DATA SHEET
CONNECTION DIAGRAMS
This device is also available in Known Good Die (KGD) form. Refer to publication number 21631 for
more information.
FBGA
Top View, Balls Facing Down
A6
A13
A5
A9
A4
WE#
A3
RY/BY#
A2
A7
A1
A3
B6
A12
B5
A8
B4
RESET#
B3
NC
B2
A17
B1
A4
C6
A14
C5
A10
C4
NC
C3
A18
C2
A6
C1
A2
D6
A15
D5
A11
D4
NC
D3
NC
D2
A5
D1
A1
E6
A16
E5
DQ7
E4
DQ5
E3
DQ2
E2
DQ0
E1
A0
F6
G6
H6
V
SS
H5
DQ6
H4
DQ4
H3
DQ3
H2
DQ1
H1
V
SS
BYTE# DQ15/A-1
F5
DQ14
F4
DQ12
F3
DQ10
F2
DQ8
F1
CE#
G5
DQ13
G4
V
CC
G3
DQ11
G2
DQ9
G1
OE#
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
T h e p a c k a g e a n d / o r d a t a i n t e g r i t y m ay b e
compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of
time.
6
Am29F800B
21504E5 November 2, 2006
AMD [ ADVANCED MICRO DEVICES ]
