可靠的性能、高度的集成性以及易于开发的特点,满足了行业对小型化、低功耗系统的需求。ZLLS2000TA不仅支持多种通信协议,还提供了丰富的接口与灵活的操作模式,帮助工程师减少开发时间,提升产品市场竞争力。 芯片ZLLS2000TA的详细参数 ZLLS2000TA的主要参数如下: - 工作电压范围:2.0V至3.6V - 工作温度范围:-40°C至85°C - 功耗:待机模式下功耗低至几微安,工作模式下功耗在数十毫安。 - 数据速率:最高可达256kbps - 无线标准:支持Zigbee、LoRa及其他自定义协议 - 内存:128KB闪存,32KB RAM - 射频频率:2400MHz至2483.5MHz(ISM频...

产品型号ZLLS2000TA的Datasheet PDF文件预览

ZLLS2000  
40V SILICON HIGH CURRENT LOW LEAKAGE SCHOTTKY DIODE  
SUMMARY  
Schottky Diode V = 40V; I = 2.2A; I = 40 A  
R
F
R
DESCRIPTION  
This compact SOT23-6 packaged Schottky diode offers users an excellent  
performance combination comprising high current operation, extremely low leakage  
and low forward voltage ensuring suitability for applications requiring efficient  
operation at higher temperatures ( above 85ЊC) see Operational Efficiency chart on  
page 4.  
Key benefits:  
Performance capability equivalent to much larger packages  
Improved circuit efficiency & power levels  
PCB area savings  
FEATURES  
Low equivalent on resistance  
Extremely low leakage (40A @30V)  
High current capability (IF = 2.2A)  
Low VF, fast switching Schottky  
SOT23-6 package  
ZLLS2000 complements low temperature equivalent ZHCS2000  
Package thermally rated to 150ЊC  
APPLICATIONS  
DC - DC converters  
Strobes  
Mobile phones  
Charging circuits  
Motor control  
ORDERING INFORMATION  
DEVICE  
REEL  
TAPE WIDTH  
QUANTITY  
PER REEL  
(inches) (mm)  
ZLLS2000TA  
7
8mm embossed 3000 units  
8mm embossed 10000 units  
ZLLS2000TC 13  
Top view  
DEVICE MARKING  
LL20  
ISSUE 4 - APRIL 2007  
1
SEMICONDUCTORS  
ZLLS2000  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
VALUE  
UNIT  
Schottky Diode  
Continuous reverse voltage  
Forward current  
VR  
IF  
40  
V
A
A
2.2  
3.55  
Peak repetitive forward current  
Rectangular pulse duty cycle  
IFPK  
Non repetitive forward current  
t=Յ100s  
t=Յ10ms  
IFSM  
36  
12  
A
A
Package  
Power dissipation at Tamb=25ЊC  
single die continuous  
single die measured at t<5 secs  
Storage temperature range  
Junction temperature  
PD  
1.1  
W
W
ЊC  
ЊC  
1.71  
Tstg  
-55 to +150  
150  
Tj  
THERMAL RESISTANCE  
PARAMETER  
SYMBOL  
RJA  
VALUE  
113  
UNIT  
Junction to ambient (a)  
Junction to ambient (b)  
°C/W  
°C/W  
RJA  
73  
Notes  
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,  
in still air conditions.  
(b) For a device surface mounted on FR4 PCB measured at t<5secs.  
ISSUE 4 - APRIL 2007  
2
SEMICONDUCTORS  
ZLLS2000  
TYPICAL CHARACTERISTICS  
ISSUE 4 - APRIL 2007  
3
SEMICONDUCTORS  
ZLLS2000  
ELECTRICAL CHARACTERISTICS (at T  
= 25°C unless otherwise stated)  
amb  
SCHOTTKY DIODE CHARACTERISTICS  
PARAMETER  
Reverse breakdown voltage V(BR)R  
Forward voltage VF  
SYMBOL MIN. TYP.  
MAX.  
UNIT  
V
CONDITIONS  
IR=1mA  
40  
260  
290  
322  
345  
395  
440  
475  
550  
465  
25  
-
mV  
mV  
mV  
mV  
mV  
mV  
mV  
mV  
IF=50 mA*  
-
IF=100 mA*  
IF=250mA*  
-
370  
430  
490  
540  
640  
IF=500mA*  
IF=1000mA*  
IF=1500mA*  
IF=2000mA*  
IF=3000mA*  
IF=2000mA*,Ta = 100ЊC  
VR=30V  
Reverse current  
IR  
40  
A  
mA  
pF  
1.7  
65  
VR=30V, Ta=85ЊC  
f=1MHz,VR=30V  
Diode capacitance  
CD  
trr  
Reverse recovery time  
Reverse recovery charge  
6
ns  
Switched from  
IF = 500mA to VR = 5.5V  
Measured @ IR 50mA.  
di / d t > 500mA / ns.  
