Altera Device Package Information Data Sheet
Table 3. PCB Dimensions
Notes (1), (2)
(Part 2 of 2)
Package
Dimensions
(mm)
19
19
17
14
Power/Ground
2.5 mm Thick Signal Layers
Layers
U484
F324
F256
U256
Notes to
Table 3:
(1)
(2)
Power layer Cu thickness 35 um, Cu 90%
Signal layer Cu thickness 17 um, Cu 15%
Board
Dimensions
(mm)
79
79
77
74
7
6
6
6
7
6
6
6
Table 4
provides
θ
JA
values and
θ
JB
(junction-to-board thermal resistance)
values for Cyclone III devices on a typical board.
Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 1 of 2)
Device
EP3C5
Package
F256
U256
θ
JA
(
°
C/W)
Still Air
32.2
32.7
32.2
32.7
28.4
29
26.3
22.5
27.5
28.1
26.4
23.1
22.3
19.4
17.6
21.2
18.6
16.8
θ
JA
(
°
C/W)
27.9
28.2
27.9
28.2
24.2
24.6
22.1
18.5
23.2
23.7
22.3
19
18.2
15.4
13.9
17.1
14.6
13.1
θ
JA
(
°
C/W)
200 ft./min.
25.5
25.7
25.5
25.7
21.8
22.2
19.9
16.4
20.9
21.3
20.1
16.9
16
13.5
12.1
15
12.6
11.3
θ
JA
(
°
C/W)
400 ft./min.
23.6
23.7
23.6
23.7
20
20.2
18.1
14.8
19.1
19.4
18.3
15.1
14.3
11.9
10.7
13.3
11.1
9.9
θ
JB
(
°
C/W)
17.3
16.3
17.3
16.3
13.5
12.7
12.4
9.8
12.6
11.8
12.4
9.2
8.5
6.8
6.7
7.5
6
5.9
EP3C10
F256
U256
EP3C16
F256
U256
U484
F484
EP3C25
F256
U256
F324
EP3C40
F324
F484
U484
F780
EP3C55
U484
F484
F780
4
DS-CYTHRML-3.0
Altera Corporation
ALTERA [ ALTERA CORPORATION ]
