data sheet
LQFP
Features:
LEADFRAME
Amkor’s LQFP packaging portfolio provides:
• 7 x 7 mm to 28 x 28 mm body size
• 32 to 256 lead counts
• Copper leadframes
• Broad selection of die pad sizes
• Custom leadframe design available
• 1.4 mm body thickness
• Low stress die attach adhesive
• Rapid cure mold compound
• Power enhancement version - PowerQuad
Low Profile Quad Flat
Pack (LQFP) Packages:
Amkor offers a broad line of LQFP IC packages
designed to provide the same great benefits
as MQFP packaging with a 1.4 mm body
thickness. This allows IC packaging engineers,
component specifiers and systems designers
to solve issues such as increasing board
density, die shrink programs, thin end-product
profile and portability.
Applications:
Amkor’s LQFPs are an ideal IC package for
most IC semiconductor technologies such as
ASIC, DSP, controllers, processors, gate arrays
(FPGA/PLD), SRAMs and PC chip sets.
LQFPs are particularly suited for light weight,
portable electronics requiring broad perform-
ance characteristics. Such applications are lap-
top PCs, video/audio, telecom, cordless/RF,
data acquisition, office equipment, disc-drives
and communication boards.
Thermal Resistance:
Single-Layer PCB
Pkg
Body Size (mm)
Pad Size (mm)
Theta JA (°C/W) by Velocity (LFPM)
0
200
500
32 ld
100 ld
100 ld
144 ld
176 ld
7x7
14 x 14
14 x 20
20 x 20
24 x 24
5x5
8x8
9.5 x 9.5
8.5 x 8.5
8x8
67.8
41.5
39.7
38.0
38.3
55.9
33.4
31.8
31.2
31.9
50.1
29.5
28.3
28.1
29.0
JEDEC Standard Test Boards
Multi-Layer PCB
Pkg
Body Size (mm)
Pad Size (mm)
Theta JA (°C/W) by Velocity (LFPM)
0
200
500
32 ld
100 ld
100 ld
144 ld
176 ld
208 ld*
7x7
14 x 14
14 x 20
20 x 20
24 x 24
28 x 28
5x5
8x8
9.5 x 9.5
8.5 x 8.5
8x8
16 x 16
Tested @ 1 W
47.9
31.7
30.0
31.7
31.9
18.1
42.1
26.8
25.1
26.9
27.3
15.3
39.4
24.7
23.0
24.9
25.4
14.4
*Pre-JEDEC Standard Test Boards
All others - JEDEC Standard Test Boards
Electrical:
Pkg
Body Size PadSize
(mm)
(mm)
Lead
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
32 ld
48 ld
100 ld
144 ld
176 ld
208 ld
7x7
7x7
14 x 14
20 x 20
24 x 24
28 x 28
Simulated Results @ 100 MHz
Longest
Shortest
5x5
Longest
Shortest
8x8
Longest
Shortest
8.5 x 8.5 Longest
Shortest
8x8
Longest
Shortest
11 x 11 Longest
Shortest
5x5
0.904
0.799
1.110
0.962
2.300
1.520
6.430
4.230
9.510
5.200
9.670
6.190
0.211
0.202
0.225
0.200
0.419
0.322
1.100
1.070
1.270
1.340
1.380
1.210
9.2
7.8
13.8
12.0
26.3
17.8
62.9
52.6
89.0
64.0
86.2
64.8
Reliability:
IC chips are assembled in optimized package designs with proven reliable
semiconductor materials.
• Moisture sensitivity
characterization
• PCT
• Temp cycle
• Temp/humidity
• High temp storage
JEDEC Level 3
30 °C/60%RH, 192 hrs
121 °C, 100%RH, 2 atm, 504 hours
-55/+125 ° C, 1000 cycles
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS232B
Rev Date: 08’00
AMKOR [ AMKOR TECHNOLOGY ]
