Functional Diagram
Multi�½le Channel Device�½ �½vailable
V
CC
V
O
Truth Tables
(Po�½itive �½ogic)
Multichannel Devices
Input
On (H)
Off (L)
Output
H
L
V
E
GND
Package �½t�½�½le�½ �½or the�½e �½art�½ are �½ �½in D�½P through hole
(ca�½e outline P)�½�½ �½6 �½in D�½P flat �½ack (ca�½e outline �½)�½�½ and
leadle�½�½ ceramic chi�½ carrier (ca�½e outline �½). Device�½ ma�½�½
be �½urcha�½ed with a variet�½�½ o�½ lead bend and �½lating
o�½tion�½�½�½ �½ee Selection �½uide �½able �½or detail�½. Standard
Microcircuit Drawing (SMD) �½art�½ are available �½or each
�½ackage and lead �½t�½�½le.
Becau�½e the �½ame electrical die (emitter�½ and detector�½)
are u�½ed �½or each channel o�½ each device li�½ted in thi�½
data �½heet�½�½ ab�½olute ma�½imum rating�½�½�½ recommended
o�½erating condition�½�½�½ electrical �½�½ecification�½�½�½ and �½er�½or�½
mance characteri�½tic�½ �½hown in the figure�½ are identical
�½or all �½art�½. �½cca�½ional e�½ce�½tion�½ e�½i�½t due to �½ackage
variation�½ and limitation�½ and are a�½ noted. �½dditionall�½�½�½�½
the �½ame �½ackage a�½�½embl�½�½ �½roce�½�½e�½ and material�½ are
u�½ed in all device�½. �½he�½e �½imilaritie�½ give ju�½tification �½or
the u�½e o�½ data obtained �½rom one �½art to re�½re�½ent other
�½art’�½ �½er�½ormance �½or die related reliabilit�½�½ and certain
limited radiation te�½t re�½ult�½.
Single Channel Devices
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
Z
Z
H
L
Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
1
2
3
4
V
CC
V
O
8
7
6
5
8 Pin DIP
Through Hole
2 Channels
1
2
3
4
V
CC
V
O1
V
O2
8
7
6
5
1
2
3
4
5
6
7
8
16 Pin Flat Pack
Unformed Leads
4 Channels
16
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
13
12
11
10
9
20 Pad LCCC
Surface Mount
2 Channels
15
V
CC2
19
20
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
V
E
GND
2
3
10
GND
Note�½�½ Multichannel D�½P and flat �½ack device�½ have common �½
CC
and ground. Single channel D�½P ha�½ an enable �½in 6. �½CCC (leadle�½�½ ceramic chi�½
carrier) �½ackage ha�½ i�½olated channel�½ with �½e�½arate �½
CC
and ground connection�½.