MECHANICAL
Package/Pinout "Y" and "Z"
1.285±0.010"
(32.64±0.25)
1514 13
1.285±0.010"
(32.64±0.25)
2423 22
2423 22
1514 13
TOP VIEWS
0.525±0.010"
(13.34±0.25)
0.525±0.010"
(13.34±0.25)
HL02UxxyzzY
HL02UxxyzzZ
0.695±0.015"
(17.65±0.38)
1 2 3
10 11 12
1 2 3
10 11 12
0.375±0.005"
(9.52±0.13)
0.015±0.005"
(0.38±0.13)
0.020±0.002"
(0.51±0.05)
SIDE VIEWS
0.375±0.005"
(9.52±0.13)
0.015±0.005"
(0.38±0.13)
0.100±0.010"
(2.54±0.25)
0.020±0.002"
(0.51±0.05)
0.100±0.010"
(2.54±0.25)
END VIEWS
0°-15°
0.600"
(15.24)
0.125+0.030"
-0.000"
(3.18+0.76)
(
-0.00)
0.014±0.002"
(0.36±0.05)
.015±.010"
(.38±.25)
DIP PACKAGE
NU = Do Not Use.
NC = No Internal Connection.
Duplicate pin functions are internally connected.
All dimensions are in inches (millimeters).
GRID: 0.100 inches (2.54 millimeters)
Typically Marked with: specific model ordered, date
code, job code and Logo.
SMD PACKAGE
PIN CONNECTIONS
PIN#
1
2
3
10
11
12
13
14
15
22
23
24
SINGLES
+VIN
NU
NU
-VOUT
+VOUT
-VIN
-VIN
+VOUT
-VOUT
NU
NU
+VIN
DUALS
+VIN
-VOUT
Common
Common
+VOUT
-VIN
-VIN
+VOUT
Common
Common
-VOUT
+VIN
RECOMMENDED LAND PATTERN
0.100"
(2.54)
2423 22
1514 13
RECOMMENDED REFLOW PROFILE
30 sec MAX
(>220°C)
250
235 °C MAX
220
200
190
TEMPERATURE (°C)
0.730"
(18.54)
0.040"
(1.02)
1 2 3
0.080"
(2.03)
150
10 11 12
100
1.150"
(29.21)
90 sec MAX
(>190°C)
50
TIME (seconds)
HL02UrevD,10/97
Page 3
CANDD [ C&D TECHNOLOGIES ]
