AOZ1320
Package Dimensions, SOT23-6 LP
Gauge Plane
c
Seating Plane
L2
D
e1
6
L
E
E1
1
θ
b
e
A2
A
aaa
A1
Dimensions in millimeters
Dimensions in inches
Symbols Min. Nom. Max.
Symbols Min.
Nom. Max.
A
A1
A2
b
—
—
—
1.00
0.10
0.95
0.50
0.20
3.00
3.00
1.70
A
A1
A2
b
—
—
—
0.039
0.004
RECOMMENDED LAND PATTERN
0.00
0.70
0.35
0.10
2.80
2.60
1.50
0.00
0.88
0.028 0.035 0.037
0.014 0.016 0.020
0.004 0.005 0.008
0.110 0.114 0.118
0.102 0.110 0.118
0.059 0.063 0.067
0.037 BSC
0.40
c
0.13
c
2.40
D
2.90
D
E
2.80
E
0.80
E1
e
1.60
E1
e
0.95 BSC
1.90 BSC
0.40
0.95
0.63
e1
L
e1
L
0.075 BSC
0.30
0.60
0.012 0.016 0.024
0.010 BSC
UNIT: mm
L2
aaa
θ
0.25 BSC
0.10
L2
aaa
θ
0.004
0°
—
8°
0°
—
8°
Notes:
1. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils each.
2. Dimension “L” is measured in gauge plane.
3. Tolerance 0.100mm (4 mil) unless otherwise specified.
4. Refer to JEDEC MO-193C AB.
6. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact.
Rev. 1.6 August 2008
www.aosmd.com
Page 14 of 18
AOS [ ALPHA & OMEGA SEMICONDUCTORS ]
