AS1334
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
VDD, PVIN to SGND
PGND to SGND
POK, EN, FB
SW
PVIN to VDD
Operating Temperature Range
Junction Temperature (T
J-MAX
)
Storage Temperature Range
Maximum Lead Temperature
(Soldering, 10 sec)
ESD Rating
Human Body Model
Operating Ratings
Input Voltage Range
Recommended Load Current
Junction Temperature (T
J
) Range
-40
2.7
5.5
650
+125
V
mA
ºC
In applications where high power
dissipation and/or poor package thermal
resistance is present, the maximum
ambient temperature may have to be
derated.
Maximum ambient temperature (T
A-MAX
)
is dependent on the maximum operating
junction temperature (T
J-MAX-OP
=
125ºC), the maximum power dissipation
of the device in the application (P
D-MAX
),
and the junction-to ambient thermal
resistance of the part/package in the
application (θ
JA
), as given by the
following
equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
×
P
D-MAX
).
2
kV
HBM MIL-Std. 883E 3015.7
methods
-65
Min
-0.3
-0.3
Max
+7.0
+0.3
Units
V
V
V
V
V
°C
ºC
ºC
ºC
7.0V max
Notes
SGND - 0.3 VDD + 0.3
PGND - 0.3 PVIN + 0.3
-0.3
-40
+0.3
+85
+150
+150
+260
Ambient Temperature (T
A
) Range
-40
+85
ºC
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