CSPESD301/302/303
Mechanical Details
CSP Mechanical Specifications
CSPESD301/302/303 devices are packaged in a cus-
tom Chip Scale Package (CSP). Dimensions are
shown below. For complete information on CSP pack-
aging, see the California Micro Devices CSP Package
Information document.
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
B2
SIDE
VIEW
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
C1
C2
D1
D2
Millimeters
Min
0.881
1.015
0.495
0.495
0.163
0.230
0.561
0.355
Nom
0.925
1.060
0.500
0.500
0.213
0.280
0.605
0.380
Max
0.971
1.105
0.505
0.505
0.263
0.330
0.649
0.405
Min
Custom CSP
4
Inches
Nom
Max
0.0347 0.0365 0.0382
0.0400 0.0417 0.0435
0.0195 0.0197 0.0199
0.0195 0.0197 0.0199
0.0064 0.0084 0.0104
0.0091 0.0110 0.0130
0.0221 0.0238 0.0255
0.0140 0.0150 0.0159
3500 pieces
B
A2
A
1
2
C2
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPESD301/302/303 Chip Scale Package
# per tape and
reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CSPESD301
CSPESD302
CSPESD303
CHIP SIZE (mm)
1.06 X 0.93 X 0.6
POCKET SIZE (mm)
B
0
X A
0
X K
0
1.14 X 1.00 X 0.70
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P
0
4mm
P
1
4mm
P
o
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
A
o
W
K
o
B
o
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 9. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
12/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
7
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
