Altera Device Package Information Data Sheet
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 2 of 2)
Device
EP3C16
Package
E144
Q240
F256
U256
U484
F484
M164
θ
JA
(
°
C/W)
Still Air
20
27.2
28.5
28.8
26.9
22.9
34.7
20
27
27.5
27.9
26.6
25.8
23.2
22.8
19.8
18.7
21.6
18.9
17.8
20.4
18
16.9
17.1
16
θ
JA
(
°
C/W)
100 ft./min.
17.5
24.7
25.1
25.4
23.5
19.4
28
17.5
24.5
24.1
24.5
23.1
23.2
19.7
19.3
16.3
15.2
18.2
15.4
14.4
16.9
14.5
13.5
13.7
12.6
θ
JA
(
°
C/W)
200 ft./min.
15.4
22.1
23.2
23.5
21.6
17.7
26.1
15.4
21.8
22.2
22.6
21.3
20.6
18
17.6
14.6
13.5
16.4
13.8
12.7
15.2
12.9
11.8
12
11
θ
JA
(
°
C/W)
400 ft./min.
14
17.8
21.7
22
20.1
16.2
24.4
14
17.6
20.7
21.1
19.8
17
16.5
16.1
13.2
12.2
15
12.2
11.4
13.8
11.5
10.5
10.7
9.7
θ
JC
(
°
C/W)
8
4.3
9.1
9.7
8.5
6.9
9.2
7.8
4.2
8.5
9.1
8
4
5.9
5.9
4.8
4.5
5.1
4.2
3.9
4.4
3.6
3.3
3.1
2.8
EP3C25
E144
Q240
F256
U256
F324
EP3C40
Q240
F324
U484
F484
F780
EP3C55
F484
U484
F780
EP3C80
U484
F484
F780
EP3C120
F484
F780
Table 3
provides board dimension information for each package.
Table 3. PCB Dimensions
Notes (1), (2)
(Part 1 of 2)
Package
Dimensions
(mm)
29
Power/Ground
2.5 mm Thick Signal Layers
Layers
F780
F484
Altera Corporation
9
7
DS-CYTHRML-3.0
9
7
Board
Dimensions
(mm)
89
83
3
ALTERA [ ALTERA CORPORATION ]
