AS1530, AS1531
Data Sheet
austriam
i c r o
systems
4 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 1. Absolute Maximum Ratings
Parameter
V
DD1
, V
DD2
, V
DD3
to GND
V
DD1
to V
DD2
to V
DD3
CH0:CH7, COM to GND
REF, REFADJ to GND
DIN, SCLK, CSN, to GND
DOUT, SSTRB to GND
DOUT, SSTRB Sink Current
Continuous Power Dissipation
(T
AMB
= +70ºC)
Operating Temperature Range
Storage Temperature Range
-40
-60
Min
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
Max
+7
+0.3
V
DD1
+
+0.3
V
DD1
+
+0.3
V
DD2
+
+0.3
V
DD2
+
+0.3
25
559
+85
+150
Units
V
V
V
V
V
V
mA
mW
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Derate 7.0mW/ºC above +70ºC
Comments
Package Body Temperature
+260
ºC
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