4
6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount)
9.65 ± 0.25
(0.380 ± 0.010)
PAD LOCATION (FOR REFERENCE ONLY)
TYPE NUMBER
6.35 ± 0.25
(0.250 ± 0.010)
HP RXXXX
YYWW
DATE CODE
4.826
(0.190)
TYP.
9.398 (0.370)
9.906 (0.390)
1.194 (0.047)
1.778 (0.070)
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.381 (0.015)
0.635 (0.025)
1.78
(0.070)
MAX.
4.19
MAX.
(0.165)
0.635 ± 0.130
(0.025 ± 0.005)
0.20 (0.008)
0.30 (0.013)
2.29
(0.090)
2.54
(0.100)
TYP.
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
[3] [5]
DIMENSIONS IN mm (INCHES)
TOLERANCES: xx.xx = 0.01
xx.xxx = 0.001
(unless otherwise specified)
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
Thermal Profile (Option #300)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
∆T
= 100°C, 1.5°C/SEC
Regulatory Information
The HSSR-8060 has been
approved by the following
organizations:
UL
Recognized under UL 508,
Component Recognition Program,
Industrial Control Switches, File
E142465.
CSA
Approved under CAN/CSA-C22.2
No. 14-95, Industrial Control
Equipment, File LR 87683.
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
TIME – MINUTES
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
