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ADSP-2189MKST-300 参数 Datasheet PDF下载

ADSP-2189MKST-300图片预览
型号: ADSP-2189MKST-300
PDF下载: 下载PDF文件 查看货源
内容描述: 微电脑DSP [DSP Microcomputer]
分类和应用: 电脑
文件页数/大小: 32 页 / 243 K
品牌: ADI [ ADI ]
 浏览型号ADSP-2189MKST-300的Datasheet PDF文件第12页浏览型号ADSP-2189MKST-300的Datasheet PDF文件第13页浏览型号ADSP-2189MKST-300的Datasheet PDF文件第14页浏览型号ADSP-2189MKST-300的Datasheet PDF文件第15页浏览型号ADSP-2189MKST-300的Datasheet PDF文件第17页浏览型号ADSP-2189MKST-300的Datasheet PDF文件第18页浏览型号ADSP-2189MKST-300的Datasheet PDF文件第19页浏览型号ADSP-2189MKST-300的Datasheet PDF文件第20页  
ADSP-2189M  
FREQUENCY DEPENDENCY FOR TIMING  
Output Drive Currents  
SPECIFICATIONS  
Figure 14 shows typical I-V characteristics for the output drivers  
on the ADSP-2189M. The curves represent the current drive  
capability of the output drivers as a function of output voltage.  
tCK is defined as 0.5tCKI. The ADSP-2189M uses an input clock  
with a frequency equal to half the instruction rate: a 37.50 MHz  
input clock (which is equivalent to 28 ns) yields a 13 ns proces-  
sor cycle (equivalent to 75 MHz). tCK values within the range of  
0.5tCKI period should be substituted for all relevant timing pa-  
rameters to obtain the specification value.  
80  
V
60  
40  
OH  
V
= 3.6V @ 40؇C  
= 3.3V @ +25؇C  
DDEXT  
Example: tCKH = 0.5tCK – 7 ns = 0.5 (15 ns) – 7 ns = 0.5 ns  
V
DDEXT  
20  
ENVIRONMENTAL CONDITIONS1  
V
= 2.5V @ +85؇C  
DDEXT  
0
Rating Description  
Symbol  
Value  
20  
40  
V
= 3.6V @ 40؇C  
DDEXT  
Thermal Resistance  
(Case-to-Ambient)  
(Junction-to-Ambient)  
(Junction-to-Case)  
θCA  
θJA  
θJC  
48°C/W  
50°C/W  
2°C/W  
V
= 2.5V @ +85؇C  
DDEXT  
V
OL  
V
= 3.3V @ +25؇C  
DDEXT  
60  
80  
NOTE  
1Where the ambient temperature rating (TAMB) is:  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
SOURCE VOLTAGE V  
TAMB = TCASE – (PD × θCA  
)
TCASE = Case temperature in °C  
Figure 14. Typical Output Driver Characteristics  
PD = Power dissipation in W.  
POWER DISSIPATION  
To determine total power dissipation in a specific application,  
the following equation should be applied for each output:  
C × VDD2 × f  
C = load capacitance, f = output switching frequency.  
Example:  
In an application where external data memory is used and no  
other outputs are active, power dissipation is calculated as follows:  
Assumptions:  
External data memory is accessed every cycle with 50% of  
the address pins switching.  
External data memory writes occur every other cycle with  
50% of the data pins switching.  
Each address and data pin has a 10 pF total load at the pin.  
The application operates at VDDEXT = 3.3 V and tCK = 15 ns.  
Total Power Dissipation = PINT + (C × VDDEXT2 × f)  
P
INT = internal power dissipation from Power vs. Frequency  
graph (Figure 15).  
(C × VDDEXT2 × f) is calculated for each output:  
# of  
Pins C  
؋
؋
؋
f
2
Parameters  
VDDEXT  
PD  
Address, DMS  
Data Output, WR 9  
RD  
CLKOUT  
8
10 pF 3.32 V  
10 pF 3.32 V  
10 pF 3.32 V  
10 pF 3.32 V  
33.3 MHz  
16.67 MHz 16.3 mW  
16.67 MHz  
33.3 MHz  
29.0 mW  
1
1
1.8 mW  
3.6 mW  
50.7 mW  
Total power dissipation for this example is PINT + 50.7 mW.  
16–  
REV. A