MP03 XXX 330 Series
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
Parameter
Conditions
Typ.
Max.
Units
V
GT
I
GT
V
GD
V
FGM
V
FGN
V
RGM
I
FGM
P
GM
P
G(AV)
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
V
DRM
= 5V, T
case
= 25
o
C
V
DRM
= 5V, T
case
= 25
o
C
At V
DRM
T
case
= 25
o
C
Anode positive with respect to cathode
Anode negative with respect to cathode
-
-
-
-
-
-
3.0
150
0.25
30
0.25
5.0
10
100
5
V
mA
V
V
V
V
A
W
W
Anode positive with respect to cathode
t
p
= 25µs
-
-
-
ORDERING INSTRUCTIONS
Part number is made up of as follows:
MP03 HBT 330 -10
MP
03
HBT
330
10
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at T
case
= 75
o
C
= V
RRM
/100
Examples:
MP03 HBP330 - 08
MP03 HBN330 - 12
MP03 HBT330 - 08
NOTE: Diode ratings and characteristics are comparable with the SCR in types HBP or HBN
Types HBP or HBN can also be supplied with diode polarity reversed, to special order.
MOUNTING RECOMMENDATIONS
s
Adequate heatsinking is required to maintain the base
temperature at 75
o
C if full rated current is to be achieved. Power
dissipation may be calculated by use of V
T(TO)
and r
T
information in
accordance with standard formulae. We can provide assistance
with calculations or choice of heatsink if required.
s
The heatsink surface must be smooth and flat; a surface finish
of N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
s
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build up
and foreign material. Care should be taken to ensure no foreign
particles remain.
s
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces. This
should ideally be 0.05mm (0.002") per surface to ensure optimum
thermal performance.
s
After application of thermal compound, place the module squarely
over the mounting holes, (or 'T' slots) in the heatsink. Using a
torque wrench, slowly tighten the recommended fixing bolts at
each end, rotating each in turn no more than 1/4 of a revolution at
a time. Continue until the required torque of 5Nm (44lb.ins) is
reached at both ends.
s
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
3/10
DYNEX [ Dynex Semiconductor ]
