CSPESD301/302/303
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
BOTTOM VIEW
(Bumps Up View)
A1
1
A
B
2
n*
A2
B2
A1
B1
Orientation
Marking
* See ordering information for
appropriate part marking.
CSPESD301/302/303
4-Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
3) All 4 bumps are always present. Unused bumps are electrically unconnected.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Ordering Part
Bumps
4
4
4
Package
CSP
CSP
CSP
Number
1
CSPESD301
CSPESD302
CSPESD303
Part Marking
F
G
H
Lead-free Finish
2
Ordering Part
Number
1
CSPESD301G
CSPESD302G
CSPESD303G
Part Marking
F
G
H
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
12/10/03
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
