EM65101
128COM/160SEG 16 Gray Scale Level LCD Driver
4.2 Pin Dimensions
Item
Chip size
Pad No.
-
1 ~ 3 ; 144 ~ 146
4 ~ 51 ; 99 ~ 143
52 ~ 98
147 ~ 169 ; 418 ~ 440
170 ~ 417
1 ~ 3 ; 144 ~ 146
4 ~ 51 ; 99 ~ 143
52 ~ 98
147 ~ 169 ; 418 ~ 440
170 ~ 417
Min pitch
Bump Size
X
10850
88
35
50
96
28
103
50
65
43
43
43
Y
1380
38
78
61
28
96
Unit
Bump Size
Pad Pitch
µm
Die thickness
(excluding bumps)
Bump Height
Minimum Bump Gap
Coordinate Origin
20 ± 1 mil (500 ± 25 um)
17 ± 3 um
15 um
Chip center
4.3 Recommended COG ITO Traces Resistor
Interface
V0~V4
CAP1+, CAP1-, CAP2+, CAP2-,CAP3+,CAP3-
CAP4+, CAP5+, VOUT, V2X
VDD, VEE, VSS
WRB,RDB,CSB,…, D0~D7
RESB
ITO Traces Resistances
Max=50Ω
Max=3KΩ
Max=5~10KΩ
Product Specification (V0.4) 08.15.2005
(This specification is subject to change without further notice)
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EMC [ ELAN MICROELECTRONICS CORP ]
