APX9145
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
(IR/Convection or VPR Reflow)
Reflow Condition
T
P
tp
Critical Zone
T
L
to T
P
Ramp-up
T
L
Temperature
t
L
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25 C to Peak
°
Time
Classificatin Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate
3
°
C/second max.
3
°
C/second max.
(T
L
to T
P
)
Preheat
100
°
C
150
°
C
-
Temperature Min (Tsmin)
150
°
C
200
°
C
-
Temperature Max (Tsmax)
60-120 seconds
60-180 seconds
-
Time (min to max) (ts)
Time maintained above:
183
°
C
217
°
C
-
Temperature (T
L
)
60-150 seconds
60-150 seconds
-
Time (t
L
)
Peak/Classificatioon Temperature (Tp)
See table 1
See table 2
Time within 5
°
C of actual
10-30 seconds
20-40 seconds
Peak Temperature (tp)
Ramp-down Rate
6
°
C/second max.
6
°
C/second max.
6 minutes max.
8 minutes max.
Time 25
°
C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
C opyright
©
ANPEC Electronics C orp.
Rev. A.2 - Nov., 2005
8
www.anpec.com.tw
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
