AS3930
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only. Functional operation of the
device at these or any other conditions beyond those indicated in
is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
DC supply voltage (V
DD
)
Input pin voltage (V
IN
)
Input current (latch up immunity) (I
SOURCE
)
Electrostatic discharge (ESD)
Total power dissipation
(all supplies and outputs)
(P
t
)
Storage temperature (T
strg
)
Package body temperature (T
body
)
Humidity non-condensing
5
-65
Min
-0.5
-0.5
-100
±2
0.07
150
260
85
Max
5
5
100
Units
V
V
mA
kV
mW
ºC
ºC
%
Norm: IPC/JEDEC J-STD-020C
1
Notes
Norm: Jedec 78
Norm: MIL 883 E method 3015 (HBM)
1. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020C “Moisture/Reflow Sensitivity
Classification for Nonhermetic Solid State Surface Mount Devices”.
AMSCO [ AUSTRIAMICROSYSTEMS AG ]
