D A T A
S H E E T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combi-
nation) is formed by a combination of the elements below.
Am29LV160D
T
-70
E
C
TEMPERATURE RANGE
C
D
I
F
E
F
S
WC
=
=
=
=
=
=
=
=
Commercial (0°C to +70°C)
Commercial (0°C to +70°C) with Pb-Free Package
Industrial (–40
°
C to +85
°
C)
Industrial (–40
°
C to +85
°
C) with Pb-Free Package
48-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 048)
48-Pin Thin Small Outline Package (TSOP) Reverse Pinout (TSR048)
44-Pin Small Outline Package (SO 044)
48-ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 9 mm package (FBC048)
PACKAGE TYPE
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
=
=
Top sector
Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29LV160D
16 Megabit (2M x 8-Bit/1M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations For TSOP and SO Packages
Am29LV160DT-70,
Am29LV160DB-70
Am29LV160DT-90,
Am29LV160DB-90
Am29LV160DT-120,
Am29LV160DB-120
EC, EI, ED, EF
FC, FI
SC, SI, SD, SF
Valid Combinations for FBGA Packages
Order Number
Am29LV160DT-70,
Am29LV160DB-70
Am29LV160DT-90,
Am29LV160DB-90
Am29LV160DT-120,
Am29LV160DB-120
Package Marking
L160DT70V,
L160DB70V
L160DT90V,
L160DB90V
L160DT12V,
L160DB12V
C, I,
D, F
WCC,
WCI,
WCD,
WCF
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
8
Am29LV160D
May 5, 2006 22358B7
AMD [ ADVANCED MICRO DEVICES ]
