AS1337
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
VIN to GND
FB to GND
All other pins to GND
Operating Temperature Range
Storage Temperature Range
Min
-0.3
-0.3
-0.3
-40
-65
Max
5.5
5
6
+85
+125
Units
V
V
V
ºC
ºC
The reflow peak soldering temperature
(body temperature) specified is in
accordance with
IPC/JEDEC J-STD-
020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
@85°C, JEDEC 78
HBM MIL-Std. 883E 3015.7
methods
Notes
Package Body Temperature
+260
ºC
Latch-Up
Human Body Model
-100
2
100
mA
kV
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