APExx16
Series
6.1 Bonding Diagram of
APE3116
/APE4116 /APE6316
GND1
25
PRD0
24
PRD1
23
ROM
PRD2
22
PRD3
21
20
PRC0
PRC1
19
PRC2
18
Chip Size : 1408 um x 2556 um
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
Y
1
Vdd3
PRC3
17
PRB0
16
OSC1
15
2
PWM2/Cout
PRB1
14
GND2
3
Vdd2
PWM1
4
(0,0)
GND3
5
PRA3
6
PRA2
7
PRA1
8
PRA0
9
PRB3 PRB2
10
11
13
Vdd1
12
X
Pad #
1
2
3
4
5
6
7
8
9
10
11
12
13
Pad Name
Vdd3
PWM2/Cout
Vdd2
PWM1
GND3
PRA3
PRA2
PRA1
PRA0
PRB3/Reset
PRB2
Vdd1
GND2
X
56
58
58
145
293
430
563
696
829
962
1095
1228
1248
Y
647
466
182
58
58
87
87
87
87
87
87
87
272
6
Pad #
14
15
16
17
18
19
20
21
22
23
24
25
Pad Name
PRB1/IR
OSC1
PRB0/OSC2
PRC3
PRC2
PRC1
PRC0
PRD3
PRD2
PRD1
PRD0
GND1
X
1248
1248
1248
1248
1248
1248
1248
1248
1248
1248
1248
1248
Y
405
570
733
896
1056
1218
1379
1540
1700
1861
2022
2310
Rev 1.1
2003/9/2
APLUS [ APLUS INTERGRATED CIRCUITS ]
