CS5343/4
7. PACKAGE DIMENSIONS
10LD TSSOP (3 mm BODY) PACKAGE DRAWING
N
D
c
E
A2
A1
L
E1
1
A
∝
e
b
END VIEW
SIDE VIEW
SEATING
PLANE
L1
1 2 3
TOP VIEW
INCHES
DIM
A
A1
A2
b
c
D
E
E1
e
L
L1
µ
MILLIMETERS
MAX
0.0433
0.0059
0.0374
0.0118
0.0091
--
--
--
--
0.0315
--
8°
NOTE
MAX
1.10
0.15
0.95
0.30
0.23
--
--
--
--
0.80
--
8°
MIN
--
0
0.0295
0.0059
0.0031
--
--
--
--
0.0157
--
0°
NOM
--
--
--
--
--
0.1181 BSC
0.1929 BSC
0.1181 BSC
0.0197 BSC
0.0236
0.0374 REF
--
MIN
--
0
0.75
0.15
0.08
--
--
--
--
0.40
--
0°
NOM
--
--
--
--
--
3.00 BSC
4.90 BSC
3.00 BSC
0.50 BSC
0.60
0.95 REF
--
Controlling Dimension is Millimeters
Notes:
1. Reference document: JEDEC MO-187
2. D does not include mold flash or protrusions, which is 0.15 mm max. per side.
3. E1 does not include inter-lead flash or protrusions, which is 0.15 mm max per side.
4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max.
5. Exceptions to JEDEC dimension.
THERMAL CHARACTERISTICS
Parameter
Allowable Junction Temperature
Junction to Ambient Thermal Impedance
(4-layer PCB)
(2-layer PCB)
Symbol
T
J
Min
-
-
-
Typ
-
100
170
Max
135
-
-
Unit
°C
°C/W
°C/W
θ
JA-4
θ
JA-2
20
DS687F1
CIRRUS [ CIRRUS LOGIC ]
