AS13985
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Input Supply Voltage (Survival)
Input Supply Voltage (Operating)
Shutdown Input Voltage (Survival)
Output Voltage (Survival)
I
OUT
(Survival)
Input/Output Voltage (Survival)
Power Dissipation
2
1
Min
-0.3
+2.5
-0.3
-0.3
Max
+7
+5.5
+7
+7
Units
V
V
V
V
Comments
Short-circuit protected.
-0.3
+7
V
Internally limited.
-40
-65
+125
+150
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Operating Junction Temperature
Storage Temperature Range
Package Body Temperature
+260
ºC
1. The output PNP structure contains a diode between pins V
IN
and V
OUT
that is normally reverse-biased. revers-
ing the polarity of pins V
IN
and V
OUT
will activate this diode.
2. The maximum allowable power dissipation is a function of the maximum junction temperature (T
J(MAX
), the
junction-to-ambient thermal resistance (Θ
JA
), and the ambient temperature (T
AMB
). The maximum allowable
power dissipation at any ambient temperature is calculated as:
P
(MAX)
= (T
J(MAX)
- (T
AMB
))/
Θ
JA
Where:
The value of
Θ
JA
for the SOT23 package is 220ºC/W in a typical PC-board mounting.
The value of
Θ
JA
for the WLP package is 225ºC/W.
Note:
Exceeding the maximum allowable dissipation will cause excessive device temperature and the regula-
tor will go into thermal shutdown.
(EQ 1)
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