CYStech Electronics Corp.
DO-201 Dimension
Spec. No. : C330LA
Issued Date : 2003.04.16
Revised Date :
Page No. : 3/3
Marking : On the cylindrical surface
1N582X
E
A
B
C
D
DO-201 Molded Plastic Package
CYStek Package Code: LA
*:Typical
DIM
A
B
C
Inches
Min.
Max.
0.0472 0.0512
1.0000
-
0.2835 0.3740
Millimeters
Min.
Max.
1.20
1.30
25.40
-
7.20
9.50
DIM
D
E
Inches
Min.
Max.
1.0000
-
0.1890 0.2087
Millimeters
Min.
Max.
25.40
-
4.80
5.30
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
•
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
1N582XLA
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
