LP62S16256E-I Series
Package Information
48LD CSP ( 6 x 8 mm ) Outline Dimensions
(48TFBGA)
unit: mm
TOP VIEW
BOTTOM VIEW
Ball#A1 CORNER
S
0.10
C
S
0.25 C A B
Ball*A1 CORNER
b (48X)
6
5 4 3 2 1
1
2 3 4 5 6
A
B
C
D
E
F
A
B
C
D
E
F
G
H
G
H
B
e
D
1
A
SIDE VIEW
D
0.20(4X)
C
SEATING PLANE
Dimensions in mm
Symbol
MIN. NOM. MAX.
A
A1
A2
D
1.04
0.20
0.48
5.90
7.90
---
1.14
0.25
0.53
6.00
8.00
3.75
5.25
0.75
0.35
1.24
0.30
0.58
6.10
8.10
---
E
D1
E1
e
---
---
---
---
b
0.30
0.40
Note:
1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).
2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM.
THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF
THE SOLDER BALL AND THE BODY EDGE.
4. BALL PAD OPENING OF SUBSTRATE IS F 0.3mm (SMD)
SUGGEST TO DESIGN THE PCB LAND SIZE AS F 0.3mm (NSMD)
(January, 2002, Version 2.0)
14
AMIC Technology, Inc.
AMICC [ AMIC TECHNOLOGY ]
