AS1507
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
V
DD
to GND
All Other Pins to GND
AS1507-10
Maximum Continuous Current into
Pins HIGH, WIPER, and LOW
Electrostatic Discharge
Latch-Up
1
Min
-0.3
-0.3
Max
+7.0
V
DD
+
0.3
+1
+1
+1
1
Units
V
V
Comments
AS1507-50
AS1507-100
mA
kV
100
mA
ºC/W
+85
+150
+150
ºC
ºC
ºC
The reflow peak soldering temperature
(body temperature) specified is in
accordance with
IPC/JEDEC J-STD-020C
“Moisture/Reflow Sensitivity Classification
for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
HBM MIL-Std. 883E 3015.7
methods
JEDEC 78
on PCB
-100
48
-40
-60
Thermal Resistance
Θ
JA
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Package Body Temperature
+260
ºC
1. The maximum rating voltage must not be exceeded during Latch-up test of the device.
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