LEADFRAME
data sheet
LQFP
Cross-section LQFP
Process Highlights
Die thickness
14.5 ± .5 mil
Strip solder plating
Marking
85/15 Sn/Pb
Laser
Laser/optical
Bar code, dry pack
Available
Mold
Compound
Die Attach
Lead inspection
Pack/ship options
Wafer backgrinding
Adhesive
Gold Wire
Leadframe
Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
• 256 Pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in
Die Attach Pad
Shipping
JEDEC outline CO-124 low profile tray
Configuration Options:
LQFP Nominal Package Dimensions (units in mm)
Body Body Lead
Foot
Tray
Units
Size
Tkns Form Standoff Length Tip To Tip
Lead Count
32/48/64
44/52/64/80
JEDEC
MS-026
MS-026
Matrix Per Tray
7 x 7
1.40 1.00
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.60
0.60
0.60
9.0
12.0
16.0
10 x 25
8 x 20
6 x 15
6 x 12
5 x 12
4 x 10
4 x 9
250
160
90
72
60
10 x 10 1.40 1.00
14 x 14 1.40 1.00
14 x 20 1.40 1.00
20 x 20 1.40 1.00
24 x 24 1.40 1.00
28 x 28 1.40 1.00
44/64/80/100/120/128 MS-026
0.60 16.0 x 22.0
100/128
MS-026
MS-026
MS-026
MS-026
0.60
0.60
0.60
22.0
26.0
30.0
128/144/176
160/176/216
160/208/256
40
36
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With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
AMKOR [ AMKOR TECHNOLOGY ]
