AS1361/AS1362
Datasheet - D e t a i l e d D e s c r i p t i o n
The maximum power dissipation is calculated:
PDMAX = (T
J
- T
AMB
)/(
θ
JC
+
θ
CA
)
Where:
T
J
- T
AMB
is the temperature difference between the AS1361/AS1362 die junction and the surrounding air;
θ
JC
is the thermal resistance of the package;
θ
CA
is the thermal resistance through the PC board/copper traces/other materials to the surrounding air.
Note:
Pin GND of the AS1361/AS1362 provides the electrical connection to system ground and also serves as a heat
sink. Connect pin GND to the system ground using a large pad or ground plane.
(EQ 2)
Noise Reduction
The AS1361/AS1362 noise bypass circuitry dramatically reduces output noise, exhibiting 9µVRMS of output voltage
noise with C
BYPASS
= 0.01µF and C
OUT
= 1µF. Use an external 0.01µF bypass capacitor between pin BYPASS and pin
OUT
Note:
Startup time is minimized by internal power-on circuitry which pre-charges C
BYPASS
.
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Revision 1.03
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