PLUS
ProASIC
Flash Family FPGAs
Device Resources
User I/Os2
Commercial/Industrial
Military/MIL-STD-883B
CCGA/
3
3
3
3
3
3
3
3
3
3
TQFP
TQFP
PQFP
PBGA FBGA FBGA FBGA FBGA FBGA
FBGA
CQFP
CQFP
LGA
Device
APA075
APA150
APA300
APA450
APA600
APA750
APA1000
Notes:
100-Pin 144-Pin 208-Pin 456-Pin 144-Pin 256-Pin 484-Pin 676-Pin 896-Pin 1152-Pin 208-Pin 352-Pin 624-Pin
66
66
107
158
158
158 5
100
100
242
290 5
344
186 4
100 5 186 4, 5
100
186 4
186 4, 5 370 4
158
158
158
248
248
248
158
344 4
158 5
158
356 5
454
454
440
440
356
562 6
642 5, 6 712 6
158 5
356 5
1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid
Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array
2. Each pair of PECL I/Os is counted as one user I/O.
3. Available in RoHS compatible packages. Ordering code is "G."
4. FG256 and FG484 are footprint-compatible packages.
5. Military Temperature Plastic Package Offering
6. FG896 and FG1152 are footprint-compatible packages.
General Guideline
Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee
performance beyond the limits specified within the datasheet.
v5.9
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ACTEL [ Actel Corporation ]
