A4982
DMOS Microstepping Driver with Translator
and Overcurrent Protection
THERMAL CHARACTERISTICS may require derating at maximum conditions
Characteristic
Package Thermal Resistance
Symbol
R
θJA
Test Conditions*
ET package; estimated, on 4-layer PCB, based on JEDEC standard
LP package; on 4-layer PCB, based on JEDEC standard
Value Units
32
28
ºC/W
ºC/W
*In still air. Additional thermal information available on Allegro Web site.
Maximum Power Dissipation, P
D
(max)
5.5
5.0
4.5
4.0
Power Dissipation, P
D
(W)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
(R
θ
J
A
(R
=3
θ
J
A
=
28
)
1º
ºC
C/
/W
W
)
20
40
60
80
100
120
Temperature (°C)
140
160
180
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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