Altera Device Package Information Data Sheet
Cyclone III
Devices
Thermal resistance values for Cyclone III devices are provided for a board
meeting JEDEC specifications and for a typical board. The JEDEC board
specifications require two signals and two power/ground planes and are
available at
www.jedec.org.
The values are described in
Tables 1
through
4.
Table 1. Thermal Resistance Values for Cyclone III Devices
Value
θ
JA
(C/W) Still Air
θ
JA
(C/W) 100 ft./minute
θ
JA
(C/W) 200 ft./minute
θ
JA
(C/W) 400 ft./minute
θ
JC
(C/W)
θ
JB
(C/W)
Description
Junction-to-ambient thermal resistance (θ
JA
) with no airflow when a heat sink
is not being used.
Junction-to-ambient thermal resistance with 100 ft./minute airflow when a
heat sink is not being used.
Junction-to-ambient thermal resistance with 200 ft./minute airflow when a
heat sink is not being used.
Junction-to-ambient thermal resistance with 400 ft./minute airflow when a
heat sink is not being used.
Junction-to-case thermal resistance (θ
JC
) for device.
Junction-to-board thermal resistance (θ
JB
) for specific board being used.
Table 2
provides
θ
JA
(junction-to-ambient thermal resistance) values and
θ
JC
(junction-to-case thermal resistance) values for Cyclone III devices on
a board meeting JEDEC specifications for thermal resistance calculation.
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2)
Device
EP3C5
Package
E144
F256
U256
M164
θ
JA
(
°
C/W)
Still Air
20
32.4
32.5
38.2
20
32.4
32.5
38.2
JA
(
°
C/W)
100 ft./min.
17.5
28.9
29.1
31.5
17.5
28.9
29.1
31.5
θ
JA
(
°
C/W)
200 ft./min.
15.4
27
27.2
29.6
15.4
27
27.2
29.6
θ
JA
(
°
C/W)
400 ft./min.
14
25.5
25.6
27.9
14
25.5
25.6
27.9
θ
JC
(
°
C/W)
8.4
11.7
12.2
11.6
8.4
11.7
12.2
11.6
EP3C10
E144
F256
U256
M164
2
DS-CYTHRML-3.0
Altera Corporation
ALTERA [ ALTERA CORPORATION ]
