EDJ1104BFBG ， EDJ1108BFBG
DDR3 SDRAM模式寄存器2 [ MR2 ] ...................................................................................................... 77
DDR3 SDRAM模式寄存器3 [ MR3 ] ...................................................................................................... 78
突发长度（ MR0 ） .................................................................................................................................... 79
突发类型（ MR0 ） ....................................................................................................................................... 79
DLL使能（ MR1 ） ...................................................................................................................................... 80
DLL断模式.............................................................................................................................................. 80
DLL的通/断切换过程.................................................................................................................. 81
附加延迟(MR1)............................................................................................................................... 83
写调整（ MR1 ） .................................................................................................................................. 84
TDQS ， / TDQS功能（ MR1 ） .................................................................................................................... 87
扩展温度用法（ MR2 ） ......................................................................................................... 88
多用途注册(MR3)..................................................................................................................... 90
在DDR3 SDRAM的操作..................................................................................................................97
读时序Definition................................................................................................................................ 97
读操作........................................................................................................................................ 101
写时序Definition.............................................................................................................................. 108
写Operation......................................................................................................................................... 109
写时序违规............................................................................................................................. 115
写数据面膜....................................................................................................................................... 116
预充电................................................................................................................................................. 117
自动预充电操作........................................................................................................................ 118
Auto-Refresh............................................................................................................................................. 119
Self-Refresh.............................................................................................................................................. 120
掉电模式................................................................................................................................... 122
在预充电掉电输入时钟频率变化......................................... ...................... 129
片上终端(ODT)........................................................................................................................ 130
ZQ Calibration........................................................................................................................................... 142
包装图......................................................................................................................................144
78球FBGA ............................................................................................................................................ 144
推荐焊接Conditions........................................................................................................145
初步数据表E1629E20 （版本2.0 ）
5
ELPIDA [ ELPIDA MEMORY ]
