APExx16
Series
6.2 Bonding Diagram of
APE8416
/APE10616 /APE12716
25
PRB3
23
PRC2
22
PRC1
21
PRC0
18
PRD1
17
PRD0
26
Vdd1
24
PRC3
20
PRD3
19
PRD2
16
GND1
ROM
Chip Size : 2288 um x 2364 um
Y
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
1
2
3
GND4
GND3
GND2 15
PWM1
Vdd3
4
Vdd2
PWM2/Cout
6
5
7
8
9
10
11
12
13
14
OSC1
PRB0
PRB1
PRB2
PRA0
PRA1
PRA2
PRA3
(0,0)
X
Pad #
1
2
3
4
5
6
7
8
9
10
11
12
13
Pad Name
GND4
GND3
PWM1
Vdd3
PWM2/Cout
Vdd2
OSC1
PRB0/OSC2
PRB1/IR
PRB2
PRA0
PRA1
PRA2
X
76
59
59
183
467
815
976
1140
1304
1465
1626
1787
1948
Y
404
294
146
59
59
76
76
76
76
76
76
76
76
Pad #
14
15
16
17
18
19
20
21
22
23
24
25
26
Pad Name
PRA3
GND2
GND1
PRD0
PRD1
PRD2
PRD3
PRC0
PRC1
PRC2
PRC3
PRB3/Reset
Vdd1
X
2109
2128
1927
1765
1603
1441
1279
1117
955
739
631
469
307
Y
76
212
2204
2204
2204
2204
2204
2204
2204
2204
2204
2204
2204
7
Rev 1.1
2003/9/2
APLUS [ APLUS INTERGRATED CIRCUITS ]
