CS8126
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
16 Lead SO Wide
Metric
Max
Min
10.50
10.10
English
Max Min
.413 .398
Thermal Data
R
QJC
typ
R
QJA
typ
5 Lead
TO-220
2.1
50
7 Lead
D
2
PAK
2.1
10-50*
16 Lead
SOIC Wide
23
ûC/W
105
ûC/W
*Depending on thermal properties of substrate.
R
QJA
= R
QJC
+ R
QCA
.
Surface Mount Wide Body (DW); 300 mil wide
5 Lead TO-220 (THA) Horizontal
4.83 (.190)
10.54 (.415)
9.78 (.385)
1.40 (.055)
3.96 (.156)
3.71 (.146)
1.14 (.045)
4.06 (.160)
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
2.87 (.113)
2.62 (.103)
6.55 (.258)
5.94 (.234)
14.99 (.590)
14.22 (.560)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.77 (.109)
6.83 (.269)
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.81(.032)
1.68
(.066)
TYP
1.70 (.067)
6.81(.268)
0.56 (.022)
0.36 (.014)
6.60 (.260)
5.84 (.230)
2.92 (.115)
2.29 (.090)
1.27 (.050)
0.40 (.016)
REF: JEDEC MS-013
0.32 (.013)
0.23 (.009)
D
0.30 (.012)
0.10 (.004)
5 Lead TO-220 (T) Straight
5 Lead TO-220 (TVA) Vertical
4.83 (.190)
4.06 (.160)
3.96 (.156)
3.71 (.146)
6.55 (.258)
5.94 (.234)
2.87 (.113)
2.62 (.103)
14.99 (.590)
14.22 (.560)
1.40 (.055)
1.14 (.045)
10.54 (.415)
9.78 (.385)
3.96 (.156)
3.71 (.146)
4.83 (.190)
4.06 (.160)
10.54 (.415)
9.78 (.385)
2.87 (.113)
6.55 (.258) 2.62 (.103)
5.94 (.234)
1.40 (.055)
1.14 (.045)
14.99 (.590)
14.22 (.560)
1.78 (.070)
14.22 (.560)
13.72 (.540)
8.64 (.340)
7.87 (.310)
2.92 (.115)
2.29 (.090)
4.34 (.171)
1.68
(.066) typ
6.80 (.268)
0.56 (.022)
0.36 (.014)
7.51 (.296)
1.02 (.040)
0.76 (.030)
1.70 (.067)
1.02(.040)
0.63(.025)
6.93(.273)
6.68(.263)
1.83(.072)
1.57(.062)
0.56 (.022)
0.36 (.014)
.94 (.037)
.69 (.027)
2.92 (.115)
2.29 (.090)
8
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
