AS1352
Data Sheet
- Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
V
DD
to GND
Any other Pin to GND
Continuous Power Dissipation
QFN12 4x4mm
Operating Ambient
Temperature
Storage Temperature
Electrostatic Discharge
Protection (ESD) Level
Package-Body Peak
Temperature
Min
-0.3
-0.3
1100
-40
-65
1
Max
7
V
DD
+ 0.3
2800
85
150
Units
V
V
mW
ºC
ºC
kV
HBM – Norm:
MIL 883 E method 3015
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
Min value measured at T
AMB
= 85ºC; max
value measured at T
AMB
= 25ºC
Comments
+260
ºC
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