CS8101
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
8L SOIC
20L SOIC
Metric
Max
Min
5.00
4.80
13.00 12.60
English
Max Min
.197
.189
.512
.496
Thermal Data
R
QJC
typ
R
QJA
typ
8 Lead
20 Lead
SOIC SOIC Wide
45
9
165
55
5 Lead
TO-220
3.3
50
ûC/W
ûC/W
Surface Mount Narrow Body (D); 150 mil wide
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.75 (.069) MAX
1.57 (.062)
1.37 (.054)
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
D
REF: JEDEC MS-012
0.25 (0.10)
0.10 (.004)
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
1.27 (.050)
0.40 (.016)
REF: JEDEC MS-013
0.32 (.013)
0.23 (.009)
D
0.30 (.012)
0.10 (.004)
7
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
