EP9307
ARM9 SOC with Ethernet, USB, Display and Touchscreen
Table R. 272 Pin Diagram Dimensions
dimension in mm
Symbol
MIN
A
A1
A2
b
c
D
D3
E
E3
e
ddd
1.35
0.23
0.65
0.35
0.21
13.95
12.75
13.95
12.75
0.75
dimension in inches
MAX
1.45
0.33
0.75
0.45
0.31
14.05
12.85
14.05
12.85
0.85
0.10
NOM
1.40
0.28
0.70
0.40
0.26
14.00
12.80
14.00
12.80
0.80
MIN
0.053
0.009
0.026
0.014
0.0083
0.549
0.502
0.549
0.502
0.030
NOM
0.055
0.011
0.028
0.016
0.0102
0.551
0.504
0.551
0.504
0.031
MAX
0.057
0.013
0.030
0.018
0.0122
0.553
0.506
0.553
0.506
0.033
0.004
Note:
1. Controlling Dimension: Millimeter.
2. Primary Datum C and seating plane are defined by the spherical crowns of the solder balls.
3. Dimension b is measured at the maximum solder ball diameter, parallel to Primary Datum C.
4. There shall be a minimum clearance of 0.25 mm between the edge of the solder ball and the body edge.
5. Reference Document: JEDEC MO-151, BAL-2
272 Pin TFBGA Pinout (Bottom View)
The following table shows the 272 pin TFBGA pinout. (For better understanding, compare the coordinates on the x and
y axis on
with
• VDD_core is vddc.
• VDD_ring is vddr.
• GND_core is gndc.
• GND_ring is gndr.
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DS667PP3
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