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CY7C1380C-133AC 参数 Datasheet PDF下载

CY7C1380C-133AC图片预览
型号: CY7C1380C-133AC
PDF下载: 下载PDF文件 查看货源
内容描述: 18 -MB ( 512K ×36 / 1M ×18 )流水线SRAM [18-Mb (512K x 36/1M x 18) Pipelined SRAM]
分类和应用: 静态存储器
文件页数/大小: 36 页 / 793 K
品牌: CYPRESS [ CYPRESS SEMICONDUCTOR ]
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CY7C1380C
CY7C1382C
CY7C1380C–Pin Definitions
(continued)
Name
ADSP
TQFP
84
BGA
A4
fBGA
B9
I/O
Description
Input-
Address Strobe from Processor, sampled
Synchronous
on the rising edge of CLK, active LOW.
When
asserted LOW, addresses presented to the
device are captured in the address registers.
A1: A0 are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only
ADSP is recognized. ASDP is ignored when
CE
1
is deasserted HIGH.
Input-
Address Strobe from Controller, sampled on
Synchronous
the rising edge of CLK, active LOW.
When
asserted LOW, addresses presented to the
device are captured in the address registers.
A1: A0 are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only
ADSP is recognized.
Input-
ZZ “sleep” Input, active HIGH.
When
Asynchronous asserted HIGH places the device in a
non-time-critical “sleep” condition with data
integrity preserved. For normal operation, this
pin has to be LOW or left floating. ZZ pin has an
internal pull-down.
I/O-
Bidirectional Data I/O lines.
As inputs, they
Synchronous feed into an on-chip data register that is
triggered by the rising edge of CLK. As outputs,
they deliver the data contained in the memory
location specified by the addresses presented
during the previous clock rise of the read cycle.
The direction of the pins is controlled by OE.
When OE is asserted LOW, the pins behave as
outputs. When HIGH, DQs and DQP
X
are
placed in a tri-state condition.
ADSC
85
B4
A8
ZZ
64
T7
H11
DQs, DQPs
52,53,56,
57,58,59,
62,63,68,
69,72,73,
74,75,78,
79,2,3,6,7,8,9,
12,13,18,19,22
,
23,24,25,
28,29,51,
80,1,30
K6,L6,
M6,N6,
K7,L7,
N7,P7,
E6,F6,
G6,H6,
D7,E7,
G7,H7,
D1,E1,
G1,H1,
E2,F2,
G2,H2,
K1,L1,
N1,P1,
K2,L2,
M2,N2,
P6,D6,
D2,P2
J2,C4,J4,R4,
J6
M11,L11,
K11,J11,
J10,K10,
L10,M10,
D10,E10,
F10,G10,
D11,E11,
F11,G11,
D1,E1,F1,
G1,D2,E2,F2,
G2,J1,
K1,L1,M1,
J2,K2,L2,
M2,N11,
C11,C1,N1
V
DD
15,41,65,
91
D4,D8,E4,E8, Power Supply
Power supply inputs to the core of the de-
F4,F8,
vice.
G4,G8,H4,H8,
J4,J8,
K4,K8,L4,
L8,M4,M8
C4,C5,C6,C7,
C8,D5,D6,D7,
E5,E6,E7,F5,
F6,F7,G5,G6,
G7,H2,H5,H6,
H7,J5,J6,J7,
K5,K6,K7,
L5,L6,L7,
M5,M6,M7,N4,
N8
Ground
Ground for the core of the device.
V
SS
17,40,67,
90
D3,E3,
F3,H3,
K3,M3,
N3,P3,
D5,E5,
F5,H5,
K5,M5,
N5,P5
Document #: 38-05237 Rev. *D
Page 7 of 36