OR3T80-6PS240 参数 Datasheet PDF下载

ORCA

Series 3C and 3T FPGAs

Data Sheet

June 1999

Package Outline Diagrams

(continued)

256-Pin PBGA

Dimensions are in millimeters.

27.00

±

0.20

A1 BALL

IDENTIFIER ZONE

+0.70

24.00 –0.00

+0.70

24.00 –0.00

27.00

±

0.20

MOLD

COMPOUND

PWB

0.36

±

0.04

1.17

±

0.05

2.13

±

0.19

SEATING PLANE

0.20

0.60

±

0.10

SOLDER BALL

19 SPACES @ 1.27 = 24.13

Y

W

V

U

T

R

P

N

M

L

K

J

H

G

F

E

D

C

B

A

1 2 3 4 5 6 7 8 9 10

11

12

13

14

15

16

17

18

19

20

0.75

±

0.15

19 SPACES

@ 1.27 = 24.13

CENTER ARRAY

FOR THERMAL

ENHANCEMENT

(OPTIONAL)

(SEE NOTE BELOW)

A1 BALL

CORNER

5-4406(F)

Note: Although the 16 thermal enhancement balls are stated as an option, they are standard on the 256 FPGA package.

202

Lucent Technologies Inc.