AS1324
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
VIN to GND
SW, EN, FB to GND
Thermal Resistance
Θ
JA
ESD
Latch-Up
Operating Temperature Range
Storage Temperature Range
-100
-40
-65
2
+100
+85
+125
Min
-0.3
-0.3
Max
7
V
IN
+ 0.3
207.4
Units
V
V
ºC/W
kV
mA
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
Junction temperature (T
J
) is calculated from
the ambient temperature (T
AMB
) and power
dissipation (PD) as:
T
J
= T
AMB
+ (PD)(207.4ºC/W)
(EQ 1)
on PCB
HBM MIL-Std. 883E 3015.7
methods
JEDEC 78
Comments
Package Body Temperature
+260
ºC
Junction Temperature
125
ºC
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