Rsource = 6; Rload= 10⍀  
Qrr  
685  
pC  
*Measured under pulsed conditions. Pulse width=300µs. Duty cycle 2%  
Operational efficiency chart  
The operational efficiency chart indicates the beneficial use of the ZLLS series diodes in applications requiring  
higher voltage, higher temperature operation. Circuits requiring low voltage low temperature operation will  
benefit from using Zetex low VF ZHCS series diodes.  
ISSUE 4 - APRIL 2007  
4
SEMICONDUCTORS  
ZLLS2000  
TYPICAL CHARACTERISTICS  
ISSUE 4 - APRIL 2007  
5
SEMICONDUCTORS  
ZLLS2000  
Definitions  
Product change  
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service.  
Customers are solely responsible for obtaining the latest relevant information before placing orders.  
Applications disclaimer  
The circuits in thisdesign/application note are offered as design ideas. It is the responsibility ofthe user toensure thatthe circuit is fitforthe user's  
application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with  
respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or  
otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence),  
breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use  
of these circuit applications, under any circumstances.  
Life support  
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written  
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body  
or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions  
for use provided in the labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Reproduction  
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in  
writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating  
to the products or services concerned.  
Terms and Conditions  
All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the  
terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.  
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.  
Quality of product  
Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.  
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally  
authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork  
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales  
channels.  
ESD (Electrostatic discharge)  
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The  
possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage  
can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of  
being affected should be replaced.  
Green compliance  
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory  
requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of  
hazardous substances and/or emissions.  
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and  
ELV directives.  
Product status key:  
"Preview"Future device intended for production at some point. Samples may be available  
"Active"Product status recommended for new designs  
"Last time buy (LTB)"Device will be discontinued and last time buy period and delivery is in effect  
"Not recommended for new designs"Device is still in production to support existing designs and production  
"Obsolete"Production has been discontinued  
Datasheet status key:  
"Draft version"This term denotes a very early datasheet version and contains highly provisional  
information, which may change in any manner without notice.  
"Provisional version"This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to  
the test conditions and specifications may occur, at any time and without notice.  
"Issue"This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and  
without notice.  
ISSUE 4 - APRIL 2007  
6
SEMICONDUCTORS  
ZLLS2000  
PACKAGE DIMENSIONS  
PAD LAYOUT DETAILS  
DIM  
Millimeters  
Min.  
Max.  
1.45  
0.15  
1.30  
0.50  
0.26  
3.10  
3.20  
1.80  
0.60  
A
A1  
A2  
b
0.90  
0.00  
0.90  
0.20  
0.09  
2.70  
2.20  
1.30  
0.10  
C
D
E
E1  
L
e
0.95 REF  
1.90 REF  
30Њ  
e1  
0Њ  
© Zetex Semiconductors plc 2007  
Europe  
Americas  
Asia Pacific  
Corporate Headquarters  
Zetex Semiconductors plc  
Zetex GmbH  
Zetex Inc  
Zetex (Asia) Ltd  
Kustermann-Park  
Balanstraße 59  
D-81541 München  
Germany  
700 Veterans Memorial Hwy  
Hauppauge, NY 11788  
USA  
3701-04 Metroplaza Tower 1  
Hing Fong Road, Kwai Fong  
Hong Kong  
Zetex Technology Park  
Chadderton, Oldham, OL9 9LL  
United Kingdom  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
europe.sales@zetex.com  
Telephone: (1) 631 360 2222  
Fax: (1) 631 360 8222  
usa.sales@zetex.com  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
asia.sales@zetex.com  
Telephone (44) 161 622 4444  
Fax: (44) 161 622 4446  
hq@zetex.com  
These offices are supported by agents and distributors in major countries world-wide.  
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced  
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company  
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.  
For the latest product information, log on to www.zetex.com  
ISSUE 4 - APRIL 2007  
7
SEMICONDUCTORS  
配单直通车
ZLLS2000TA产品参数
型号:ZLLS2000TA
是否Rohs认证: 符合
生命周期:Transferred
IHS 制造商:ZETEX PLC
包装说明:R-PDSO-G6
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8541.10.00.80
风险等级:5.39
应用:EFFICIENCY
配置:SINGLE
二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE
JESD-30 代码:R-PDSO-G6
JESD-609代码:e3
湿度敏感等级:1
最大非重复峰值正向电流:36 A
元件数量:1
相数:1
端子数量:6
最大输出电流:2.2 A
封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
最大功率耗散:1.1 W
认证状态:Not Qualified
最大反向恢复时间:0.006 µs
表面贴装:YES
技术:SCHOTTKY
端子面层:Matte Tin (Sn)
端子形式:GULL WING
端子位置:DUAL
处于峰值回流温度下的最长时间:40
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