CSPEMI307A
Mechanical Details
CSP Mechanical Specifications
CSPEMI307A devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1
B1
C
A2
C2
B
B2
B4
B3
SIDE
VIEW
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Millimeters
Min
2.915
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.561
0.355
Nom
2.960
1.330
0.500
0.250
0.435
0.435
0.230
0.230
0.605
0.380
Max
3.005
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.649
0.405
Min
Custom CSP
15
Inches
Nom
Max
0.1148 0.1165 0.1183
0.0506 0.0524 0.0541
0.0195 0.0197 0.0199
0.0096 0.0098 0.0100
0.0169 0.0171 0.0173
0.0169 0.0171 0.0173
0.0071 0.0091 0.0110
0.0071 0.0091 0.0110
0.0221 0.0238 0.0255
0.0140 0.0150 0.0159
3500 pieces
A
1
2
3
4
5
6
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI307A Chip Scale Package
# per tape and
reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CSPEMI307A
CHIP SIZE (mm)
2.96 X 1.33 X 0.6
POCKET SIZE (mm)
B
0
X A
0
X K
0
3.10 X 1.45 X 0.74
P
o
Top
Cover
Tape
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P
0
4mm
P
1
4mm
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
A
o
W
K
o
B
o
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 11. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
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CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
