CS5101
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
14L PDIP
16L SO Wide
Metric
Max
Min
19.69
18.67
10.50
10.10
English
Max
Min
.775
.735
.413
.398
Thermal Data
R
QJC
typ
R
QJA
typ
16L SOIC
23
105
14L PDIP
48
85
ûC/W
ûC/W
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
8.26 (.325)
7.62 (.300)
3.68 (.145)
2.92 (.115)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
REF: JEDEC MS-001
D
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
1.27 (.050)
0.40 (.016)
REF: JEDEC MS-013
0.32 (.013)
0.23 (.009)
D
0.30 (.012)
0.10 (.004)
Ordering Information
Part Number
CS5101EN14
CS5101EDW16
CS5101EDWR16
Rev. 3/31/97
Description
14L PDIP
16L SO Wide
16L SO Wide
(tape & reel)
7
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
PATENTS PENDING
© 1999 Cherry Semiconductor Corporation
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
