APL1581
Block Diagram
VIN
VOUT
VCNTL
Current
Limit
VSENSE
Thermal
Protection
Voltage
Regulation
ADJ/GND
Absolute Maximum Ratings
Symbol
VIN
VCNTL
PD
TJ
TSTG
TSDR
Input Voltage
Control Voltage
Power Dissipation
Junction Temperature
Storage Temperature Range
Parameter
(Note 1, 2)
Rating
7
7
Internally Limited
150
-65 to +150
260
Unit
V
V
W
°C
°C
°C
Maximum Lead Soldering Temperature, 10 Seconds
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 2: The maximum allowable power dissipation at any T
A
(ambient temperature) is calculated using: P
D
(max) = (T
J
– T
A
) /
θ
JA
; T
J
= 125°C. Exceeding the maximum allowable power dissipation will result in
excessive die temperature.
Thermal Characteristics
Symbol
Parameter
Junction-to-Ambient Resistance in free air
TO-263-5 (Toplayer plane size : 15mm x 15 mm)
TO-252-5 (Toplayer plane size : 10mm x 10 mm)
SOP-8-P (Toplayer plane size : 10mm x 10 mm)
(Note 4)
Junction-to-Case Resistance
TO-220-5
TO-263-5
TO-252-5
(Note 3)
Typical Value
Unit
θ
JA
28
42
68
3
4
5
o
C/W
θ
JC
o
C/W
Note 3:
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. The sizes of the
rectangular plane, where the devices are mounted, are shown in the table.
Note 4: The case temperature is measured on the TAB of the device mounted on the test board described in Note 3 except the
package TO-220-5. The case temperature of the TO-220-5 is measured on the bottom of the case directly below the die.
Copyright
©
ANPEC Electronics Corp.
Rev. B.5 - Mar., 2008
3
www.anpec.com.tw
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
