APX9145
Classificatin Reflow Profiles (Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
3
3
Package Thickness
Volume mm
Volume mm
<350
≥
350
<2.5 mm
240 +0/-5
°
C
225 +0/- 5
°
C
≥
2.5 mm
225 +0/-5
°
C
225 +0/- 5
°
C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Package Thickness
Volume mm
Volume mm
Volume mm
<350
350 -2000
>2000
<1.6 mm
260 +0
°
C *
260 +0
°
C*
260 +0
°
C *
1.6 mm – 2.5 mm
260 +0
°
C *
250 +0
°
C*
245 +0
°
C *
≥
2.5 mm
250 +0
°
C *
245 +0
°
C*
245 +0
°
C *
*Tolerance: The device manufacturer/supplier
shall
assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0
°
C.
For example 260
°
C+0
°
C) at the rated MSL level.
Reliability test program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
245
°
C , 5 SEC
1000 Hrs Bias @ 125
°
C
168 Hrs, 100 % RH , 121
°
C
-65
°
C ~ 150
°
C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , I
tr
> 100mA
Description
Carrier Tape & Reel Dimensions
t
P
P1
D
Po
E
F
W
Bo
Ao
Ko
D1
C opyright
©
ANPEC Electronics C orp.
Rev. A.2 - Nov., 2005
9
www.anpec.com.tw
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
